KR-20260063737-A - Testing Method of adhesive strength for wheels provided to semiconductor manufacturing lines

KR20260063737AKR 20260063737 AKR20260063737 AKR 20260063737AKR-20260063737-A

Abstract

A method for testing the adhesive strength of a wheel provided in a semiconductor manufacturing line according to the present invention, for evaluating the adhesive strength between a first member constituting a wheel of a conveying device and a second member bonded to the first member by an adhesive portion, comprises the steps of: providing a specimen in which a first specimen member made of a first material forming the first member and a second specimen member made of a second material forming the second member are bonded by the adhesive portion; fixing each of the first specimen member and the second specimen member to a tensile evaluation device; and measuring the tensile strength by tensile testing the first specimen member and the second specimen member with the tensile evaluation device.

Inventors

박지윤
김종호
조환진

Assignees

세메스 주식회사

Dates

Publication Date: 20260507
Application Date: 20241031

Claims (10)

A method for testing the adhesive strength of a wheel to evaluate the adhesive strength between a first member constituting the wheel of a conveying device and a second member bonded to the first member by an adhesive portion, A step of providing a specimen in which a first specimen member made of a first material forming the first member and a second specimen member made of a second material forming the second member are bonded to the adhesive portion; A step of fixing each of the first specimen member and the second specimen member to a tensile evaluation device; and A step comprising measuring the tensile strength by tensile testing the first specimen member and the second specimen member using the above tensile evaluation device. A method for testing the adhesive strength of a wheel supplied to a semiconductor manufacturing line.
In paragraph 1, The step of providing the above specimen is, A method comprising the step of preparing a first specimen member having the same shape as the first member. A method for testing the adhesive strength of a wheel supplied to a semiconductor manufacturing line.
In paragraph 1, The step of measuring the tensile strength above is, A tensile speed formed to be 20 mm/min to 30 mm/min, A method for testing the adhesive strength of a wheel supplied to a semiconductor manufacturing line.
In paragraph 1, After the step of measuring the above tensile strength, a first graph including an adhesion loss test section is set, The first graph above has the horizontal axis as the perimeter length to which the first specimen member and the second specimen member are attached, and the vertical axis as the tensile value according to the tensile strength measurement value. The starting point of the above adhesive strength loss test section is set as the point where the change in slope from the origin of the above first graph begins, and The last point of the above adhesive strength loss test section is set to a point within a preset range from the above starting point, The above preset range is formed to be smaller than the diameter of the specimen, A method for testing the adhesive strength of a wheel supplied to a semiconductor manufacturing line.
In paragraph 1, The step of providing the above specimen is, A method comprising the step of preparing a second specimen member having the same shape as the second member, A method for testing the adhesive strength of a wheel supplied to a semiconductor manufacturing line.
In paragraph 1, A method for testing the adhesive strength of a wheel provided to a semiconductor manufacturing line, wherein the above-mentioned adhesive portion is provided as an adhesive.
In paragraph 1, The step of measuring tensile strength by tensile testing the first specimen member and the second specimen member is: A method for testing the adhesive strength of a wheel provided in a semiconductor manufacturing line, wherein at least one of the first specimen member and the second specimen member is pulled in a direction separated from each other in the tensile evaluation device, such that at least one of the first gripping part that grips the first specimen member and the second gripping part that grips the second specimen member are pulled relatively.
In paragraph 1, The above first material is provided as a metal material, and A method for testing the adhesive strength of a wheel provided to a semiconductor manufacturing line, wherein the second material is made of urethane material.
In paragraph 1, The first member above forms the center of the wheel, and A method for testing the adhesive strength of a wheel provided in a semiconductor manufacturing line, wherein the second member above forms an outer portion surrounding the wheel.
A method for testing the adhesive strength of a wheel to evaluate the adhesive strength between a first member forming the center of a wheel of a conveying device and a second member surrounding the first member and bonded to the first member with an adhesive, A step of providing a specimen in which a first specimen member made of a first material forming the first member and a second specimen member made of a second material forming the second member are bonded together with the adhesive; A step of fixing each of the first specimen member and the second specimen member to a tensile evaluation device; and The method includes the step of measuring tensile strength by applying tension to the first specimen member and the second specimen member using the above-described tensile evaluation device, wherein the tensile speed is formed to be 20 mm/min to 30 mm/min. The step of providing the above specimen is, A step of preparing a first specimen member having the same shape as the first member; and The method includes the step of preparing the second specimen member having the same shape as the second member, and The step of measuring tensile strength by tensile testing the first specimen member and the second specimen member is: The above-mentioned tensile evaluation device includes a first gripping part that grips the first specimen member and a second gripping part that grips the second specimen member, wherein the two parts are moved in a direction that is spaced apart from each other. A method for testing the adhesive strength of a wheel supplied to a semiconductor manufacturing line.

