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KR-20260063618-A - semiconductor package including an optical substrate

KR20260063618AKR 20260063618 AKR20260063618 AKR 20260063618AKR-20260063618-A

Abstract

The semiconductor package of the present invention includes an optical printed circuit board; and an integrated circuit element mounted on the optical printed circuit board. The optical printed circuit board includes: a base layer; at least one optical image dielectric layer disposed on the base layer; a horizontal optical waveguide disposed extending horizontally within the at least one optical image dielectric layer; a first via optical waveguide disposed in communication with the horizontal optical waveguide on one side of the horizontal optical waveguide and disposed vertically within the at least one optical image dielectric layer; and a second via optical waveguide disposed in communication with the horizontal optical waveguide on the other side of the horizontal optical waveguide and disposed vertically within the at least one optical image dielectric layer.

Inventors

  • 김혜진

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20241030

Claims (10)

  1. Optical printed circuit board; and The integrated circuit element mounted on the above-mentioned optical printed circuit board, wherein The above optical printed circuit board is, Base layer; At least one optical image dielectric layer disposed on the base layer; A horizontal optical waveguide extending horizontally and disposed within the above-mentioned at least one optical image dielectric layer; A first via optical waveguide disposed on one side of the horizontal optical waveguide in communication with the horizontal optical waveguide and disposed vertically to the at least one optical image dielectric layer; and A semiconductor package characterized by including a second via optical waveguide disposed on the other side of the horizontal optical waveguide in communication with the horizontal optical waveguide and disposed vertically to the at least one optical imaging dielectric layer.
  2. In claim 1, the first via optical waveguide and the second via optical waveguide are vertical cavities penetrating the upper and lower portions of the at least one optical imaging dielectric layer, and A semiconductor package characterized in that the horizontal optical waveguide is a horizontal cavity disposed in the at least one optical imaging dielectric layer.
  3. In claim 1, a lower metal layer is further disposed in contact with the lower portions of the first via optical waveguide, the horizontal optical waveguide, and the second via optical waveguide, and A semiconductor package characterized by having a lower non-reflective layer further disposed between the lower metal layer and the base layer.
  4. A semiconductor package according to claim 1, characterized in that an upper metal layer is further disposed on the optical image dielectric layer, and an upper non-reflective layer is further disposed on the upper metal layer.
  5. A semiconductor package according to claim 1, wherein the first via optical waveguide and the second via optical waveguide each have one side having a single elliptical structure or a double elliptical structure in a vertical cross-section.
  6. Optical printed circuit board; and The integrated circuit element mounted on the above-mentioned optical printed circuit board, wherein The above optical printed circuit board is, Base layer; A lower optical image dielectric layer disposed on the base layer above; An upper optical image dielectric layer disposed on the lower optical image dielectric layer above; A horizontal optical waveguide extending horizontally and disposed within the lower optical image dielectric layer; A first via optical waveguide disposed on one side of the horizontal optical waveguide in communication with the horizontal optical waveguide and disposed in a vertical direction to the lower optical image dielectric layer and the upper optical image dielectric layer; and A semiconductor package characterized by including a second via optical waveguide disposed on the other side of the horizontal optical waveguide in communication with the horizontal optical waveguide and disposed perpendicularly to the lower optical image dielectric layer and the upper optical image dielectric layer.
  7. In claim 6, a lower metal layer is further disposed in contact with the lower portions of the first via optical waveguide, the horizontal optical waveguide, and the second via optical waveguide, and A lower non-reflective layer is further disposed between the lower metal layer and the base layer, and An upper metal layer is further disposed on the lower optical image dielectric layer, and A semiconductor package characterized by having an upper non-reflective layer further disposed on the upper optical image dielectric layer.
  8. Optical printed circuit board; and The integrated circuit element mounted on the above-mentioned optical printed circuit board, wherein The above optical printed circuit board is, Base layer; A base optical waveguide arranged to extend in the horizontal and vertical directions within the base layer; An optical image dielectric layer disposed on the above base layer; A first via optical waveguide disposed on one side of the base optical waveguide in communication with the base optical waveguide and disposed perpendicularly to the optical image dielectric layer; and A semiconductor package characterized by including a second via optical waveguide disposed on the other side of the base optical waveguide in communication with the base optical waveguide and disposed perpendicularly to the optical image dielectric layer.
  9. In claim 8, at least one of a metal layer and a non-reflective layer is further disposed on one side wall of the base optical waveguide, and A semiconductor package characterized in that at least one of a metal layer and a non-reflective layer is further disposed on one side wall of the first via optical waveguide and the second via optical waveguide.
  10. A semiconductor package according to claim 8, characterized in that a transparent pad layer is further disposed on the first via optical waveguide and the second via optical waveguide.

