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KR-20260063382-A - Method for manufacturing Flexible Die-cut Circuit and Battery module

KR20260063382AKR 20260063382 AKR20260063382 AKR 20260063382AKR-20260063382-A

Abstract

The present disclosure relates to a method for manufacturing a Flexible Die-cut Circuit (FDC) and a battery module. Through a method for manufacturing a Flexible Die-cut Circuit (FDC) comprising the steps of: forming a copper foil circuit pattern by punching a copper foil; completing the FDC by combining a cover layer that covers the copper foil circuit pattern; and pressing the FDC with a press machine to flatten the punched portion of the copper foil circuit pattern, the punched portion around the processing area formed during the punching process of the copper foil to form the circuit pattern can be flattened, thereby preventing damage to the insulator cover layer and detecting the presence or absence of damage by inspecting the insulation performance of the insulator cover layer. Additionally, a battery module including the Flexible Die-cut Circuit (FDC) can be provided.

Inventors

  • 홍총표
  • 신희준
  • 최회욱

Assignees

  • 에스케이온 주식회사

Dates

Publication Date
20260507
Application Date
20241030

Claims (13)

  1. A step of forming a copper foil circuit pattern by punching out the copper foil; A step of completing a Flexible Die-cut Circuit (FDC) by combining a coverlay that covers the copper foil circuit pattern; and A method for manufacturing a Flexible Die-cut Circuit (FDC), comprising the step of flattening the punched portion of a copper foil circuit pattern by pressing the above-mentioned FDC with a press machine.
  2. In claim 1, A method for manufacturing a Flexible Die-cut Circuit (FDC), further comprising a defect inspection step for detecting whether there is damage to the coverlay by measuring the insulation resistance of the FDC.
  3. In claim 2, The above defect inspection step is A step of measuring insulation resistance using an insulation inspection device while the upper metal plate and the lower metal plate of the above press equipment are in contact with the FDC (Flexible Die-cut Circuit); and FDC manufacturing method comprising the step of detecting whether there is damage to the coverlay based on the insulation resistance measurement data above.
  4. In claim 3, The step of measuring the insulation resistance above A method for manufacturing an FDC (Flexible Die-cut Circuit), wherein one of the two measuring wires of the insulation inspection equipment is connected to a copper foil circuit pattern of the FDC, the other measuring wire is connected to an upper metal plate or a lower metal plate of a press equipment, and the insulation resistance of the FDC is measured by applying power.
  5. In claim 1, The step of flattening the punched portion of the copper foil circuit pattern by pressing the above FDC (Flexible Die-cut Circuit) with a press machine FDC manufacturing method, pressing under pressure conditions in the range of 1~7 kgf/㎠.
  6. In claim 1, The step of completing the FDC (Flexible Die-cut Circuit) by combining a coverlay that covers the copper foil circuit pattern above A step of punching out a coverlay to be attached to the copper foil circuit pattern above; A step of attaching the above-mentioned punched coverlay to a copper foil circuit pattern and laminating it; A step of punching out an outer shape for a copper foil circuit pattern on which the above coverlay is laminated; and A method for manufacturing a Flexible Die-cut Circuit (FDC), comprising the step of completing the FDC by hot-pressing a coverlay onto a copper foil circuit pattern with the outer shape punched out above.
  7. A step of forming a copper foil circuit pattern by punching out the copper foil; A step of flattening the punched portion of the copper circuit pattern by pressing the copper circuit pattern with a press machine; and A method for manufacturing a Flexible Die-cut Circuit (FDC), comprising the step of completing the FDC by combining a cover layer that covers the copper foil circuit pattern.
  8. In claim 7, After the step of completing the above FDC (Flexible Die-cut Circuit), A step of measuring the insulation resistance of the above FDC (Flexible Die-cut Circuit) using insulation inspection equipment; and FDC manufacturing method further comprising the step of detecting whether there is damage to the coverlay based on the insulation resistance measurement data above.
  9. In claim 8, The step of measuring the insulation resistance above A method for manufacturing an FDC (Flexible Die-cut Circuit), wherein one measuring wire of an insulation inspection device is connected to a copper foil circuit pattern of the FDC, another measuring wire of the insulation inspection device is connected to an upper metal plate or a lower metal plate positioned above or below the FDC, and the insulation resistance of the FDC is measured by applying power.
  10. In claim 7, The step of flattening the punched portion of the copper circuit pattern by pressing the above copper circuit pattern with a press machine FDC manufacturing method, pressing under pressure conditions in the range of 1~7 kgf/㎠.
  11. In claim 7, The step of completing the FDC (Flexible Die-cut Circuit) by combining a coverlay that covers the copper foil circuit pattern above A step of punching a coverlay to be attached to a copper circuit pattern after completing the step of flattening the punched portion of the copper circuit pattern; A step of attaching the above-mentioned punched coverlay to a copper foil circuit pattern and laminating it; A step of punching out an outer shape for a copper foil circuit pattern on which the above coverlay is laminated; and A method for manufacturing a Flexible Die-cut Circuit (FDC), comprising the step of completing the FDC by hot-pressing the copper foil circuit pattern and coverlay formed by the above-mentioned outer shape punching.
  12. Multiple battery cells; A busbar assembly that transmits power from battery cells by connecting multiple taps of the plurality of battery cells; A circuit board including a Flexible Die-cut Circuit (FDC) that performs state measurement of the plurality of battery cells or performs data transmission and reception; and It includes a case for housing a circuit board including the above-mentioned plurality of battery cells, a busbar assembly, and a Flexible Die-cut Circuit (FDC). The above FDC (Flexible Die-cut Circuit) is A copper foil circuit pattern in which the punch-indented portion around the processing area formed during the punch-in process of the copper foil is flattened; and A battery module comprising a coverlay that covers a flattened copper foil circuit pattern on the above-mentioned stamped portion.
  13. In claim 12, The copper foil circuit pattern of the above FDC (Flexible Die-cut Circuit) is A battery module that flattens the punched indentation around the processing area formed during the punching process of copper foil by pressing under pressure conditions in the range of 1~7 kgf/㎠.

