KR-20260063516-A - METHOD AND APPARATUS FOR ESTIMATING TEMPERATURE OF MEMS RESONATOR BY INDIRECT Q FACTOR MEASUREMENT

Abstract

The present invention relates to a method and apparatus for estimating the temperature of a MEMS resonator through indirect Q factor measurement, and may include the steps of: estimating an indirect Q factor in real time using a resonance frequency and the amplitude of an output signal; estimating the temperature of the resonator using the indirect Q factor; and compensating for temperature characteristics using the estimated temperature.

Inventors

• 김학주
• 정형균
• 박규철

Assignees

• (주)마이크로인피니티

Dates

Publication Date

20260507

Application Date

20241030

Claims (8)

1. In a method for estimating the temperature of a resonator by indirectly estimating the Q factor, A step of estimating an indirect Q factor in real time using the resonance frequency and the amplitude of the output signal; and Step of estimating the temperature of the resonator using the above indirect Q factor A method including
2. In paragraph 1, The step of indirectly estimating the above indirect Q factor in real time is, Estimating the indirect Q factor using the above resonance frequency, the amplitude of the output signal, the applied force, and the verification mass method.
3. In paragraph 1, The step of indirectly estimating the above Q factor in real time is, Indirectly estimating the above indirect Q factor using <Mathematical Equation 7> below method. [Mathematical Formula 7] Here, is an indirectly estimated indirect Q-factor, and is a scale factor that determines weights defined by Q factors estimated by a ring-down method, and is the resonant frequency controlled by the closed-loop system, and is the amplitude of the output signal obtained from the sensing electrode, and is the force applied to the MEMS (micro-electro-mechanical system) resonator, and is a verification mass defined according to the designed resonator.
4. In paragraph 1, A step of compensating for temperature characteristics using the above-mentioned estimated temperature A method that includes more.
5. In a device for estimating the temperature of a resonator by indirectly estimating the Q factor, An indirect Q factor estimation unit that estimates an indirect Q factor in real time using the resonance frequency and the amplitude of the output signal received from a closed-loop system; and A temperature estimation unit that estimates the temperature of the resonator using the above Q factor. A device including
6. In paragraph 5, The above indirect Q factor estimator is, The above resonant frequency, the amplitude of the output signal, and the applied force are received by the closed-loop system, and Verify the verification mass defined by the designed resonator, and Estimating the indirect Q factor using the above resonance frequency, the amplitude of the output signal, the applied force, and the verification mass device.
7. In paragraph 5, The above indirect Q factor estimator is, Indirectly estimating the above Q factor using <Mathematical Equation 7> below device. [Mathematical Formula 7] Here, is an indirectly estimated Q factor, and is a scale factor that determines weights defined by Q factors estimated by a ring-down method, and is the resonant frequency controlled by the closed-loop system, and is the amplitude of the output signal obtained from the sensing electrode, and is the force applied to the MEMS (micro-electro-mechanical system) resonator, and is a verification mass defined according to the designed resonator.
8. In paragraph 5, A compensation unit that compensates for temperature characteristics using the above-mentioned estimated temperature A device that further includes

Description

Method and apparatus for estimating the temperature of a MEMS resonator by indirect Q factor measurement The following embodiments relate to a method and apparatus for estimating the temperature of a MEMS resonator. Micro-electro-mechanical system (MEMS) resonators can be fabricated at low cost with excellent mechanical properties using silicon-based technology and play an important role in various applications. In particular, for MEMS resonant accelerometers, it is important to address the problem of resonant frequency changing with temperature variations. Existing technologies have attempted to solve this problem using microwave oven control methods or compensation methods utilizing temperature sensors; however, these approaches suffer from issues such as high power consumption, time delays due to temperature gradients, and thermal hysteresis. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Figure 1 is a diagram illustrating the change in resonator displacement in a ring-down manner. FIG. 2 is a diagram illustrating the structure of a device for estimating the temperature of a MEMS resonator through indirect Q factor measurement according to one embodiment of the present invention. FIG. 3 is a flowchart illustrating the process of estimating the temperature of a MEMS resonator through indirect Q factor measurement according to one embodiment of the present invention. FIG. 4 is a diagram illustrating an example of a profile showing temperature changes for evaluating the performance of a device for estimating the temperature of a MEMS resonator according to one embodiment of the present invention. FIG. 5 is a diagram comparing an indirect Q factor and a ring-down type Q factor according to one embodiment of the present invention. FIG. 6 is a diagram illustrating an example of the change in resonance frequency output characteristics and real-time indirect Q factor characteristics according to the application of acceleration in accordance with an embodiment of the present invention. FIG. 7 is a diagram illustrating an example of the change in resonance frequency output characteristics and real-time indirect Q factor characteristics according to the application of acceleration in accordance with an embodiment of the present invention. FIG. 8 is a diagram illustrating the change in the resonance frequency and real-time indirect Q factor of a resonator according to temperature cycling in accordance with one embodiment of the present invention. FIG. 9 is a diagram illustrating the resonance frequency output according to the temperature estimated by the indirect Q factor and the temperature measured through the temperature sensor according to one embodiment of the present invention. FIG. 10 is a diagram illustrating the hysteresis results of the temperature estimated according to the indirect Q factor and the temperature measured through the temperature sensor according to one embodiment of the present invention. Hereinafter, embodiments are described in detail with reference to the attached drawings. However, various modifications may be made to the embodiments, and thus the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights. The terms used in the embodiments are for illustrative purposes only and should not be interpreted as intended to be limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the embodiments pertain. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. In describing the embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiments, such detailed description is omitted. In addition, terms such as first, second, A, B, (a), (b), e