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KR-20260064167-A - CAMERA MODULE

KR20260064167AKR 20260064167 AKR20260064167 AKR 20260064167AKR-20260064167-A

Abstract

The proposed invention relates to a camera module comprising a substrate assembly and an optical assembly, wherein at least a portion of the substrate pad and the wire connected to the substrate pad is coated with epoxy resin, and the substrate assembly is manufactured by pressing an optical filter onto the coated epoxy resin, thereby reducing the height of the camera module.

Inventors

  • 전재선
  • 백현기
  • 유재환
  • 신재민

Assignees

  • 주식회사 엠씨넥스

Dates

Publication Date
20260507
Application Date
20241031

Claims (6)

  1. A camera module comprising an optical assembly and a substrate assembly, The above substrate assembly is, A printed circuit board having a cavity (C) formed in the center and substrate pads and peripheral components mounted around it; An image sensor disposed in a cavity of a printed circuit board and having a sensor pad mounted thereon; Wire bonded to the substrate pad and the sensor pad; Epoxy resin applied to at least a portion of the substrate pad and the wire connected to the substrate pad; and Optical filter attached by pressing onto epoxy resin; A camera module including
  2. In claim 1, the wire is: A camera module formed by bonding one end of a wire to a sensor pad and then bonding the other end of the wire to a substrate pad.
  3. In claim 2, the wire is: A camera module formed by pressing the other end of a wire downward after one end of the wire is bonded to a sensor pad.
  4. In claim 1, the substrate assembly is: A camera module formed by pre-curing epoxy resin through UV irradiation.
  5. In claim 4, the substrate assembly is: A camera module formed by applying heat to the epoxy resin to fully cure.
  6. In claim 1, the optical assembly is: A camera module comprising a housing, a lens, and a lens barrel.

Description

Camera Module {CAMERA MODULE} The proposed invention discloses camera module technology. FIG. 1 shows the assembly structure of a conventional camera module. As illustrated, the conventional camera module (1000) is composed of an optical assembly (100) and a substrate assembly (200), and the optical assembly (100) and the substrate assembly (200) are connected to each other to manufacture a camera module (1000) that is mounted on an electronic device such as a mobile terminal. The optical assembly (100) may include a housing (110), a lens (120), and a lens barrel (130) that moves the lens back and forth. The substrate assembly (200) includes a PCB (210), an image sensor (220) mounted on the PCB (210), peripheral components (230) mounted on the PCB (210), a connector (240), and an FPCB (250) that electrically connects the connector (240) and the PCB (210). The lens (120) may be composed of multiple lenses and arranged. Looking at the rear of the optical assembly (100), an optical filter (140) is attached to the housing (110) by means of epoxy resin, etc. The optical filter (140) is configured as an IR cut filter and can block infrared to near-infrared rays among the light passing through the lens (120) to prevent them from being incident on the infrared to near-infrared image sensor (220). However, in accordance with the trend of slimming down electronic devices such as mobile terminals, conventional camera modules are also being slimmed down. Accordingly, the MOC process is being introduced as a new method of manufacturing camera modules by placing a substrate assembly into a mold, molding it to create an intermediate frame, attaching an optical filter to produce an intermediate assembly, and attaching an optical assembly to the intermediate assembly. U.S. Patent (US10084949) discloses the MOC process. Camera modules manufactured using this MOC (Mold On Chip) process have the advantage of being able to reduce their height, but they have the disadvantage of requiring an additional molding process and the problem of significantly increased costs due to the need to drastically replace existing manufacturing equipment. Therefore, there is an urgent need to introduce camera module technology with a lower height based on the assembly technology of the conventional camera module of Fig. 1. Figure 1 shows the assembly structure of a conventional camera module. FIG. 2 shows a substrate assembly according to one embodiment. FIG. 3 shows a camera module in which a substrate assembly and an optical assembly are combined, according to one embodiment. The foregoing and additional aspects are embodied through embodiments described with reference to the accompanying drawings. It is understood that the components of each embodiment may be combined in various ways within the embodiment or with components of other embodiments, unless otherwise stated or contradicted. Based on the principle that the inventor may appropriately define the concepts of terms to best describe his invention, the terms used in this specification and claims shall be interpreted in a meaning and concept consistent with the description or proposed technical idea. Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. <Description of Claim 1> FIG. 2 shows a substrate assembly according to one embodiment. A camera module includes a substrate assembly (200). The substrate assembly (200) includes a printed circuit board (210) having a cavity (C) formed in the center and a substrate pad (211) and peripheral components mounted around it, an image sensor (220) disposed in the cavity (C) of the printed circuit board and having a sensor pad (221) mounted thereon, a wire (260) bonded to the substrate pad and the sensor pad, an epoxy resin (270) applied to at least a portion of the wire connected to the substrate pad and the substrate pad, and an optical filter (140) attached by pressing onto the epoxy resin. For convenience, a connector and a flexible circuit board are omitted from the illustration. A substrate pad (211) and peripheral components (230) can be mounted on a printed circuit board (210, PCB). A cavity (C) may be formed in the center of the printed circuit board (210), and a substrate pad (211) and peripheral components (230) may be mounted around it. The cavity (C) may be formed by being recessed to a predetermined depth in the printed circuit board (210). As a result, a step may be formed between the central region and the peripheral region of the printed circuit board (210). The substrate pad (211) may be placed inside the peripheral component (230), but is not limited thereto. The substrate pad (211) may have a loop shape, but is not limited thereto. The peripheral component (230) may include a multi-layer ceramic capacitor (MLCC). An image sensor (220) can be inserted into a cavity (C) on a printed circuit board (210), specifically and die-attached. The image sensor (220) can