Description

Method for manufacturing Flexible Die-cut Circuit and Battery module The present disclosure relates to a method for manufacturing a flexible die-cut circuit (FDC) which is a flexible circuit product, and a battery module including the flexible die-cut circuit (FDC) manufactured thereby. Flexible Die-cut Circuit (FDC) is a flexible circuit product in which circuit patterns are implemented using a die-cutting process. FDC is a new technology that replaces Flexible Printed Circuit Board (FPCB), which implements circuit patterns through photolithography and etching processes. FDC enables non-stop processing from the implementation of circuit patterns to the outer shape die-cutting process. Compared to FPCB, FDC can shorten the manufacturing process and increase cost reduction effects. FIG. 1 is a drawing for explaining an FDC manufacturing method that performs a press flattening step after the completion of the FDC according to one embodiment. FIG. 2 is a drawing illustrating the state in which a punched indentation is formed on a punched copper foil circuit pattern in a method for manufacturing an FDC according to one embodiment. FIG. 3 is a diagram illustrating the press flattening step in an FDC manufacturing method according to one embodiment. FIG. 4 is a drawing showing a state in which micro-damage occurs to the coverlay due to the punching pressure of the copper foil circuit pattern in the FDC manufacturing method according to one embodiment. FIG. 5 is a drawing including a detailed process of the defect inspection step in the FDC manufacturing method of FIG. 1 according to one embodiment. FIG. 6 is a drawing illustrating press flattening and insulation performance testing in an FDC manufacturing method according to one embodiment. FIG. 7 is a diagram illustrating the detection of coverlay damage during insulation performance testing in an FDC manufacturing method according to one embodiment. FIG. 8 is a drawing for explaining an FDC manufacturing method that performs a press flattening step after copper foil punching according to one embodiment. FIG. 9 is a drawing for explaining insulation performance testing in the FDC manufacturing method of FIG. 8 according to one embodiment. FIG. 10 is a drawing illustrating a battery module including an FDC according to one embodiment. Hereinafter, the present disclosure will be described in detail (with reference to the attached drawings). However, this is merely illustrative and the present disclosure is not limited to the specific embodiments described illustratively. Drawings may be schematic or exaggerated for the purpose of illustrating embodiments. In this document, expressions such as "may include" and "may have" refer to the existence of the relevant feature (e.g., numerical values, functions, actions, or components such as parts) and do not exclude the existence of additional features. Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the attached drawings. FIG. 1 is a drawing for explaining an FDC manufacturing method that performs a press flattening step after FDC completion according to one embodiment, FIG. 2 is a drawing for explaining a state in which a punched indentation is formed on a punched copper foil circuit pattern in an FDC manufacturing method according to one embodiment, FIG. 3 is a drawing for explaining a press flattening step in an FDC manufacturing method according to one embodiment, and FIG. 4 is a drawing showing a state in which micro-damage occurs on a coverlay due to the punched indentation of a copper foil circuit pattern in an FDC manufacturing method according to one embodiment. Referring to FIGS. 1 to 4, the method for manufacturing an FDC according to the present disclosure may include the step (S10) of forming a copper foil circuit pattern (10) by punching a copper foil, the step (S20) of completing the FDC (1) by combining a cover layer (20) that covers the copper foil circuit pattern (10), and the step (S30) of flattening the punched-in portion (11) of the copper foil circuit pattern (10) by pressing the FDC (1) with a press machine. The step (S10) of forming a copper foil circuit pattern (10) by punching a copper foil can be performed by inserting a cut copper foil into a punching die having a certain pattern and forming the copper foil circuit pattern (10) through punching processing. The punching die may be a rolling press having a circuit pattern on its surface. By using a rolling press as the punching die, the manufacturing of the FDC (1) can be performed as a continuous process. The copper foil may have a thickness of 0.3 to 0.5 mm. An example of a copper foil circuit pattern (10) punched by a punching die is shown in FIG. 2. The copper foil circuit pattern (10) can function as a conductor that transmits electrical signals in the FDC (1). The copper foil circuit pattern (10) of the present disclosure allows for the circuit pattern to be implemented on the copper foil