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KR-20260063936-A - PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

KR20260063936AKR 20260063936 AKR20260063936 AKR 20260063936AKR-20260063936-A

Abstract

A package substrate may comprise: a first insulating film including first and second surfaces facing each other in a vertical direction; a first wiring disposed on the first surface of the first insulating film; first conductive films disposed on each side of the first wiring on the first surface of the first insulating film; a pad comprising a second conductive film that contacts the upper surface of the first conductive films, is spaced vertically apart from the upper surface of the first wiring, and overlaps at least a portion of the first wiring in the vertical direction; and a first protective film that contacts the first surface of the first insulating film to cover the sidewall of the pad and includes a solder resist.

Inventors

  • 이재진

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20241031

Claims (10)

  1. A first insulating film comprising first and second surfaces facing each other in a vertical direction; A first wiring disposed on the first surface of the first insulating film; First conductive films respectively disposed on both sides of the first wiring on the first surface of the first insulating film; and A pad comprising a second conductive film that contacts the upper surface of the first conductive films, is spaced apart in the vertical direction from the upper surface of the first wiring, and overlaps in the vertical direction with at least a portion of the first wiring; and A package substrate having a first protective film comprising a solder resist, which contacts the first surface of the first insulating film to cover the sidewall of the pad.
  2. In claim 1, each of the first conductive films is a package substrate having an arcuate shape when viewed from above.
  3. In claim 1, each of the first conductive films is a package substrate extending in a first direction parallel to the first plane of the first insulating film.
  4. In claim 3, the second conductive film is a package substrate extended in the first direction.
  5. In claim 3, the first wiring extends in the first direction and is formed in a plurality of package substrates spaced apart from each other along a second direction that is parallel to the first surface of the first insulating film and intersects the first direction.
  6. In claim 3, the first protective film covers the upper surface of the second conductive film, and includes an opening that exposes a portion of the upper surface of the second conductive film.
  7. In claim 6, the above-mentioned opening is a package substrate having a circular shape when viewed from above.
  8. A package substrate according to claim 1, further comprising a second insulating film formed on the first surface of the first insulating film and covering the upper surface and sidewall of the first wiring.
  9. A first insulating film comprising first and second surfaces facing each other in a vertical direction; A wiring disposed on the first surface of the first insulating film and extending in a first direction parallel to the first surface; First conductive films respectively disposed on both sides of the wiring in a second direction parallel to the first surface of the first insulating film and intersecting the first direction, and each extending in the first direction on the first surface of the first insulating film; and A pad comprising a second conductive film that extends in the first direction while in contact with the upper surface of the first conductive films and overlaps the wiring in the vertical direction; and A package substrate having a protective film comprising a solder resist, the protective film formed on the first surface of the first insulating film and in contact with the sidewall and upper surface of the pad, and including an opening that exposes a portion of the upper surface.
  10. A first insulating film comprising first and second surfaces facing each other in a vertical direction; A first wiring disposed below the first surface of the first insulating film; First conductive films respectively disposed on both sides of the first wiring below the first surface of the first insulating film; and A pad comprising a second conductive film that contacts the lower surface of the first conductive films, is spaced vertically apart from the lower surface of the first wiring, and overlaps vertically with at least a portion of the first wiring; A first protective film comprising a solder resist, which contacts the first surface of the first insulating film to cover the sidewall of the pad; A second insulating film formed on the second surface of the first insulating film; A second wiring formed within the second insulating film; and A package substrate having a second protective film formed on the second insulating film, covering the upper surface of the second wiring, and including an opening that exposes a portion of the upper surface of the second wiring; A semiconductor chip disposed on the above package substrate; A first conductive connection member in contact with a portion of the upper surface of the exposed second wiring and the lower surface of the semiconductor chip; and A semiconductor package comprising a second conductive connection member in contact with the lower surface of the pad.

