KR-20260063682-A - A Bonding Apparatus with a Thermo-Compression Head and a Laser Compression Head and a Bonding Method Using the Same

KR20260063682AKR 20260063682 AKR20260063682 AKR 20260063682AKR-20260063682-A

Abstract

The present invention relates to a bonding device having a thermal compression head and a laser compression head, and a bonding method using the same. The bonding device having a thermal compression head and a laser compression head includes: a thermal compression head (11) that picks up a die, transfers it to a substrate located on a work stage (14), and performs bonding by a thermal compression method; and a laser compression head (12) that bonds the die, which is transferred to and located on the substrate by the thermal compression head (11), to the substrate by irradiating it with a laser.

Inventors

황영수
박수홍
박창용

Assignees

인펠 주식회사

Dates

Publication Date: 20260507
Application Date: 20241031

Claims (8)

A heat compression head (11) that picks up a die, transfers it to a substrate located on a work stage (14), and performs bonding by a heat compression method; and A bonding device having a thermal compression head and a laser compression head, comprising a laser compression head (12) that irradiates a die positioned on a substrate by means of a thermal compression head (11) to bond it to the substrate.
In claim 1, the laser compression head (12) comprises a laser oscillator that emits a laser beam (LB) during the bonding process and a pressure block that applies pressure to the die, forming a bonding device having a thermal compression head and a laser compression head.
A bonding device having a thermal compression head and a laser compression head according to claim 2, wherein the pressure block guides the laser beam (LB) to the die such that the transmittance of the laser beam (LB) is 90% or more.
In a method for bonding a die to a substrate, Step (P56) in which the die is transported by the first head and placed at a predetermined position; Step (C56) of moving to a die where a pressurizing means is placed and applying pressure to fix it; and A method for bonding a die to a substrate, comprising the step (L53) of irradiating a laser from a second head to bond the die to a substrate.
A method for bonding a substrate of a die according to claim 4, wherein the first head is a head capable of thermal compression bonding.
A method for bonding a die to a substrate according to claim 4, characterized in that one or more dies are simultaneously bonded to a substrate by a second head.
A method for bonding a die to a substrate according to claim 4, characterized in that the transmittance of the laser irradiated onto the die by the second head is 90%.
A method for bonding a die to a substrate according to claim 6, characterized in that when two or more dies simultaneously become substrates, the dies become different heterogeneous dies.

Description

A Bonding Apparatus with a Thermo-Compression Head and a Laser Compression Head and a Bonding Method Using the Same The present invention relates to a bonding device having a thermal compression head and a laser compression head and a bonding method using the same. Specifically, it relates to a bonding device having a thermal compression head and a laser compression head and a bonding method using the same, which is capable of bonding a die to a substrate by a thermal compression method or picking up and positioning the die by a thermal compression head and then proceeding with the bonding process by a laser compression head. A die or chip picked up from a wafer can be bonded to a substrate by a thermal compression method or a laser compression method, and the equipment for the thermal compression method and the laser compression method is manufactured independently. A thermo-compression apparatus for applying the thermal compression method includes a pickup means for picking up a die; a heating means for generating heat to make the bumps bondable; and a pressurizing means for applying pressure to the heated die to bond. In addition, in a laser compression apparatus for applying the laser compression method, the heating means may be a laser oscillator. Regarding the thermal compression of a die, Patent Publication No. 10-2024-0149362 discloses a thermo-compression bonding apparatus for thermally compressing and bonding a semiconductor chip onto a substrate. Additionally, Patent Publication No. 10-2013-0117682 discloses the attachment of semiconductor chips onto substrates, particularly by a method of solder interconnects. In a laser compression device, the pressurizing means can be made of a light-transmitting material, for example, quartz. The pressurizing means may have a pickup function, but if the pressurizing means is made with a structure suitable for die pickup, it has the disadvantage that laser transmittance may decrease. Specifically, as the amount of quartz cross-section processing increases, laser transmittance drops significantly; therefore, heating the bump becomes more advantageous as the amount of cross-section processing decreases. Furthermore, in the case of quartz, due to processing issues, it is impossible to machine suction holes with a diameter of less than 1 mm, and hole polishing becomes impossible. Although a groove with a length of 1 mm is machined around the suction hole for die pickup, it has the disadvantage that infrared (IR) transmittance is significantly lower in the unpolished parts of the quartz. Consequently, it has the disadvantage that the solder beneath the hole and groove may not melt. Figure 6 shows the transmittance of the crystal to infrared light. It can be seen that the transmittance for IR 980 to 1080 nm is approximately 92.5%, and while it can be increased to approximately 96% by single-sided IR coating, the transmittance drops to 70% or less in the unpolished state. The graph on the left in Figure 6 shows the transmittance according to wavelength for a standard tube, a synthetic tube, a plate, and an opaque material. The graph on the right in Figure 6 shows the degree of laser transmission of the lower surface of the crystal measured by a beam profiler, and it can be seen that the transmittance is significantly reduced in the central hole and groove processing areas. Therefore, it is advantageous for the pressurizing means for the laser compression device not to have a hole or groove for picking up the die processed. Accordingly, it is necessary to create a structure capable of laser thermal compression where the pickup and placement of the die are performed by separate means, but the prior art does not disclose this. The present invention aims to solve the problems of the prior art and has the following objectives. FIGS. 1 and FIGS. 2 illustrate embodiments of a bonding device having a thermal compression head and a laser compression head according to the present invention. FIG. 3 illustrates an example of a structure that is picked up and placed and a structure that is laser pressed by a bonding device according to the present invention. FIG. 4 illustrates an example of a process in which a thermal compression process is carried out by a bonding device having a thermal compression head and a laser compression head according to the present invention. FIG. 5 illustrates an example of a process in which a laser compression process is carried out by a bonding device having a thermal compression head and a laser compression head according to the present invention. Figure 6 shows a graph and transmission image representing the transmittance according to the wavelength of the laser when holes and grooves for adsorption of the die are formed in a quartz corresponding to the laser-transmitting material. The present invention is described in detail below with reference to embodiments shown in the attached drawings, but the embodiments are for a clear understanding of t