Description

Semiconductor package including an optical substrate The technical concept of the present invention relates to a semiconductor package, and more specifically, to a semiconductor package including an optical printed circuit board. Printed Circuit Board (PCB) technology utilizing copper-based electrical wiring is reaching its limits due to the increasing speed and capacity of data in electronic components. Consequently, optical PCBs incorporating optical waveguides are attracting attention as a technology capable of overcoming the limitations of conventional copper-based electrical wiring. Optical PCBs require the improvement of optical transmission characteristics by reducing optical loss in the optical waveguides. FIG. 1 is a plan view illustrating a semiconductor package according to one embodiment of the technical concept of the present invention. FIGS. 2a and 2b are cross-sectional views illustrating an optical printed circuit board according to one embodiment of the technical concept of the present invention. FIGS. 3a and 3b are cross-sectional views illustrating an optical printed circuit board according to one embodiment of the technical concept of the present invention. FIG. 4 is a perspective view illustrating the optical printed circuit board shown in FIG. 3a. FIGS. 5a to 5e are cross-sectional views for explaining a method of manufacturing an optical printed circuit board as illustrated in FIGS. 2a and 2b. FIGS. 6a to 6c are cross-sectional views for explaining a method of manufacturing an optical printed circuit board as illustrated in FIGS. 3a, FIG. 3b, and FIG. 4. FIGS. 7a and 7d are cross-sectional views illustrating an optical waveguide included in an optical printed circuit board of the present invention. FIG. 8 is a cross-sectional view illustrating an optical printed circuit board according to one embodiment of the technical concept of the present invention. FIGS. 9A and 9B are cross-sectional views illustrating an optical printed circuit board according to one embodiment of the technical concept of the present invention. FIGS. 10a and FIGS. 10b are cross-sectional views illustrating an optical printed circuit board according to one embodiment of the technical concept of the present invention. FIGS. 11a and FIGS. 11b are cross-sectional views illustrating an optical printed circuit board according to one embodiment of the technical concept of the present invention. FIGS. 12a to 12d are cross-sectional views for explaining a method of manufacturing an optical printed circuit board illustrated in FIG. 9. FIG. 13 is a diagram illustrating the optical characteristics of an optical image dielectric layer used in an optical printed circuit board according to one embodiment of the technical concept of the present invention and a comparative dielectric layer of a comparative example. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The following embodiments of the present invention may be implemented as only one, and may also be implemented by combining one or more of the following embodiments. Accordingly, the technical concept of the present invention is not to be interpreted as being limited to a single embodiment. In this specification, the singular form of the components may include the plural form unless the context clearly indicates otherwise. In this specification, the drawings are illustrated in an exaggerated manner to more clearly explain the invention. FIG. 1 is a plan view illustrating a semiconductor package according to one embodiment of the technical concept of the present invention. Specifically, the semiconductor package (PK) of the present invention may include a plurality of integrated circuit elements (12, 14) mounted on an optical printed circuit board (sb). The semiconductor package (PK) may be referred to as an optical integrated circuit package. The optical printed circuit board (sb) may be referred to as an optical substrate or an optical integrated circuit board. The integrated circuit elements (12, 14) may further include an optical element (12) and an electric element (14). The optical element (12) may include a photoelectric element (or photoelectric conversion element). The photoelectric element may include a photodetector (PD). The optical element (12) may include an electro-optical element (or electro-optic conversion element). The electro-optical element may include a laser diode (LD). The optical element (12) may include both an electro-optical element and an electro-optical element. The optical element (12) may include an optical input/output section and an electrical connection section. The optical input/output section may be optically connected to an optical waveguide formed on an optical printed circuit board (sb). The optical waveguide may be a path through which light (or an optical signal) travels. The electrical connection section may be electrically connected to a connection