KR-20260064166-A - METHOD OF MANUFACTURING CAMERA MODULE

KR20260064166AKR 20260064166 AKR20260064166 AKR 20260064166AKR-20260064166-A

Abstract

The proposed invention relates to a method for manufacturing a camera module comprising a substrate assembly and an optical assembly, wherein at least a portion of a sensor pad and a wire connected to the sensor pad is coated with epoxy resin, and an optical filter is pressed onto the coated epoxy resin to manufacture the substrate assembly, thereby reducing the height of the camera module.

Inventors

전재선
백현기
유재환
신재민

Assignees

주식회사 엠씨넥스

Dates

Publication Date: 20260507
Application Date: 20241031

Claims (6)

In a method for manufacturing a camera module (S1000), A printed circuit board provision step (S100) in which a cavity (C) is formed in the center and a printed circuit board is provided with substrate pads and peripheral components mounted around it; An image sensor insertion step (S200) in which an image sensor with a sensor pad mounted thereon is inserted into a cavity of a printed circuit board; A wire bonding step (S300) in which a substrate pad and a sensor pad are bonded with a wire; An epoxy resin dispensing step (S400) in which at least a portion of the substrate pad and the wire connected to the substrate pad is coated with epoxy resin; and An optical filter compression step (S500) in which an optical filter is compressed onto an applied epoxy resin; including, Method for manufacturing a camera module.
In claim 1, the wire bonding step (S300) is: A sensor pad priority bonding step (S310) in which, after one end of the wire is bonded to the sensor pad, the other end of the wire is bonded to the substrate pad; Method for manufacturing a camera module.
In claim 2, the sensor pad priority bonding step (S310) is: A downward pressing step (S311) in which the other end of the wire is pressed downward after one end of the wire is bonded to the sensor pad; including, Method for manufacturing a camera module.
In claim 1, the camera module manufacturing method (S1000) is: A first curing step (S600) in which UV is irradiated to pre-cure the epoxy resin; including, Method for manufacturing a camera module.
In claim 4, the camera module manufacturing method (S1000) is: A secondary curing step (S700) in which heat is applied to fully cure the epoxy resin; including, Method for manufacturing a camera module.
In claim 5, the camera module manufacturing method (S1000) is: An optical assembly mounting step (S800) in which an optical assembly including a housing, a lens, and a lens barrel is mounted on a printed circuit board and an optical filter; including, Method for manufacturing a camera module.

Description

Method of manufacturing a camera module The proposed invention discloses a method technology for manufacturing a camera module. FIG. 1 shows the assembly structure of a conventional camera module. As illustrated, the conventional camera module (1000) is composed of an optical assembly (100) and a substrate assembly (200), and the optical assembly (100) and the substrate assembly (200) are connected to each other to manufacture a camera module (1000) that is mounted on an electronic device such as a mobile terminal. The optical assembly (100) may include a housing (110), a lens (120), and a lens barrel (130) that moves the lens back and forth. The substrate assembly (200) includes a PCB (210), an image sensor (220) mounted on the PCB (210), peripheral components (230) mounted on the PCB (210), a connector (240), and an FPCB (250) that electrically connects the connector (240) and the PCB (210). The lens (120) may be composed of multiple lenses and arranged. Looking at the rear of the optical assembly (100), an optical filter (140) is attached to the housing (110) by means of epoxy resin, etc. The optical filter (140) is configured as an IR cut filter and can block infrared to near-infrared rays among the light passing through the lens (120) to prevent them from being incident on the infrared to near-infrared image sensor (220). However, in accordance with the trend of slimming down electronic devices such as mobile terminals, conventional camera modules are also being slimmed down. Accordingly, the MOC process is being introduced as a new method of manufacturing camera modules by placing a substrate assembly into a mold, molding it to create an intermediate frame, attaching an optical filter to produce an intermediate assembly, and attaching an optical assembly to the intermediate assembly. U.S. Patent (US10084949) discloses the MOC process. Camera modules manufactured using this MOC (Mold On Chip) process have the advantage of being able to reduce their height, but they have the disadvantage of requiring an additional molding process and the problem of significantly increased costs due to the need to drastically replace existing manufacturing equipment. Therefore, there is an urgent need to introduce a manufacturing process technology that is improved to have a lower height based on the assembly technology of the conventional camera module of Fig. 1. Figure 1 shows the assembly structure of a conventional camera module. FIGS. 2 to 4 illustrate a method for manufacturing a camera module according to one embodiment. FIG. 5 shows a camera module manufacturing flowchart according to one embodiment. FIG. 6 shows a cross- section of a substrate assembly according to one embodiment. FIG. 7 shows a cross-section of a camera module in which a substrate assembly and an optical assembly are combined, according to one embodiment. The foregoing and additional aspects are embodied through embodiments described with reference to the accompanying drawings. It is understood that the components of each embodiment may be combined in various ways within the embodiment or with components of other embodiments, unless otherwise stated or contradicted. Based on the principle that the inventor may appropriately define the concepts of terms to best describe his invention, the terms used in this specification and claims shall be interpreted in a meaning and concept consistent with the description or proposed technical idea. Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. <Description of Claim 1> FIGS. 2 to 4 illustrate a method for manufacturing a camera module according to one embodiment. FIG. 5 illustrates a flowchart for manufacturing a camera module according to one embodiment. As illustrated, the method for manufacturing a camera module (S1000) includes a step of preparing a printed circuit board (S100), a step of mounting an image sensor (S200), a wire bonding step (S300), a dispensing step of epoxy resin (S400), and a step of crimping an optical filter (S500). For convenience, the connector and the flexible circuit board are omitted from the illustration. In the step of preparing a printed circuit board (S100), a printed circuit board on which a substrate pad (211) and peripheral components (230) are mounted may be prepared (see (A) in FIG. 2). A substrate pad (211) and peripheral components (230) may be mounted on a printed circuit board (210, PCB). A cavity (C) may be formed in the center of the printed circuit board (210), and a substrate pad (211) and peripheral components (230) may be mounted around it. The cavity (C) may be formed by being recessed to a predetermined depth in the printed circuit board (210). As a result, a step may be formed between the central region and the peripheral region of the printed circuit board (210). The substrate pad (211) may be placed inside the peripheral component (230), but is not limited thereto. The substrat