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KR-20260063561-A - CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, PHOTOSENSITIVE RESIN LAYER, COLOR FILTER AND CMOS IMAGE SENSOR

KR20260063561AKR 20260063561 AKR20260063561 AKR 20260063561AKR-20260063561-A

Abstract

A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin film manufactured using the photosensitive resin composition, a color filter including the photosensitive resin film, and a CMOS image sensor including the color filter are provided.

Inventors

  • 문희조
  • 박백성
  • 서광원
  • 김익진
  • 박수빈
  • 전영민

Assignees

  • 삼성에스디아이 주식회사

Dates

Publication Date
20260507
Application Date
20241030

Claims (15)

  1. A core represented by the following chemical formula 1 and A shell surrounding the core and represented by the following chemical formula 2 Core-shell compound composed of: [Chemical Formula 1] [Chemical Formula 2] In the above Chemical Formulas 1 and 2, R1 is a thermosetting group, and R2 and R3 are each independently a substituted or unsubstituted C1 to C20 alkyl group, an unsubstituted C2 to C20 alkenyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C6 to C20 aryl group, and R2 and R3 can be connected or fused to form a ring, and L1 to L4 are each independently represented by a single bond, a substituted or unsubstituted C1 to C10 alkylene group, or the following chemical formula L, provided that L1 to L4 are not simultaneously single bonds, [Chemical Formula L] In the above chemical formula L, L5 is a substituted or unsubstituted C1 to C10 alkylene group, and n is an integer from 1 to 10, and L a and L b are each independently single-bonded, substituted, or unsubstituted C1 to C10 alkylene groups, and R a is a hydrogen atom, a halogen atom, a substituted or unsubstituted C1 to C20 alkyl group or *-C(=O)OR 4 (R 4 is a substituted or unsubstituted C1 to C20 alkyl group), and Rb to Re are each independently a hydrogen atom, a halogen atom, or a substituted or unsubstituted C1 to C20 alkyl group, and However, R a to R e are not simultaneously hydrogen atoms, m1 is an integer from 0 to 3, and m2 is an integer from 1 to 10.
  2. In paragraph 1, The above thermosetting group is a compound comprising a substituted or unsubstituted epoxy group, a substituted or unsubstituted oxetane group, or a combination thereof.
  3. In paragraph 1, A compound in which m1 is an integer of 0, and Rb to Re are each independently halogen atoms.
  4. In paragraph 3, The above L1 is a substituted or unsubstituted C1 to C10 alkylene group, and The above L2 to L4 are each independently single-bonded compounds.
  5. In paragraph 1, The above R2 and R3 are compounds that are connected or fused to form a substituted or unsubstituted cycloalkane ring or a substituted or unsubstituted benzene ring.
  6. In paragraph 1, The core represented by the above chemical formula 1 is a compound having a maximum absorption wavelength at 660 nm to 680 nm.
  7. In paragraph 1, The shell represented by the above chemical formula 2 is a compound represented by the following chemical formula 2-1: [Chemical Formula 2-1] In the above chemical formula 2-1, R a is a hydrogen atom, a halogen atom, a substituted or unsubstituted C1 to C20 alkyl group or *-C(=O)OR 4 (R 4 is a substituted or unsubstituted C1 to C20 alkyl group), and Rb to Re are each independently a hydrogen atom, a halogen atom, or a substituted or unsubstituted C1 to C20 alkyl group, and However, R a to R e are not simultaneously hydrogen atoms, m1 is an integer from 0 to 3.
  8. In paragraph 1, The above core-shell compound is a compound represented by any one of the following chemical formulas A to E. [Chemical Formula A] [Chemical Formula B] [Chemical Formula C] [Chemical Formula D] [Chemical Formula E]
  9. In paragraph 1, The above compound is a compound that is a green dye.
  10. A photosensitive resin composition comprising a compound of any one of claims 1 to 9.
  11. In Paragraph 10, The above photosensitive resin composition is a photosensitive resin composition further comprising a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a pigment, and a solvent.
  12. In Paragraph 10, The above photosensitive resin composition is a photosensitive resin composition for a CMOS image sensor.
  13. A photosensitive resin film manufactured using the photosensitive resin composition of claim 10.
  14. A color filter comprising the photosensitive resin film of paragraph 13.
  15. A CMOS image sensor including the color filter of claim 14.

