Search

KR-20260064179-A - PRINTED CIRCUIT BOARD

KR20260064179AKR 20260064179 AKR20260064179 AKR 20260064179AKR-20260064179-A

Abstract

The present disclosure relates to a printed circuit board comprising: a glass layer including a first region and a second region surrounding the first region; a plurality of first metal vias each including a first via portion that penetrates the glass layer and is spaced apart from each other in the first region; and a plurality of second metal vias each including a second via portion that penetrates the glass layer and is spaced apart from each other in the second region, wherein the first via portion has a maximum width in cross-section smaller than that of the second via portion.

Inventors

  • 김인건

Assignees

  • 삼성전기주식회사

Dates

Publication Date
20260507
Application Date
20241031

Claims (15)

  1. A glass layer comprising a first region and a second region surrounding the first region; A plurality of first metal vias spaced apart from each other in the first region and each including a first via portion penetrating the glass layer; and A plurality of second metal vias spaced apart from each other in the second region and each including a second via portion penetrating the glass layer; comprising, The first via portion has a maximum width in cross-section smaller than the second via portion, Printed circuit board.
  2. In Article 1, The average pitch between the plurality of first metal vias is smaller than the average pitch between the plurality of second metal vias. Printed circuit board.
  3. In Article 1, The first region above includes a portion adjacent to the center of the glass layer, and The second region above includes a portion adjacent to the edge of the glass layer, Printed circuit board.
  4. In Article 1, Each of the above plurality of first metal vias includes a metal via for signal transmission, Each of the above plurality of second metal vias includes a metal via for power transmission or a metal via for heat dissipation, Printed circuit board.
  5. In Article 1, Further comprising an electronic component embedded in a first region of the glass layer; and The plurality of first metal vias are each disposed around the electronic component, Printed circuit board.
  6. In Article 1, Further comprising a plurality of third metal vias spaced apart from each other in the first region and each including a third via portion penetrating the glass layer; The plurality of third metal vias are disposed between the plurality of first metal vias and the plurality of second metal vias, and The third via portion has a maximum width in cross-section smaller than the second via portion but a maximum width in cross-section larger than the first via portion. Printed circuit board.
  7. In Article 6, The average pitch between the plurality of third metal vias is smaller than the average pitch between the plurality of second metal vias, but larger than the average pitch between the plurality of first metal vias. Printed circuit board.
  8. In Article 1, A frame having a penetration portion in which at least a portion of the above-mentioned glass layer is disposed; A first insulating layer that covers the upper and lower surfaces of each of the frame and the glass layer, and fills the space between the frame and the glass layer within the penetration portion; A first wiring layer disposed on the upper surface of the first insulating layer; A first via layer penetrating the upper side of the first insulating layer and comprising a plurality of first connection vias that respectively connect the first wiring layer to the plurality of first and second metal vias; A second wiring layer disposed on the lower surface of the first insulating layer; and A second via layer comprising a plurality of second connection vias penetrating the lower side of the first insulating layer and connecting the second wiring layer to the plurality of first and second metal vias, respectively; further comprising Printed circuit board.
  9. In Article 8, A plurality of second insulating layers disposed on the upper surface of the first insulating layer; A plurality of third wiring layers each disposed on the upper surface of the plurality of second insulating layers; and A plurality of third via layers each penetrating the plurality of second insulating layers and each connected to one or more of the plurality of third wiring layers; further comprising Printed circuit board.
  10. A glass layer comprising a first region and a second region surrounding the first region; A first metal via disposed in the first region and comprising a first via portion penetrating the glass layer, a first-1 pad portion disposed on the upper surface of the glass layer, and a first-2 pad portion disposed on the lower surface of the glass layer; and A second metal via disposed in the second region and comprising a second via portion penetrating the glass layer, a second-1 pad portion disposed on the upper surface of the glass layer, and a second-2 pad portion disposed on the lower surface of the glass layer; comprising The above 1-1 pad portion has a maximum width in cross-section smaller than the above 2-1 pad portion, Printed circuit board.
  11. In Article 10, The above 1-2 pad portion has a maximum width in cross-section smaller than the above 2-2 pad portion, Printed circuit board.
  12. In Article 11, The above 1-1 pad portion has a smaller planar area than the above 1-2 pad portion, and The above 1-2 pad portion has a smaller planar area than the above 2-2 pad portion, Printed circuit board.
  13. In Article 10, A third metal via disposed in the first region and comprising a third via portion penetrating the glass layer, a third-1 pad portion disposed on the upper surface of the glass layer, and a third-2 pad portion disposed on the lower surface of the glass layer; further comprising The third metal via is positioned between the first and second metal vias, and The above 3-1 pad portion has a maximum width in cross-section smaller than the above 2-1 pad portion, but a maximum width in cross-section larger than the above 1-1 pad portion, The above 3-2 pad portion has a maximum width in cross-section smaller than the above 2-2 pad portion, but a maximum width in cross-section larger than the above 1-2 pad portion. Printed circuit board.
  14. In Article 13, The above 3-1 pad portion has a smaller planar area than the above 2-1 pad portion, but a larger planar area than the above 1-1 pad portion, and The above 3-2 pad portion has a smaller planar area than the above 2-2 pad portion, but a larger planar area than the above 1-2 pad portion. Printed circuit board.
  15. In Article 10, The second via portion comprises a plurality of vias that penetrate the glass layer between the second-1 and second-2 pad portions and connect the second-1 and second-2 pad portions, respectively. Printed circuit board.

