KR-20260063250-A - SENSOR DEVICE

KR20260063250AKR 20260063250 AKR20260063250 AKR 20260063250AKR-20260063250-A

Abstract

The sensor device of the present disclosure comprises a sensor array including a first calorimeter and a second calorimeter, disposed on a flow path of a gas supplied to a semiconductor manufacturing device, and a control unit that checks the pressure of the gas based on the temperature of the first calorimeter, the ambient temperature, and the first heat transfer amount of the first calorimeter, and checks the flow rate of the gas based on the temperature of the second calorimeter, the ambient temperature, the second heat transfer amount of the second calorimeter, and the pressure.

Inventors

송종민
최연석
김주현
윤병민
이호현

Assignees

삼성전자주식회사

Dates

Publication Date: 20260507
Application Date: 20241030

Claims (10)

In a sensor device placed in a semiconductor manufacturing apparatus, A sensor array disposed on a gas flow path supplied to the semiconductor manufacturing apparatus and comprising a first calorimeter and a second calorimeter; and Based on the temperature of the first calorimeter, the ambient temperature, and the first heat transfer amount of the first calorimeter, the pressure of the gas is determined, and A sensor device comprising a control unit that checks the flow rate of the gas based on the temperature of the second calorimeter, the ambient temperature, the second heat transfer amount of the second calorimeter, and the pressure.
In paragraph 1, The above sensor array is, It further includes a cover that encloses at least a portion of the first calorimeter, and The above cover is, A sensor device comprising a first partition disposed in the direction of inflow of the gas, and a second partition disposed in the direction of outflow of the gas and having an opening formed therein.
In paragraph 2, The above second calorimeter is, A sensor device disposed in an open space where the gas flows according to the above flow rate.
In paragraph 1, The above control unit is, A first heat transfer coefficient is determined according to the first heat transfer amount, the area of the first calorimeter, the temperature of the first calorimeter, and the ambient temperature, and A sensor device that checks the pressure according to the first heat transfer coefficient and the ambient temperature.
In paragraph 4, The above control unit is, A second heat transfer coefficient is determined according to the second heat transfer amount, the area of the second calorimeter, the temperature of the second calorimeter, and the ambient temperature. A sensor device that checks the flow rate according to the second heat transfer coefficient, the ambient temperature, and the pressure.
In paragraph 1, The above first calorimeter includes a first resistor, and The above second calorimeter includes a second resistor, and The above control unit is, A sensor device that supplies current to the first resistor and the second resistor so that the first calorimeter and the second calorimeter are heated, checks the first heat transfer amount according to the resistance of the first resistor and the current, checks the second heat transfer amount according to the resistance of the second resistor and the current, determines the temperature checked by the first calorimeter after the first calorimeter is heated as the temperature of the first calorimeter, and determines the temperature checked by the second calorimeter after the second calorimeter is heated as the temperature of the second calorimeter.
In paragraph 6, The above sensor array is, A sensor device further comprising a temperature sensor or a third calorimeter for checking the above ambient temperature.
In a sensor device disposed inside a semiconductor manufacturing apparatus supplied with gas, A sensor array comprising a first calorimeter, an insulating material covering the first calorimeter, and a second calorimeter; and It includes a control unit that checks the first heat transfer amount of the first calorimeter and the second heat transfer amount of the second calorimeter, corrects the second heat transfer amount according to the difference value between the first heat transfer amount and the second heat transfer amount, and checks the flow rate of the gas based on the corrected second heat transfer amount, the temperature of the second calorimeter, the ambient temperature, and the pressure of the gas. The above sensor array is, It further includes a third calorimeter and a cover covering at least a portion of the third calorimeter, and The above control unit is, A sensor device that corrects the third heat transfer amount according to the difference between the first heat transfer amount and the third heat transfer amount of the third calorimeter, and checks the pressure based on the corrected third heat transfer amount, the temperature of the third calorimeter, and the ambient temperature.
In paragraph 8, A substrate further comprising a base portion and a support portion formed on the upper part of the base portion, and having a cavity formed between the base portion and the support portion. The first calorimeter and the second calorimeter are sensor devices disposed on the support member.
In a sensor device disposed inside a semiconductor manufacturing apparatus supplied with gas, A substrate including a plurality of support members; A plurality of sensor arrays each comprising a first calorimeter disposed in a first conduit forming a flow path in a first direction and a second calorimeter disposed in a second conduit forming a flow path in a second direction different from the first direction, disposed on the plurality of support members; and Based on the temperature of the first calorimeter, the ambient temperature, the first heat transfer amount, and the pressure of the gas, the flow rate in the first direction is determined, and Based on the temperature of the second calorimeter, the ambient temperature, the second heat transfer amount, and the pressure of the gas, the flow rate in the second direction is determined, and A sensor device comprising a control unit for verifying a flow rate map including a flow rate for the first direction and a flow rate for the second direction for each of the positions of the plurality of sensor arrays.

