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KR-20260063670-A - HIGH EFFICIENCY FLEXIBLE NEURAL PROBE STRUCTURE

KR20260063670AKR 20260063670 AKR20260063670 AKR 20260063670AKR-20260063670-A

Abstract

The present invention relates to a neural probe structure, and more specifically, to a flexible neural probe structure having a laminated structure based on a flexible printed circuit board (FPCB).

Inventors

  • 신효근

Assignees

  • 경북대학교 산학협력단

Dates

Publication Date
20260507
Application Date
20241030

Claims (6)

  1. Flexible substrate; A patterned wiring layer laminated on the flexible substrate; Tin (Sn) electrodes laminated on the wiring layer above; and A flexible substrate and an insulating layer formed on the wiring layer, comprising Neural probe structure.
  2. In paragraph 1, The above flexible substrate is polyimide, Neural probe structure.
  3. In paragraph 1, The thickness of the wiring layer is greater than the thickness of the flexible substrate. Neural probe structure.
  4. In paragraph 1, The above wiring layer is copper (Cu), Neural probe structure.
  5. In paragraph 1, The above insulating layer is a PSR (Photo Solder Resist) layer, Neural probe structure.
  6. In paragraph 1, The thickness of the insulation layer is greater than the thickness of the wiring layer. Neural probe structure.

Description

High Efficiency Flexible Neural Probe Structure The present invention relates to a neural probe structure, and more specifically, to a flexible neural probe structure having a laminated structure based on a flexible printed circuit board (FPCB). With the advancement of neuroscience research and brain-computer interface (BCI) technology, the demand for neural signal measurement and stimulation devices is continuously increasing. In particular, neural probes have established themselves as essential equipment in electrophysiological experiments and small animal model studies. The global neural probe market is growing rapidly in the research and medical device sectors and is expected to reach approximately $13 billion by 2027. FIG. 1 illustrates a configuration diagram of a neural probe structure according to one embodiment of the present invention. FIG. 2 illustrates a manufacturing process diagram of a neural probe structure according to one embodiment of the present invention. FIG. 3 illustrates an electrode structure and an overall film plating photographic image using a ball electrolytic plating method of a neural probe structure according to one embodiment of the present invention. Figure 4 illustrates a conventional Black Pt plating method. FIG. 5 illustrates the structure of a neural probe structure according to one embodiment of the present invention. Hereinafter, embodiments of the present invention are described in detail so that those skilled in the art can easily implement the invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Referring to FIG. 1, a neural probe structure (100) according to one embodiment of the present invention comprises a flexible substrate (110); a patterned wiring layer (120) laminated on the flexible substrate (110); a tin (Sn) electrode (130) laminated on the wiring layer (120); and an insulating layer (140) formed in an area where the electrode (130) is not formed. The flexible substrate (110) provides a space in which a wiring layer (120) and an insulating layer (140) can be formed as a base substrate. The flexible substrate (110) may have a predetermined thickness (T1) and may be a substrate of a flexible material that does not cause damage to the skin or cells of an object, thereby providing a flexible function to the nerve probe structure (100). As an example, the flexible substrate (110) may be polyimide. The wiring layer (120) is intended to be coupled with an external interface to the electrode (130) and may be appropriately patterned according to the arrangement, structure, and shape of the electrode (130). The wiring layer (120) may be composed of an electrically conductive material, and as an example, the wiring layer (120) may be copper (Cu). The wiring layer (120) has a predetermined thickness (T2), which may be greater than the thickness (T1) of the flexible substrate (110). A tin (Sn) electrode (130) is for obtaining an electrical signal (hereinafter referred to as a 'nerve signal') from a target's nerve, and may be formed by electroplating of the tin (Sn) electrode (130). Through this, a nerve probe structure (100) can be provided that can be mass-produced through an automated manufacturing process and that performance can be consistently maintained. The tin (Sn) electrode (130) may have a protruding electrode structure, and more specifically, may have a shape that protrudes relative to the upper plane of the insulating layer (140). Through this, signal sensitivity can be maximized by minimizing the distance between the nerve cell and the electrode, and the signal quality is superior to that of conventional embedded electrodes, and accurate nerve signal measurement is possible. The insulating layer (140) may allow the neural detection structure (100) to measure biosignals only through the electrode (130) when inserted into the body, and may protect (insulate) the flexible substrate (110) other than the electrode (130) and the wiring layer (120) from the external environment. The insulating layer (140) may be a PSR layer composed of PSR ink, and by including the PSR layer, the substrate (110) and the wiring layer (120) can be bonded or fixed without an adhesive layer, so the overall thickness of the final neural probe structure (100) can be formed thinly. The above PSR ink may comprise a polyfunctional monomer, an epoxy resin, and an epoxy curing accelerator, wherein the polyfunctional monomer may be a dimer or a trimer, the epoxy resin may be of the epoxy phenol novolak (EPN) or bisphenol-A (BPA) type, and the epoxy curing accelerator may be an amine or an acid anhydride. The insulating layer (140) has a predetermined thickness (T3), which may be larger than the thickness (T2) of the wiring layer (120) and may be larger than the total thickness (T1) of the flexible substrate (110) and the thickness (T2) of the wiring layer (120). The present invention will be explained i