KR-20260063271-A - HOPPER APPARATUS WITH COOLING FUNCTION

KR20260063271AKR 20260063271 AKR20260063271 AKR 20260063271AKR-20260063271-A

Abstract

A hopper device equipped with a cooling function capable of cooling high-temperature powder inside a hopper is provided. The hopper device may include i) a hopper into which powder is introduced from the outside upward, a space for accommodating powder is formed inside, and powder is discharged downward, and ii) a cooling unit in which at least a portion is disposed inside the hopper to cool the powder. The cooling unit may include a plurality of cooling coils through which cooling water flows. The cooling coils may be disposed on a path through which powder is introduced into the hopper so as to come into contact with the powder.

Inventors

임동현
양건모
김종엽
유연지
전영환

Assignees

(주)포스코퓨처엠

Dates

Publication Date: 20260507
Application Date: 20241030

Claims (15)

A hopper in which powder is introduced upward from the outside, a space is formed inside for accommodating the powder, and the powder is discharged downward; and A cooling unit, at least a portion of which is disposed within the hopper to cool the powder. Includes, The above cooling unit includes a plurality of cooling coils through which cooling water flows, and The above cooling coil is a hopper device equipped with a cooling function, which is positioned on the path through which the powder flows into the hopper so as to come into contact with the powder.
In paragraph 1, The above cooling coil is, A hopper device equipped with a cooling function that extends in a curved manner along the inner surface of the upper part of the hopper from a first point on the inner side of the upper part of the hopper to a second point on the inner side of the upper part of the hopper.
In paragraph 2, The above cooling coil is, A hopper device equipped with a cooling function, wherein a plurality of units are arranged in parallel and spaced apart by a predetermined distance from the first point to the second point.
In paragraph 3, A plurality of the above cooling coils, A hopper device equipped with a cooling function, positioned in a portion of the inner circumferential area of the upper part of the hopper.
In paragraph 2, The above cooling coil is A base coil portion extending in a curved manner along the inner surface of the upper part of the hopper from the second point to the first point; A middle coil portion disposed above the base coil portion to communicate with the base coil portion, and extending in a curved manner along the inner surface of the upper portion of the hopper from the first point to the second point; and An upper coil part disposed above the middle coil part to communicate with the middle coil part, and extending in a curved manner along the inner surface of the upper part of the hopper from the second point to the first point. A hopper device equipped with a cooling function including
In paragraph 5, The upper coil portion is located directly above the base coil portion, and The above middle coil section is a hopper device equipped with a cooling function located on the inclined upper side of the above base coil section.
In paragraph 5, The above cooling coil is An inlet coil section that connects one end of the plurality of base coil sections to communicate with each other and through which cooling water flows in from the outside; and An outlet coil section that connects one end of the plurality of upper coil sections to communicate with each other, and through which cooling water heat-exchanged with the powder is discharged. A hopper device equipped with a cooling function that further includes
In Paragraph 7, The above cooling unit is, It further includes a coil assembly in which a plurality of the above-mentioned cooling coils form a plurality of groups, and The above coil assembly is First cooling coil; A second cooling coil disposed above the first cooling coil; and A third cooling coil positioned above the second cooling coil Includes, A hopper device equipped with a cooling function in which the first cooling coil, the second cooling coil, and the third cooling coil are connected to communicate with each other.
In paragraph 8, The above cooling unit is An inlet pipe providing a path for cooling water to flow from the outside to the inlet coil section; and A discharge pipe providing a path for cooling water to be discharged to the outside from the above outlet coil section. Includes more, The above inlet pipe is, The first inlet coil section, the second inlet coil section, and the third inlet coil section of each of the first cooling coil, the second cooling coil, and the third cooling coil are all connected to communicate with each other, and The above discharge pipe is, A hopper device equipped with a cooling function connected to communicate with the first outlet coil section, the second outlet coil section, and the third outlet coil section of each of the first cooling coil, the second cooling coil, and the third cooling coil.
In paragraph 8, The above hopper is Side section; and An inclined portion extending downward from the above-mentioned side portion, converging toward the center. Includes, The second cooling coil and the third cooling coil are located on the inner side of the side portion, and The first cooling coil is a hopper device equipped with a cooling function located on the inner side of the upper part of the inclined section.
In paragraph 8, The base coil portion of the second cooling coil is located above the upper coil portion of the first cooling coil in the inclined direction, and The base coil portion of the third cooling coil is a hopper device equipped with a cooling function located on the inclined upper side of the upper coil portion of the second cooling coil.
In Paragraph 9, It further includes a cover that covers the upper part of the above-mentioned hopper, and The above inlet pipe and the above discharge pipe are a hopper device equipped with a cooling function that extends upward to penetrate the cover.
In paragraph 2, It further includes a cover that covers the upper part of the above-mentioned hopper, and The above cover has a plurality of input ports formed therein through which the powder flows from the outside into the hopper, and A hopper device equipped with a cooling function, wherein a plurality of the above-mentioned input ports are formed to be located above the cooling coil.
In Paragraph 13, The above input port is A first inlet formed in the cover so as to be located at the first point above; A second inlet formed in the cover to be located on the second point above; and A third input opening formed in the cover to be located at a third point between the first point and the second point. A hopper device equipped with a cooling function including
In Paragraph 9, It further includes a cooling water supply unit that supplies cooling water to the above cooling unit, and The above cooling water supply unit is A chiller that cools the cooling water; A first cooling water channel providing a path for cooling water to flow from the chiller to the inlet pipe; A second cooling water channel providing a path for cooling water that has heat-exchanged with the powder to flow from the discharge pipe to the chiller; and A pump disposed in the first cooling water channel to pressurize the flow of cooling water from the chiller to the inlet pipe. A hopper device equipped with a cooling function including

