KR-20260063379-A - POWER MODULE

Abstract

A power module according to one embodiment of the present invention may include: a substrate on which a chip is mounted; a mold portion provided to surround the substrate and the chip; a lead portion having one end electrically connected to the chip inside the mold portion and the other end exposed to the outside of the mold portion; and an insulating rib portion protruding from the outer surface of the mold portion where the lead portion is provided.

Inventors

• 도한진
• 이동환
• 양진명
• 박성원

Assignees

• 현대자동차주식회사
• 기아 주식회사

Dates

Publication Date

20260507

Application Date

20241030

Claims (18)

1. A substrate on which a chip is mounted; A mold portion provided to surround the substrate and the chip; A lead portion having one end electrically connected to the chip inside the mold portion and the other end exposed outside the mold portion; and Including an insulating rib portion protruding from the outer surface where the lead portion of the mold portion is provided. Power module.
2. In Article 1, The above lead portion includes a signal lead for transmitting a control signal and a power lead for transmitting power, and The above insulating rib portion includes a signal lead insulating rib protruding from one surface provided with the signal lead and a power lead insulating rib protruding from one surface provided with the power lead. Power module.
3. In Article 2, The above signal lead includes a plurality of adjacent signal pins, and the signal lead insulating rib is disposed between the signal pins. Power module.
4. In Paragraph 3, The spacing between the above signal pins is provided with a first spacing and a second spacing wider than the first spacing, and The above signal lead insulating rib includes a first signal lead insulating rib disposed between the first gaps and a second signal lead insulating rib disposed between the second gaps. Power module.
5. In Paragraph 4, The length protruding from the outer surface of the mold portion of the second signal lead insulating rib is provided to be longer than the length protruding from the outer surface of the mold portion of the first signal lead insulating rib. Power module.
6. In Paragraph 4, A plurality of the second signal lead insulating ribs are disposed between the second intervals, Power module.
7. In Paragraph 4, The signal lead insulating rib is provided to surround the inner end of at least one signal pin that contacts the mold portion. Power module.
8. In Article 7, The signal lead insulating rib is provided to surround the inner ends of a plurality of signal pins arranged adjacently at the first interval. Power module.
9. In Article 7, The signal lead insulating rib is provided to surround the inner end of the signal pin positioned at the outermost among a plurality of signal pins arranged adjacently at the first interval. Power module
10. In Article 2, The power lead comprises a plurality of input terminals that supply power to the chip and a plurality of output terminals to which power converted by the chip is output. Power module.
11. In Article 10, The above power lead insulation rib is, A first power lead insulating rib provided between adjacent input terminals or between adjacent output terminals; and A second power lead insulating rib provided between the input terminal and the output terminal arranged adjacently; comprising Power module.
12. In Article 11, The length protruding from the outer surface of the mold portion of the second power lead insulating rib is provided to be longer than the length protruding from the outer surface of the mold portion of the first power lead insulating rib. Power module.
13. In Article 10, The power lead insulating rib is provided to surround an inner end in contact with at least one of the input terminal or the output terminal, the mold portion. Power module.
14. A substrate on which a chip is mounted; A mold portion provided to surround the substrate and the chip; and It includes a lead portion that is electrically connected to the chip at one end inside the mold portion and exposed to the outside of the mold portion at the other end. The above lead portion is exposed to the outside through an insulating groove formed by being drawn inward from the outer surface of the mold portion, Power module.
15. In Article 14, The above lead portion includes a signal lead for transmitting a control signal and a power lead for transmitting power, and The above insulation groove includes a signal lead insulation groove that exposes the signal lead to the outside and a power lead insulation groove that exposes the power lead to the outside. Power module.
16. In Article 15, The above signal lead includes a plurality of adjacent signal pins, and At least one of the plurality of signal pins is disposed on the inner side of the signal lead insulation groove, Power module.
17. In Article 15, The above power lead is, It includes a plurality of input terminals that supply power to the chip and a plurality of output terminals to which power converted by the chip is output. At least one of a plurality of input terminals and output terminals is disposed on the inner side of the power lead insulation groove, Power module.
18. In Article 1, The above lead portion includes a plurality of leads, and The above insulating rib portion includes a plurality of insulating ribs, and A plurality of the above insulating ribs protrude between the plurality of the above leads, Power module.

Description

Power Module The present invention relates to a power module. With the recent rise in environmental awareness, there is a growing trend of eco-friendly vehicles equipped with electric motors as a power source. These eco-friendly vehicles are also known as electrified vehicles, and representative examples include electric vehicles (EVs) and hybrid electric vehicles (HEVs). Inverters are used for power control as a key component that significantly impacts the performance and efficiency of these vehicles. An inverter is a device that converts direct current (DC) power into alternating current (AC) power and can drive an electric motor by receiving power from a high-voltage battery. The inverter includes a power module as a core component. The power module performs power conversion by processing high voltage and current. In the design of power modules, ensuring creepage distance between signal leads and power leads is important for maintaining signal accuracy and reliability. Conventionally, a method was used to secure creepage distance between signal leads and power leads by adjusting the position of the chip mounted on the substrate; recently, research is being conducted on power module structures that can achieve miniaturization of the power module while securing creepage distance between signal leads and power leads. FIG. 1 is a front perspective view of a power module according to one embodiment of the present invention. FIG. 2 is a rear perspective view of a power module according to one embodiment of the present invention. FIG. 3 is a plan view of a power module according to one embodiment of the present invention. Figure 4 is a cross-sectional view along I-I' of Figure 1. FIG. 5a is a perspective view of a signal lead portion of a power module according to one embodiment of the present invention, and FIG. 5b is a front view of a power module according to one embodiment of the present invention. FIG. 6a is a perspective view of a signal lead portion of a power module according to another embodiment of the present invention, and FIG. 6b is a front view of a power module according to another embodiment of the present invention. FIG. 7a is a perspective view of a signal lead portion of a power module according to another embodiment of the present invention, and FIG. 7b is a front view of a power module according to another embodiment of the present invention. FIG. 8a is a perspective view of a signal lead portion of a power module according to another embodiment of the present invention, and FIG. 8b is a front view of a power module according to another embodiment of the present invention. FIG. 9a is a perspective view of a signal lead portion of a power module according to another embodiment of the present invention, and FIG. 9b is a front view of a power module according to another embodiment of the present invention. FIG. 10a is a perspective view of the power lead portion of a power module according to one embodiment of the present invention, and FIG. 10b is a rear view of a power module according to one embodiment of the present invention. FIG. 11a is a perspective view of the power lead portion of a power module according to another embodiment of the present invention, and FIG. 11b is a rear view of a power module according to another embodiment of the present invention. FIG. 12a is a perspective view of the power lead portion of a power module according to another embodiment of the present invention, and FIG. 12b is a rear view of a power module according to another embodiment of the present invention. FIG. 13a is a front perspective view of a power module according to another embodiment of the present invention, and FIG. 13b is a front view of a power module according to another embodiment of the present invention. FIG. 14a is a rear perspective view of a power module according to another embodiment of the present invention, and FIG. 14b is a rear view of a power module according to another embodiment of the present invention. FIG. 15a is a front perspective view of a power module according to another embodiment of the present invention, and FIG. 15b is a front view of a power module according to another embodiment of the present invention. FIG. 16a is a rear perspective view of a power module according to another embodiment of the present invention, and FIG. 16b is a rear view of a power module according to another embodiment of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. The