Description

Printed Circuit Board The present disclosure relates to a printed circuit board. To meet the high-performance and miniaturization strategies of semiconductors, the required levels of miniaturization and high density for printed circuit boards are increasing. For example, manufacturing high-end products such as server boards requires high multi-layer structures and large bodies. However, as the number of wiring layers increases and the body size grows, the board may become vulnerable to warpage. To address this problem, the use of glass cores is being considered. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. Figure 3 is a schematic plan view showing the glass layer of the printed circuit board of Figure 2 as viewed from above. FIG. 4 is a schematic cross-sectional view of another example of a printed circuit board. Figure 5 is a schematic plan view showing the glass layer of the printed circuit board of Figure 4 as viewed from above. FIG. 6 is a schematic cross-sectional view showing another example of a printed circuit board. Figure 7 is a schematic plan view showing the glass layer of the printed circuit board of Figure 6 as viewed from above. The present disclosure will be described below with reference to the attached drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. Referring to the drawing, the electronic device (1000) accommodates a main board (1010). Chip-related components (1020), network-related components (1030), and other components (1040), etc., are physically and/or electrically connected to the main board (1010). These are also combined with other electronic components described later to form various signal lines (1090). The chip-related components (1020) include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs), but are not limited thereto, and other types of chip-related electronic components may also be included. Furthermore, it is obvious that these chip-related components (1020) may be combined with each other. The chip-related components (1020) may also be in the form of a package containing the aforementioned chips or electronic components. Network-related components (1030) include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, but are not limited thereto, and any of a number of other wireless or wired standards or protocols may be included. In addition, it goes without saying that network-related components (1030) can be combined with chip-related components (1020). Other components (1040) include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include passive components in the form of chip components used for various other purposes. In addition, it goes without saying that other components (1040) may be combined with chip-related components (1020) and/or network-related components (1030). Depending on the type of electronic device (1000), the electronic device (1000) may include other electronic components that may or may not be physically and/or electrically connected to the main board (1010). Examples of other electronic components include a camera module (1050), an antenna module (1060), a display (1070), a battery (1080), etc. However, it is not limited thereto, and may include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition to these, other electronic components used for various purposes may be included depending on the type of electronic device (1000). The electronic device (1000) may be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, server, etc. However, it is not limited to these, and it may be any other electronic device that processes data in addition to these. FIG. 2 is a schematic cross-sectional view of an exampl