Description

Core-shell compound, photosensitive resin composition comprising the same, photosensitive resin layer, color filter and CMOS image sensor The present invention relates to a core-shell compound, a photosensitive resin composition comprising the same, a photosensitive resin film manufactured using the photosensitive resin composition, a color filter comprising the photosensitive resin film, and a CMOS image sensor comprising the color filter. Recently, due to the rapid development of advanced information and communication processing technology and the electronics industry as a whole, there is a growing need for next-generation detectors capable of rapidly transmitting and receiving large amounts of information, as well as the development of new concept devices and systems. In particular, with the emergence of video processing for mobile devices, the technology for ultra-miniaturized and ultra-low power image sensors is rapidly accelerating development, centering on existing CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor). An image sensor is a semiconductor that converts photons into electrons to be displayed on a display or stored in a storage device. It consists of a light receiving element that converts a light signal into an electrical signal, a pixel circuit part that amplifies and compresses the converted electrical signal, and an ASIC part that processes an image signal by converting the preprocessed analog signal into a digital signal. There are types such as CCD, CMOS, and CIS (Contact Image Sensor). CCD and CMOS image sensors utilize the same photodetectors. In the case of CCD image sensors, electric charge generated at the light-receiving section moves sequentially through MOS capacitors connected in a series and is converted into voltage at the Source Follower connected to the final stage. On the other hand, in CMOS image sensors, electric charge is converted into voltage at the Source Follower embedded within each pixel and output externally. More specifically, a CCD image sensor moves electrons generated by light directly to the output section using gate pulses, whereas a CMOS image sensor converts electrons generated by light into voltage within each pixel and outputs them through various CMOS switches. The applications of these image sensors are extremely broad, ranging from consumer products such as digital cameras and mobile phones to endoscopes used in hospitals and telescopes on satellites orbiting the Earth. Regarding technological trends in CMOS image sensors, there is a trend toward increasing pixel counts and decreasing device size to achieve higher image quality and miniaturization. However, as pixel sizes shrink, there are limitations to manufacturing fine patterns using pigments, necessitating the development of dyes to compensate. Nevertheless, dyes present challenges in terms of processability during pattern manufacturing compared to pigments. Specifically, issues arise regarding developability. This is because pigments are fine particles with crystallinity, resulting in poor solubility and preventing them from leaching into solvents like PGMEA after baking. In contrast, dyes are amorphous solids, which leads to the disadvantage of dissolving into solvents after the baking process. Furthermore, in the case of CMOS image sensors, the high content of colorants results in a relatively lower ratio of binder resins or monomers, making it difficult to improve the developability of dyes. Figure 1 is a graph showing the absorbance of compounds according to Synthesis Example 1, Synthesis Example 2, and Comparative Synthesis Example 1. Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention, and the present invention is defined only by the scope of the claims set forth below. Unless otherwise specifically stated in this specification, "substituted" to "substituted" means that one or more hydrogen atoms of the functional groups of the present invention are substituted with one or more substituents selected from the group consisting of a halogen atom (F, Br, Cl or I), a hydroxyl group, a nitro group, a cyano group, an amino group ( NH₂ , NH( R₂O₆ ) or N( R₂O₆ )( R₂O₆ ), wherein R₂O₆ , R₂O₆ , and R₂O₆ are the same or different from each other and are each independently a C1 to C10 alkyl group), an amido group, a hydrazine group, a hydrazone group, a carboxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted alicyclic organic group, a substituted or unsubstituted aryl group, and a substituted or unsubstituted heterocyclic group. Unless otherwise specifically stated in this specification, "alkyl group" means a C1 to C20 alkyl group, specifically a C1 to C15 alkyl group; "cycloalkyl group" means a C3 to C20 cycloalkyl group, specif