KR-20260064120-A - Improved Antenna Module

Abstract

The present invention discloses an improved antenna module. The improved antenna module according to the present invention comprises an antenna substrate including an antenna, a package substrate including a signal transmission line coupled to a radio frequency integrated circuit chip and transmitting a signal of the radio frequency integrated circuit chip, and an interconnection member positioned between the antenna substrate and the package substrate to connect the antenna substrate and the package substrate, and having a slot formed therein that corresponds to at least a portion of a passage through which a radio frequency signal transmitted between the signal transmission line and the antenna passes through the package substrate.

Inventors

• 전진완

Assignees

• 주식회사 넥스웨이브

Dates

Publication Date

20260507

Application Date

20241031

Claims (18)

1. Antenna substrate including an antenna; A package substrate including a signal transmission line that is coupled to a radio frequency integrated circuit chip and transmits a signal of the radio frequency integrated circuit chip; and An improved antenna module comprising an interconnection member positioned between the antenna substrate and the package substrate to connect the antenna substrate and the package substrate, and having a slot formed therein that corresponds to at least a portion of the passage through which a radio frequency signal transmitted between the signal transmission line and the antenna passes through the package substrate.
2. In Article 1, An improved antenna module comprising a plurality of cavity shielding vias surrounding the cavity of the package substrate, wherein the package substrate is positioned to correspond to a passage passing through the package substrate and a cavity is formed to accommodate the slot.
3. In Article 1, An improved antenna module in which the above slot is provided corresponding to the cavity specifications of the package substrate or corresponding to the specifications of a passage passing through the package substrate opposite to the package substrate.
4. In Paragraph 3, An improved antenna module in which the cross-sectional area, length, and material of the slot corresponding to the specifications of the passage passing through the package substrate are determined in correspondence with the wavelength of the radio frequency signal.
5. In Article 1, The above package substrate is an improved antenna module comprising a second shielding portion disposed at the edge of the slot.
6. In Article 5, An improved antenna module characterized by the fact that a plurality of the second shielding members are arranged to surround the slot to form a second radio frequency signal transmission member in the center.
7. In Article 5, The second shielding member comprises a plurality of metal layers spaced apart from each other and a plurality of second shielding vias electrically connecting the metal layers. An improved antenna module characterized in that one of the selected metal layers among the plurality of metal layers is positioned to face the slot with the signal transmission line in between.
8. In Article 1, The antenna substrate includes a first shielding portion disposed at the edge of the slot. Improved antenna module.
9. In Article 8, An improved antenna module characterized by the fact that a plurality of the first shielding members are arranged to surround the slot, thereby forming a first radio frequency signal transmission member in the center.
10. In Article 1, The above antenna substrate includes a first coupling portion positioned between the antenna and the slot to transmit the radio frequency signal, and An improved antenna module comprising a second coupling portion that transmits the radio frequency signal, wherein the above package substrate is positioned between the above radio frequency integrated circuit chip and the above slot.
11. In Article 10, An improved antenna module characterized in that the first coupling part and the second coupling part are arranged so that their ends face each other with the slot in between.
12. In Article 1, The above interconnection member is an improved antenna module comprising a trench space formed on the lower surface facing the package substrate.
13. In Article 1, An improved antenna module characterized in that the interconnection member has an outer surface formed of a conductor and an interior formed of a heterogeneous material having a lower density than the conductor.
14. In Article 1, An improved antenna module comprising a heat dissipation means coupled to one or more sides of the antenna substrate, the package substrate, and the interconnection member.
15. In Article 1, The above interconnection member includes a first interconnection member coupled to the lower side of the antenna substrate and a second interconnection member coupled to the upper side of the package substrate. An improved antenna module characterized by having an alignment portion formed therein that aligns the first interconnect member and the second interconnect member to a position where they are connected to each other.
16. In Article 1, An improved antenna module comprising an adhesive member disposed between the lower part of the interconnection member and the upper surface of the package substrate.
17. In Article 1, The above interconnection member is an improved antenna module including a ridge-forming projection formed to protrude into the slot.
18. In Article 17, An improved antenna module characterized by having a plurality of ridge-forming protrusions formed therein, wherein the plurality of formed ridge-forming protrusions have different sizes and shapes.

