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KR-20260063699-A - PRINTED CIRCUIT BOARD

KR20260063699AKR 20260063699 AKR20260063699 AKR 20260063699AKR-20260063699-A

Abstract

The present disclosure relates to a printed circuit board comprising: a glass layer; a metal via penetrating between the upper and lower surfaces of the glass layer; a first metal pad disposed on the upper surface of the glass layer and connected to the upper side of the metal via; and a second metal pad disposed on the lower surface of the glass layer and connected to the lower side of the metal via; wherein, with respect to the centerline between the upper and lower surfaces of the glass layer, the first and second metal pads have an asymmetric structure relative to each other.

Inventors

  • 김인건

Assignees

  • 삼성전기주식회사

Dates

Publication Date
20260507
Application Date
20241031

Claims (10)

  1. Glass layer; A metal via penetrating between the upper and lower surfaces of the glass layer; A first metal pad disposed on the upper surface of the glass layer and connected to the upper side of the metal via; and A second metal pad disposed on the lower surface of the glass layer and connected to the lower side of the metal via; comprising, Based on the centerline between the upper and lower surfaces of the glass layer, the first and second metal pads have an asymmetrical structure relative to each other. Printed circuit board.
  2. In Article 1, The above first metal pad has substantially the same width on its upper surface and lower surface, and The above second metal pad has a width on the upper surface and a width on the lower surface that are different. Printed circuit board.
  3. In Article 1, The second metal pad above is tapered such that the width of the upper surface is wider than the width of the lower surface. Printed circuit board.
  4. In Article 1, The second metal pad above is tapered so that the width of the lower surface is wider than the width of the upper surface. Printed circuit board.
  5. In Article 1, A first circuit pattern disposed on the upper surface of the glass layer; and A second circuit pattern disposed on the lower surface of the glass layer; further comprising, The above first and second circuit patterns have different structures, Printed circuit board.
  6. In Article 1, The metal via and the first and second metal pads are integrated without boundaries with each other. Printed circuit board.
  7. In Article 1, Further comprising an insulating layer disposed on the lower surface of the glass layer and covering the side of the second metal pad; The above insulating layer comprises a photosensitive insulating material, Printed circuit board.
  8. In Article 7, A first insulating body disposed on the upper surface of the glass layer and covering at least a portion of each of the upper surface and side of the first metal pad; A plurality of first wiring layers, each disposed on the upper surface of the first insulating body or within the first insulating body; A plurality of first via layers, each disposed within the first insulating body and each connected to one or more of the plurality of first wiring layers; A second insulating body disposed on the lower surface of the insulating layer and covering at least a portion of the lower surface of the second metal pad; A second wiring layer disposed on the lower surface of the second insulating body; A second via layer disposed within the second insulating body and connected to the second wiring layer; A first resist layer disposed on the upper surface of the first insulating body and covering at least a portion of the first wiring layer disposed at the uppermost of the plurality of first wiring layers; and A second resist layer disposed on the lower surface of the second insulating body and covering at least a portion of the second wiring layer; further comprising Printed circuit board.
  9. In Article 8, The first insulating body is thicker than the second insulating body, and The plurality of first wiring layers has more layers than the second wiring layers, and The plurality of first via layers has more layers than the second via layers, Printed circuit board.
  10. Glass layer; A metal via penetrating between the upper and lower surfaces of the glass layer; A first metal pad disposed on the upper surface of the glass layer and connected to the upper side of the metal via; A second metal pad disposed on the lower surface of the glass layer and connected to the lower side of the metal via; and An insulating layer disposed on the lower surface of the glass layer and covering the side of the second metal pad; comprising, The above insulating layer comprises a photosensitive insulating material, Printed circuit board.

Description

Printed Circuit Board The present disclosure relates to a printed circuit board. In response to the high performance and miniaturization strategies of semiconductors, the level of miniaturization and high density required for printed circuit boards is increasing, and high multilayer and large bodies are required to manufacture high-end products such as server boards. Meanwhile, as the number of layers in a board increases and the size of the body increases, it may become vulnerable to warpage. To solve this problem, using a glass layer as a core layer is being considered. However, in the case of a glass layer, there is a possibility of breakage due to bending stress. Therefore, when a glass layer is applied to an asymmetric structure such as an interposer, or/or when a thin glass layer is used, there are limitations in directly forming microcircuits, etc., on the glass layer due to problems such as breakage. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. Figure 3 is a schematic process diagram showing an example of manufacturing a printed circuit board of Figure 2. FIG. 4 is a schematic cross-sectional view of another example of a printed circuit board. The present disclosure will be described below with reference to the attached drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. Referring to the drawing, the electronic device (1000) accommodates a main board (1010). Chip-related components (1020), network-related components (1030), and other components (1040), etc., are physically and/or electrically connected to the main board (1010). These are also combined with other electronic components described later to form various signal lines (1090). The chip-related components (1020) include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs), but are not limited thereto, and other types of chip-related electronic components may also be included. Furthermore, it is obvious that these chip-related components (1020) may be combined with each other. The chip-related components (1020) may also be in the form of a package containing the aforementioned chips or electronic components. Network-related components (1030) include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, but are not limited thereto, and any of a number of other wireless or wired standards or protocols may be included. In addition, it goes without saying that network-related components (1030) can be combined with chip-related components (1020). Other components (1040) include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include passive components in the form of chip components used for various other purposes. In addition, it goes without saying that other components (1040) may be combined with chip-related components (1020) and/or network-related components (1030). Depending on the type of electronic device (1000), the electronic device (1000) may include other electronic components that may or may not be physically and/or electrically connected to the main board (1010). Examples of other electronic components include a camera module (1050), an antenna module (1060), a display (1070), a battery (1080), etc. However, it is not limited thereto, and may include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition to these, other electronic components used for various purposes may be included depending on the type of electronic device (1000). The electronic device (1000) may be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, server, etc. However, it is not limited to these, and it may be any other electronic device that processes data in addition to these. FIG. 2 is a schematic cross-sectional view of a