Description

Testing Method of adhesive strength for wheels provided to semiconductor manufacturing lines The present invention relates to a method for testing the adhesive strength of a wheel provided to a semiconductor manufacturing line. A semiconductor manufacturing process is a process for manufacturing semiconductor devices on a substrate (wafer), and may include, for example, photolithography, deposition, etching, ion implantation, cleaning, and packaging. A manufacturing plant for manufacturing semiconductor devices may have one or more layers configured as cleanrooms, and manufacturing equipment for performing semiconductor manufacturing processes may be placed on each layer. A final processed substrate can be completed by repeatedly performing multiple manufacturing processes on a substrate (wafer) in a manufacturing facility. When a manufacturing process is completed in a specific semiconductor manufacturing facility, the substrate can be returned to the facility for the next manufacturing process. Here, the substrate can be returned while stored in a container (front opening unified pod, FOUP) capable of accommodating multiple substrates. The container containing the substrate can be returned by an overhead hoist transport (OHT). The conveying device is provided with a bogie equipped with wheels to travel along a rail, wherein the wheel is provided with a metal core for strength and/or connection with other components, and a urethane outer rim is provided around the core to prevent the metal from directly contacting the rail. In other words, wheels are provided with two components of different materials attached, but since the two components delaminate during driving, a wheel adhesion strength test is required to improve the delamination problem. Figure 1 is a drawing illustrating a conveying device provided to a semiconductor manufacturing line. FIG. 2 is a drawing illustrating a specimen for testing the adhesive strength of a wheel provided to a semiconductor manufacturing line according to some embodiments of the present invention. FIG. 3 is a drawing illustrating a state in which a wheel provided to a semiconductor manufacturing line according to some embodiment of the present invention is fixed to a tensile evaluation device and its tensile strength is tested. FIG. 4 is a drawing illustrating a first graph to explain a method for testing the adhesive strength of a wheel provided in a semiconductor manufacturing line according to some embodiments of the present invention. FIG. 5 is a diagram illustrating an adhesion loss test section to explain an adhesion strength test method for a wheel provided to a semiconductor manufacturing line in some embodiments of the present invention. FIG. 6 is a flowchart illustrating a method for testing the adhesive strength of a wheel provided in a semiconductor manufacturing line according to some embodiments of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the attached drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components. The terms used herein are for describing the embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used herein, "comprises" and/or "comprising" do not exclude the presence or addition of one or more other components, steps, actions, and/or elements to the mentioned components, steps, actions, and/or elements. Figure 1 is a drawing illustrating a conveying device provided to a semiconductor manufacturing line. Referring to FIG. 1, the conveying device (10) provided to the semiconductor manufacturing line may be provided with a trolley module (11) and a wheel (12). The trolley module (11) may be provided to transport goods while traveling along a travel path (e.g., a pair of rails) installed on the ceiling of a semiconductor manufacturing plant. The trolley module (11) may be provided with various configurations for transporting goods. For example, the trolley module (11) may be provided with a trolley, a housing, a gripping module, and a lifting module. The trolley may be provided with various devices for driving and performing tasks, such as a motor and/or control unit, and may have wheels (12) installed. A housing for loading and un