Description

Package substrate and semiconductor package including the same The present invention relates to a package substrate and a semiconductor package including the same. A semiconductor package includes a package substrate and a semiconductor chip disposed thereon, and the package substrate includes wirings and pads formed in a plurality of layers. Accordingly, a method for effectively disposing of the wirings and pads is required. FIGS. 1 and 2 are a plan view and a cross-sectional view, respectively, for illustrating a package substrate according to exemplary embodiments. FIGS. 3 to 13 are plan and cross-sectional views illustrating a method for manufacturing a package substrate according to exemplary embodiments. FIG. 14 is a plan view illustrating a package substrate according to exemplary embodiments. FIGS. 15 to 19 are plan views illustrating a method for manufacturing a package substrate according to exemplary embodiments. FIGS. 20 to 22 are plan views illustrating package substrates according to exemplary embodiments. FIG. 23 is a cross-sectional view illustrating a package substrate according to exemplary embodiments. FIGS. 24 and 25 are plan views illustrating package substrates according to exemplary embodiments, respectively. FIG. 26 is a cross-sectional view illustrating a semiconductor package according to exemplary embodiments. Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings. Where materials, layers (films), regions, pads, electrodes, patterns, structures, or processes are referred to as "first," "second," and/or "third" in this specification, it is not intended to limit these components but merely to distinguish each material, layer (film), region, electrode, pad, pattern, structure, and process. Accordingly, "first," "second," and/or "third" may be used selectively or interchangeably for each material, layer (film), region, electrode, pad, pattern, structure, and process. In the following, among the horizontal directions parallel to the upper surface of the package substrate, two directions that are orthogonal to each other are referred to as the first and second directions (D1, D2), respectively, and the direction perpendicular to the upper surface of the package substrate is referred to as the third direction (D3). However, each of the first to third directions (D1, D2, D3) may include not only the directions shown in the drawings but also directions opposite thereto. FIGS. 1 and 2 are a plan view and a cross-sectional view, respectively, for illustrating a package substrate according to exemplary embodiments. FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1. Referring to FIGS. 1 and 2, the package substrate may include a first insulating film (100) having first and second surfaces (112, 114) formed opposite each other in a third direction (D3), second to fourth insulating films (20, 40, 60) sequentially stacked along the third direction (D3) below the first surface (112) of the first insulating film (100), first and second vias (10, 50) and first to sixth wirings (32, 34, 36, 72, 74, 76) formed within the first to fourth insulating films (100, 20, 40, 60), and a first pad (148) and a second conductive film (144) disposed on the second surface (114) of the first insulating film (100). Additionally, the package substrate may further include a first protective layer (80) formed below the fourth insulating layer (60), and a fifth insulating layer (160) and a second protective layer (180) formed on the first insulating layer (100). Each of the first to fourth insulating films (100, 20, 40, 60) may include an insulating material such as, for example, polypropylene glycol (PPG), Ajinomto Build-up Film (ABF), etc., and may be referred to as a core. The first and second vias (10, 50) can penetrate the first and third insulating films (100, 40), respectively. Each of the first to third wires (32, 34, 36) can penetrate the second insulating film (20), and each of the fourth to sixth wires (72, 74, 76) can penetrate the fourth insulating film (60). At this time, the first via (10) can contact the lower surface of the first pad (148) and the upper surface of the first wire (32), and the second via (50) can contact the lower surface of the first wire (32) and the upper surface of the fourth wire (72). In one embodiment, the first to third wires (32, 34, 36) may each perform the roles of signal wiring, ground wiring, and power wiring, and the fourth to sixth wires (72, 74, 76) may each perform the roles of signal wiring, ground wiring, and high-speed signal wiring, but the concept of the present invention is not limited thereto. For example, the first to third wires (32, 34, 36) may each perform the roles of ground wiring, signal wiring, and power wiring. That is, the first to sixth wires (32, 34, 36, 72, 74, 76) and the first and second vias (10, 50) formed within the first to fourth insulating films (100, 2