Description

Improved Antenna Module The present invention relates to an improved antenna module, and more specifically, to an improved antenna module that improves wireless communication performance by connecting an antenna substrate and a package substrate with an interconnection member having a three-dimensional structure in which a slot is formed. Wireless communication data traffic is increasing dramatically, and electronic devices related to wireless communication are becoming more high-performance. As the development of related technologies—such as autonomous driving, VR/AR, IoT, telemedicine, and ultra-high-resolution video transmission—which require the rapid exchange of large amounts of data over wireless networks is accelerating, there is a demand for 5G and millimeter wave band components and related technologies to support this. To increase the data transmission capacity of wireless communication, the operating frequency and bandwidth of wireless communication components applied to wireless transceiver systems must be increased. Furthermore, as the operating frequency band increases in wireless transceiver systems, an increase in the number of antennas is required to boost the power of the transmitted and received signals and improve the signal-to-noise ratio. Therefore, in 5G wireless transceiver systems, especially in the millimeter wave band, antennas are essentially arranged in an array form consisting of a large number of antennas, and antenna modules are configured to perform beamforming functions to control the beam. An antenna module or system that performs the function of forming and controlling an electromagnetic beam typically consists of numerous antenna elements, various integrated circuit chips, their interconnects, and control lines. Such an antenna module additionally includes multilayer antenna elements, their radio frequency signal transmission structures, radio frequency integrated circuit (RFIC) chips that perform functions such as beamforming, intermediate frequency distribution circuits, local oscillators, and various circuits such as related control circuits and bias circuits. Such antenna modules or systems are essential components of wireless communication systems and require characteristics such as high output power, low signal loss degradation, performance of functions such as beamforming, high reception sensitivity, low cost, easy compatibility, and expansion. Meanwhile, in ultra-high frequency bands such as 12-18 GHz, 24 GHz, 28 GHz, 39 GHz, and 60 GHz, radio frequency (RF) signals are easily absorbed and lost during the signal transmission process, so the quality of wireless communication can rapidly degrade. Therefore, in the case of antenna modules in the ultra-high frequency band, technologies such as securing antenna gain, minimizing connection loss between the antenna and RFIC, minimizing signal interference caused by complex signal line arrangement, and securing spacing between antenna arrays (usually 0.5 times the signal wavelength) must be developed. To realize these characteristics, antenna modules in ultra-high frequency bands such as millimeter waves are configured with multiple array-type antenna arrays to increase output and perform beamforming functions, along with integrated circuit chips to implement them. Meanwhile, as the frequency used in wireless communication systems increases, the size of the antenna and the width of the transmission line in the corresponding band decrease, and the integration density of the circuits required to implement this increases. To form an antenna module by connecting a millimeter-wave band antenna array to integrated circuit chips, the antenna array and the integrated circuit chips can be located on the top layer of their substrate. However, with this method, as the number of antenna elements increases, the number of routings required to connect each antenna to the integrated circuit chips also increases. Consequently, it is very difficult to effectively configure the antenna array and arrange it to properly perform functions such as beamforming. To solve this, according to the existing Korean registered patent 1581225, a dual-sided package is used in which antenna elements are formed on the top layer of the substrate, and integrated circuit chips and BGAs for connecting them are placed on the opposite side of the substrate. In this case, a method is used in which integrated circuit chips for additional control and power supply, in addition to radio frequency integrated circuit chips that are generally routed directly to the antenna, are connected to another package substrate through ball grid arrays (BGAs). That is, a plurality of antenna arrays are configured on the top layer of the package substrate, radio frequency integrated circuit (RFIC) chips are placed in a face-up configuration on the opposite side of the package substrate, and the input/output lines of the RFIC chips are connected to each antenna element in a correspon