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KR-20260063601-A - Air amplification module applied to cleaning device and air amplification assembly including the air amplification module

KR20260063601AKR 20260063601 AKR20260063601 AKR 20260063601AKR-20260063601-A

Abstract

The present invention relates to an air amplification module applied to a cleaning device and an air amplification assembly including said air amplification module. More specifically, it is a useful invention in which the removal of fine foreign substances, such as environmental contaminants and soldering fumes, is more effective when cleaning the surface of a PCB by supplying a separate air to the air amplification module to amplify the suction flow rate and cleaning the PCB surface, by installing the air amplification module on one side of a suction pipe, which is a passage for the air sucked in toward the collection filter side when air supply and suction occur simultaneously.

Inventors

  • 이승호

Assignees

  • 씨티에스(주)

Dates

Publication Date
20260507
Application Date
20241030

Claims (8)

  1. As an air amplification module installed in the suction pipe of a cleaning device, A passage (45) is formed so that the intake and discharge of air is made by penetrating from one side to the other side inside, and An air amplification module applied to a cleaning device, characterized by having an air supply hole (47) formed on one side of the outside that receives a separate air supply to amplify the air discharged by extending from the above-mentioned passage (45).
  2. In Article 1, An air amplification module applied to a cleaning device, characterized in that the end portion of the air discharge path (45) is formed to gradually widen in the direction of discharge.
  3. In Article 1, An air amplification module applied to a cleaning device, characterized in that the air supply holes (47) are formed in one or more multiple numbers.
  4. As an air amplification assembly mounted inside a cleaning device, An ultrasonic cleaner nozzle part (10) that cleans by spraying air onto a PCB placed on the cleaning device for cleaning; A collection filter (20) positioned on the other side of the above-mentioned ultrasonic cleaner nozzle part (10) and performing a suction function; One side is connected to the ultrasonic cleaner nozzle part (10) and the other side is connected to one side of the collection filter (20), so that when the collection filter (20) performs a suction function, the suction pipe (30) sucks in foreign substances on the PCB surface and moves them to the collection filter (20); An air amplification module (40) of claim 1 disposed on one side of the suction pipe (30); An air amplification assembly including an air amplification module applied to a cleaning device, characterized by including a second air supply unit (50) for supplying air to the air amplification module (40).
  5. In Paragraph 4, In the above second air supply unit (50), An air amplification assembly including an air amplification module applied to a cleaning device, characterized by including a regulator (51) to regulate the supply pressure of the air supplied to the air amplification module (40).
  6. In Paragraph 4, The above air amplification assembly includes, A first air supply unit (60) that supplies air to the above ultrasonic cleaner nozzle unit (10) is configured, and An air amplification assembly comprising an air amplification module applied to a cleaning device, characterized in that the first air supply unit (60) includes a regulator (61) for adjusting the air supply pressure.
  7. In Paragraph 4, The above ultrasonic cleaner nozzle part (10) is, A spray hole (11) is formed to spray the supplied air to the lower central part, and An air amplification assembly comprising an air amplification module applied to a cleaning device, characterized in that one or more suction holes (13) connected to a suction pipe (30) are formed at the lower edge.
  8. In Paragraph 4, The above air amplification module (40) is, A plurality of them are spaced apart at regular intervals on one side of the suction pipe (30), and The above second air supply unit (50) supplies air to each air amplification module (40) individually or integrally, or An air amplification assembly including an air amplification module applied to a cleaning device, characterized by being configured to supply air to each air amplification module (40) by configuring a second air supply unit (50) corresponding to the number of air amplification modules (40).

Description

Air amplification module applied to a cleaning device and air amplification assembly including the air amplification module The present invention relates to an air amplification module applied to a cleaning device and an air amplification assembly including the air amplification module. More specifically, it is a technology effective for removing fine foreign substances, such as environmental foreign substances and soldering fumes, by simultaneously supplying and sucking air for cleaning a PCB surface, and generating a suction flow rate 2 to 3 times greater than the supplied air so that spraying and suction are performed simultaneously. Typically, a cleaning device is used to remove foreign substances attached to the surface of a PCB, and there are contact cleaning methods that clean by generating friction with the PCB in the cleaning device, and non-contact cleaning methods that clean without generating friction with the PCB. In the case of the contact cleaning method, the cleaning is performed by forming it with a material that is not damaged when friction occurs with the surface of the PCB, such as a brush, using water or other cleaning materials, and then drying. In the case of the non-contact cleaning method, air is supplied from an external air source and placed close to the surface of the PCB to spray the air onto the PCB surface. The pressure of the air removes foreign substances attached to or remaining on the PCB surface, and the foreign substances removed in this way are collected by sucking them in using a collection device. Meanwhile, the non-contact cleaning method is a method that effectively removes foreign substances by applying pressure to the PCB through supplied air to remove foreign substances, and at the same time, sucking in the removed foreign substances through a collection device, thereby applying air injection and suction force simultaneously. First, if we look at conventional technologies, Publication No. 10-2024-0050868 (Patent) A substrate cleaning device for removing particles attached to the surface of a PCB, comprising: a transfer unit that transfers the PCB while supporting it; and a cleaning unit that removes particles from the PCB moving in one direction by the transfer unit; wherein the cleaning unit comprises a spraying unit that sprays high-pressure air onto the surface of the PCB through a nozzle, an ultrasonic providing unit provided in the nozzle that provides ultrasonic vibrations to the high-pressure air sprayed through the nozzle, and a suction unit that sucks in the air sprayed onto the surface of the PCB by the spraying unit. Patent No. 10-2177380 (Patent) is a technology relating to a substrate cleaning device comprising: a cartridge part in which a plurality of substrates are spaced apart at a certain interval to form a cleaning space between the substrates; a cleaning part that sprays air introduced from an air supply means into the cartridge part to spray air into the cleaning space; and a hinge transfer part coupled to the cartridge part so that the angle formed by the direction of spraying of the air sprayed from the cleaning part and the substrate is variable, and for hinge-rotating the cartridge part around a hinge rotation axis. Registration No. 10-1397408 (Patent) A cleaning means comprising a first cleaning tank and a second cleaning tank having a sealed structure, wherein a workpiece to be cleaned, in which a plurality of plate-shaped PCBs are loaded in a box-shaped magazine with an internal and external opening, is inserted as a whole and cleaned sequentially; and a rinsing and drying means comprising a rinse and drying tank in which a workpiece supplied from the cleaning means is inserted to perform rinsing and drying, a steam generator connected to the rinse and drying tank to inject steam, and a vacuum pump to form a vacuum; wherein each cleaning tank is equipped with an ultrasonic vibrator that generates ultrasonic waves on the cleaning water while simultaneously filling the cleaning water so that the workpiece to be cleaned is submerged; and wherein the second cleaning tank is equipped with a microbubble generator that generates microbubbles on the cleaning water, wherein the microbubble generator is configured to allow a portion of the cleaning liquid of the second cleaning tank to pass through and is configured to inject the cleaning liquid into the second cleaning tank while vibrating it at a certain frequency; The present invention relates to a magazine and PCB cleaning device, wherein the first cleaning tank is connected to an intake line connected to the vacuum pump to degas air contained in the cleaning water by vacuum suction; the rinse and drying tank is equipped with a spray nozzle that sprays air to primarily remove moisture on the object to be cleaned prior to the operation of the steam generator and the vacuum pump; and at least the second cleaning tank among the cleaning tanks is equipped with a water level control means includin