KR-20260063391-A - SEMICONDUCTOR DEVICE TESTING APPARATUS AND SEMICONDUCTOR DEVICE TESTING METHOD

KR20260063391AKR 20260063391 AKR20260063391 AKR 20260063391AKR-20260063391-A

Abstract

The present invention relates to a semiconductor device inspection apparatus and inspection method, and more specifically, to a semiconductor device inspection apparatus and method comprising a probe card support member for supporting a probe card for inspecting a substrate, a deformation amount measuring device, a main controller for determining alignment status, and a substrate support unit for supporting a substrate, wherein the deformation amount is measured after a compensation reference time has elapsed from the last performed alignment, and alignment of the substrate and the probe card is performed according to the measurement result of the deformation amount.

Inventors

정병욱

Assignees

세메스 주식회사

Dates

Publication Date: 20260507
Application Date: 20241030

Claims (10)

A semiconductor device inspection device that inspects the electrical characteristics of a substrate is An inspection chamber providing a space where an inspection process is performed; A probe card support installed in the above inspection chamber to support a probe card for inspecting the substrate; A deformation measuring device for measuring the amount of deformation of the substrate or the probe card according to the temperature change of the inspection process; A main controller that determines whether the substrate and the probe card are aligned based on the amount of deformation measured above; and A substrate support unit that supports the above substrate; comprising, The above substrate support unit is, An upper plate for controlling the temperature of the above substrate; It includes a driving unit that adjusts the position of the above substrate, and A semiconductor device inspection device in which the main controller measures the amount of deformation when a compensation reference time elapses from the last alignment point, and performs alignment of the substrate and the probe card according to the measurement result of the amount of deformation.
In claim 1, the deformation amount measuring device is a semiconductor device inspection device comprising a camera module that photographs one side of a probe card or a camera module that photographs one side of a substrate.
In paragraph 2, The main controller is, An image processing unit that receives and analyzes a captured image from the above camera module and calculates the amount of deformation; A semiconductor device inspection device comprising: a main control unit that compares the amount of deformation calculated by the image processing unit with the reference amount of deformation, and compares the time elapsed from the last alignment point with the compensation reference time.
In paragraph 3, The above main controller is, A semiconductor device inspection device connected to the above driving unit and moving a substrate by the amount of deformation.
In a semiconductor device inspection method comprising the semiconductor device inspection device of claim 1, A process temperature change step for controlling the temperature of the above substrate; A substrate alignment step for aligning the above substrate to a probe card; A substrate test start step for initiating an electrical characteristic test of the above substrate; and a substrate test end step for terminating the test; A first determination step for checking whether the time elapsed from the last performed substrate alignment step and the compensation reference time have been exceeded; and The above semiconductor device inspection device includes a second determination step for checking whether the thermal deformation amount exceeds a reference deformation amount, and A semiconductor device inspection method that re-performs the substrate alignment step when the compensation standard time is exceeded in the first judgment step and the standard deformation amount is exceeded in the second judgment step.
In paragraph 5, A semiconductor device inspection method in which the amount of displacement of the substrate moved from before the substrate test start stage until after the substrate test end stage is the amount of thermal deformation.
In paragraph 6, The above second judgment step is, A semiconductor device inspection method that proceeds with the substrate alignment step when one of the displacement amounts in the X-axis direction, Y-axis direction, and Z-axis direction exceeds the reference deformation amount corresponding to each axis direction.
In paragraph 6, The strain measuring device includes a camera module that photographs one side of the substrate, and The above main controller is, A semiconductor device inspection method that calculates the amount of displacement of a substrate by comparing a reference image captured by the camera module before the process temperature change step or the substrate test start step with a current image captured after the substrate test end step.
In paragraph 5, A semiconductor device inspection method that performs the process temperature change step and the first judgment step after the above substrate test termination step.
In paragraph 5, A semiconductor device inspection method that does not proceed with the substrate alignment step if the compensation standard time is not exceeded in the first judgment step.

Description

Semiconductor Device Testing Apparatus and Semiconductor Device Testing Method The present invention relates to a semiconductor device inspection device and a semiconductor device inspection method, and more specifically, to a device and method for conducting inspection of a substrate by compensating for thermal deformation of the substrate and the semiconductor device inspection device caused by temperature changes during the semiconductor device inspection process. Semiconductor devices are manufactured through processes such as deposition, etching, photolithography, etching, and packaging. At this stage, the electrical characteristics of the semiconductor device can be inspected to verify whether the device has been manufactured correctly. The inspection process of the semiconductor device can be performed using a probe station. In particular, the probe station can conduct inspections of the semiconductor device by controlling it to various process temperatures. However, a problem arises where the components of the probe station undergo thermal deformation due to expansion or contraction caused by temperature changes depending on each process condition. For example, thermal deformation of the substrate support and substrate support station that support and transport the substrate can cause the position of the substrate to shift. In this case, semiconductor devices on the substrate may detach from the probes of the probe card, thereby reducing the reliability of the semiconductor device inspection process results; therefore, a technology is required to realign the position of the substrate carrying the semiconductor devices when thermal deformation occurs due to changes in the inspection process temperature. FIG. 1 is a schematic diagram showing a semiconductor device inspection device according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing the configuration of a test equipment according to an embodiment of the present invention. Figure 3 shows a substrate captured through a camera module according to an embodiment of the present invention. Figure 4 is an enlarged view of the process of aligning a substrate in a semiconductor device inspection device according to an embodiment of the present invention. FIG. 5 is a flowchart illustrating a semiconductor device inspection method of a semiconductor device inspection device according to an embodiment of the present invention. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the invention, parts unrelated to the description have been omitted, and the same reference numerals are used for identical or similar components throughout the specification. In addition, in various embodiments, components having the same configuration are described using the same reference numerals only in representative embodiments, and for other embodiments, only configurations different from representative embodiments are described. Throughout the specification, when a part is described as being “connected (or combined)” to another part, this includes not only cases where they are “directly connected (or combined)” but also cases where they are “indirectly connected (or combined)” with other members in between. Furthermore, when a part is described as “comprising” a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. Hereinafter, a semiconductor device inspection apparatus and a semiconductor device inspection method will be described according to an embodiment of the present invention. The semiconductor device inspection apparatus of the present invention includes a probe station equipped with a probe card for inspecting a semiconductor device. By realigning the position of the substrate according to thermal deformation caused by temperature changes occurring during the semiconductor device inspection process, the reliability of the inspection results can be improved. Furthermore, by variably adjusting the time interval for realigning the position of the substrate, the effect of reducing the total time required for substrate inspection can be obtained. FIG. 1 is a schematic diagram showing a semi