KR-20260063192-A - POWER MODULE

KR20260063192AKR 20260063192 AKR20260063192 AKR 20260063192AKR-20260063192-A

Abstract

A power module according to one embodiment of the present invention comprises: a substrate; a chip mounted on the substrate and having a signal pad; and a lead portion electrically connected to the chip; wherein the lead portion may include a signal lead provided spaced apart from the substrate; and a connecting lead connecting the signal lead and the signal pad.

Inventors

도한진
양진명
박성원

Assignees

현대자동차주식회사
기아 주식회사

Dates

Publication Date: 20260507
Application Date: 20241030

Claims (15)

Substrate; A chip mounted on the above substrate and equipped with a signal pad; and Includes a lead portion electrically connected to the above chip; and The above lead part A signal lead provided spaced apart from the above substrate; and A connecting lead connecting the signal lead and the signal pad; comprising Power module.
In Article 1, One end of the connecting lead is connected to the signal pad and the other end is connected to the signal lead, and at least a portion between the one end and the other end is provided with an upper surface and a lower surface as a flat plate. Power module.
In Article 2, A portion of the connecting lead that overlaps vertically with the substrate is provided as a flat plate. Power module.
In Article 1, The above connecting lead is, A first connection part having one end connected to the above signal lead; A second connection part having one end connected to the above signal pad; and A third connecting part connecting the other end of the first connecting part and the other end of the second connecting part; including The above third connecting part is provided with at least a portion of its upper and lower surfaces as a flat plate. Power module.
In Paragraph 4, The above substrate is, Lower substrate and It includes an upper substrate disposed on the upper part of the lower substrate; and At least a portion of the third connecting part is provided between the lower substrate and the upper substrate, Power module.
In Article 5, The upper and lower surfaces of the portion provided between the lower substrate and the upper substrate of the third connecting part are provided as flat plates. Power module.
In Article 5, The third connecting part is provided parallel to at least one of the lower substrate or the upper substrate. Power module.
In Article 5, The third connecting part is bent at least once in a direction parallel to at least one of the lower substrate or the upper substrate, Power module.
In Paragraph 4, The first connecting part and the second connecting part are obliquely connected at both ends of the third connecting part. Power module.
In Article 1, The above connecting lead is, A first connecting part having one end connected to the above signal lead and having upper and lower surfaces provided in a flat plate shape; and A second connecting part that is bent downward at the other end of the first connecting part and has the bent end connected to the signal pad; comprising Power module.
In Article 1, It further includes a mold portion provided to surround the substrate and the chip; One end of the signal lead is provided so as to be spaced apart from the substrate inside the mold portion, and the other end is exposed to the outside of the mold portion. The above connecting lead connects one end of the signal lead and the signal pad, Power module.
In Article 11, The above substrate is, A lower substrate having at least a portion exposed to the bottom surface of the above-mentioned mold portion; and An upper substrate disposed on the upper portion of the lower substrate and having at least a portion exposed to the upper surface of the mold portion; comprising Power module.
A substrate comprising a lower substrate and an upper substrate disposed on top of the lower substrate; A chip mounted on the above substrate and equipped with a signal pad; A mold portion provided to surround the substrate and the chip; and It includes a lead portion, one end of which is electrically connected to the signal pad inside the mold portion and the other end of which is exposed outside the mold portion. The portion disposed between the lower substrate and the upper substrate of the above lead portion is provided with an upper surface and a lower surface in a flat plate shape. Power module.
In Article 13, The above lead portion includes a signal lead for transmitting a control signal, and The above signal lead is A first part having one end connected to the signal pad inside the mold part; and One end is connected to the other end of the first part, and the other end is a second part exposed to the outside of the mold part; The widthwise length of the first part is shorter than the widthwise length of the second part. Power module.
In Article 14, The first part is provided by being folded at least once in a direction parallel to the substrate. Power module.

Description

Power Module The present invention relates to a power module. With the recent rise in environmental awareness, there is a growing trend of eco-friendly vehicles equipped with electric motors as a power source. These eco-friendly vehicles are also known as electrified vehicles, and representative examples include electric vehicles (EVs) and hybrid electric vehicles (HEVs). Inverters are used for power control as a key component that significantly impacts the performance and efficiency of these vehicles. An inverter is a device that converts direct current (DC) power into alternating current (AC) power and can drive an electric motor by receiving power from a high-voltage battery. The inverter includes a power module as a core component. The power module performs power conversion by processing high voltage and current. In conventional power modules, wire bonding was used to connect signal leads to semiconductor chips. However, this method posed difficulties in miniaturizing power modules because it required sufficient height for the bonding process. Furthermore, when connecting signal leads to semiconductor chips via wire bonding, if the semiconductor chip is positioned inside a substrate, an electrode pattern is required to form signal loops; this electrode pattern complicates current loops, which degrades the electrical characteristics of the power module. Therefore, there is a recent demand for research on power module structures that are advantageous for miniaturization and have improved electrical characteristics. FIG. 1 is a perspective view of a power module according to one embodiment of the present invention. Figure 2 is a perspective view showing the power module illustrated in Figure 1 with the molded portion removed. Figure 3 is a cross-sectional view along I-I' of Figure 1. FIG. 4a is a cross-sectional view showing the molded portion removed from a power module according to another embodiment of the present invention, and FIG. 4b is a cross-sectional view of a power module according to another embodiment of the present invention. FIG. 5a is a cross-sectional view showing the molded portion removed from a power module according to another embodiment of the present invention, and FIG. 5b is a cross-sectional view of a power module according to another embodiment of the present invention. FIG. 6a is a cross-sectional view showing the molded portion removed from a power module according to another embodiment of the present invention, and FIG. 6b is a cross-sectional view of a power module according to another embodiment of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and/or" includes a combination of a plurality of related described items or any of a plurality of related described items. Terms such as "~part," "~section," "~part," etc. may be used to describe various components, but said components should not be limited by said terms. These terms may refer not only to physically or visibly distinguishable components but also to descriptions of the function or configuration of a relevant part, even if the distinction or division is not clearly defined. The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sens