Description

Sensor Device {SENSOR DEVICE} The present disclosure relates to electronic devices, specifically to sensor devices. A semiconductor manufacturing device (or semiconductor manufacturing facility) can perform at least one of various semiconductor processes, such as a chemical vapor deposition (CVD) process and an etching process, to manufacture a semiconductor device. Semiconductor manufacturing processes require precise environmental control. Sensor devices can monitor the internal environment of semiconductor manufacturing equipment in real time. In processes such as CVD and etching, the flow of reactive gases can directly affect the quality and productivity of the process. Gas flow is difficult to measure compared to other physical quantities. Estimating and verifying gas flow through simulation or trial and error is inefficient in terms of time and cost. Furthermore, there is the problem that gas flow must be re-estimated and verified whenever the conditions of the semiconductor process or manufacturing equipment change. Accordingly, there is a need for a method to accurately and efficiently measure gas flow within semiconductor manufacturing equipment. FIG. 1 is a block diagram for explaining a sensor device according to an embodiment. FIG. 2 is a drawing for explaining a sensor device and a semiconductor manufacturing device according to an embodiment. FIG. 3 is a plan view for explaining a sensor device according to an embodiment. FIG. 4 is a drawing for explaining a sensor array including a cover according to an embodiment. FIG. 5 is a drawing for explaining a sensor array including an insulating material according to an embodiment. FIG. 6 is a drawing for explaining a sensor array including a conduit according to an embodiment. FIG. 6 is a drawing for explaining a sensor array including a conduit according to an embodiment. FIG. 7 is a drawing for explaining a substrate according to an embodiment. FIG. 8 is a drawing for explaining a flow velocity map according to an embodiment. The terms used in the embodiments have been selected to be as widely used as possible, taking into account their functions in the present disclosure; however, these may vary depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Additionally, in specific cases, terms have been arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the relevant explanatory section. Therefore, terms used in the present disclosure should be defined not merely by their names, but based on their meanings and the overall content of the present disclosure. When a part of a specification is described as “comprising” a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Furthermore, terms such as “...part” or “...module” as used in the specification refer to a unit that processes at least one function or operation, and this may be implemented in hardware or software, or as a combination of hardware and software. Embodiments of the present disclosure are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. FIG. 1 is a block diagram for explaining a sensor device according to an embodiment. Referring to FIG. 1, a sensor device (100) according to an embodiment may be placed inside a semiconductor manufacturing device. The sensor device (100) may monitor the flow state of a gas inside the semiconductor manufacturing device. For example, the flow state of the gas may include at least one of the flow velocity and direction of movement of the gas. The sensor device (100) may include a sensor array (110) and a control unit (120). The sensor array (110) and the control unit (120) may communicate to transmit and receive information. The control unit (120) may check sensing information through the sensor array (110). For example, the control unit (120) may control the sensing operation of the sensor array (110) by transmitting a control signal to the sensor array (110). The sensor array (110) may acquire sensing information by performing a sensing operation. The control unit (120) may receive sensing information from the sensor array (110). In the embodiment, the number of sensor arrays (110) may be one or multiple. In an embodiment, the sensor array (110) may include a plurality of calorimeters. The calorimeter can verify its thermal state. In an embodiment, the thermal state may include at least one of the calorimeter's heat transfer amount, temperature, and ambient temperature. For example, the calorimeter's heat transfer amount may include at least one of the heat transfer amount flowing into the calorimeter and the heat transfer amount emitting from the calorimeter. The heat