Description

Hopper apparatus with cooling function The present invention relates to a hopper device equipped with a cooling function. More specifically, the present invention relates to a hopper device equipped with a cooling function capable of cooling high-temperature powder inside the hopper. Electrode powder, a raw material for secondary batteries, is manufactured by applying high-temperature heat to raw materials inside a kiln. The powder, heated to high temperatures inside the kiln, flows into the hopper via a reverser and a roll mill. In a hopper, high-temperature powder flows in from the top, forms an internal space to contain the powder, and is discharged from the bottom. However, external devices connected to the hopper, such as sensors, seals, double dampers, and rotary valves, are frequently damaged by the high-temperature powder discharged from the hopper. In the prior art, there are cooling means such as attaching a separate cooling plate to the outer surface of a hopper or installing pipes through which cooling water flows inside the hopper. However, these general cooling means have the problem that the high-temperature powder is not effectively cooled because they indirectly transfer cold air to the high-temperature powder flowing into the hopper or are positioned in a path where the cooling means cannot come into direct contact with the high-temperature powder. Therefore, there is a need for a device capable of effectively cooling the high-temperature powder flowing into the hopper. FIG. 1 is a diagram showing the schematic overall configuration of a hopper device equipped with a cooling function according to one embodiment of the present invention. Figure 2 is a drawing showing the interior of the hopper with the cover of the hopper device of Figure 1 removed. Figure 3 is a top view of the hopper device of Figure 1. Figure 4 is a drawing showing the cooling coil of the hopper device of Figure 2. Figure 5 is a diagram showing a plurality of cooling coils of Figure 4 connected to communicate with each other. Figure 6 is a side cross-sectional view of the hopper device of Figure 2. Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings. Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Additionally, throughout the specification, the 'upper part', 'upper', 'upper', or 'upper surface' of a component refers to an end, part, section, or surface of a component that is relatively higher in the drawing, and the 'lower part', 'lower', 'lower', or 'lower surface' of a component refers to an end, part, section, or surface of a component that is relatively lower in the drawing. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. FIG. 1 is a schematic overall configuration of a hopper device (10) equipped with a cooling function according to one embodiment of the present invention (hereinafter referred to as the hopper device (10)), FIG. 2 is a diagram showing the interior of a hopper (100) with the cover (300) of the hopper device (10) of FIG. 1 separated, FIG. 3 is a diagram of the hopper device (10) of FIG. 1 viewed from above, FIG. 4 is a diagram showing a cooling coil (210) of the hopper device (10) of FIG. 2, FIG. 5 is a diagram showing a plurality of cooling coils (210) of FIG. 4 connected to communicate with each other, and FIG. 6 is a diagram showing a side cross-section of the hopper device (10) of FIG. 2. Referring to FIGS. 1 to 3, the hopper device (10) can cool a relatively high-temperature powder supplied from the upper outside inside the hopper (100) and discharge it to the lower outside. For example, the powder heated in the kiln is relatively high temperature, and the high-temperature powder is introduced from the upper side of the hopper (100) and discharged to the lower side of the hopper (100), but damage to external devices such as sensors, seals, double damp