KR-20260064180-A - PRINTED CIRCUIT BOARD

KR20260064180AKR 20260064180 AKR20260064180 AKR 20260064180AKR-20260064180-A

Abstract

The present disclosure relates to a printed circuit board comprising: a glass layer; a cavity penetrating between the upper and lower surfaces of the glass layer; a metal layer disposed on the wall surface of the cavity; and an electronic component spaced apart from the metal layer and having at least a portion disposed within the cavity; wherein the upper surface of the metal layer is disposed at substantially the same level as the upper surface of the glass layer or is disposed below the upper surface of the glass layer, and the lower surface of the metal layer is disposed at substantially the same level as the lower surface of the glass layer or is disposed above the lower surface of the glass layer.

Inventors

한상현
지용완
이동근

Assignees

삼성전기주식회사

Dates

Publication Date: 20260507
Application Date: 20241031

Claims (15)

Glass layer; A cavity penetrating between the upper and lower surfaces of the glass layer; A metal layer disposed on the wall surface of the above cavity; and An electronic component, at least a portion thereof disposed within the cavity and spaced apart from the metal layer; comprising, The upper surface of the metal layer is positioned at substantially the same level as the upper surface of the glass layer, or is positioned below the upper surface of the glass layer, and The lower surface of the metal layer is positioned at substantially the same level as the lower surface of the glass layer, or is positioned above the lower surface of the glass layer. Printed circuit board.
In Article 1, The upper surface of the metal layer is substantially coplanar with the upper surface of the glass layer, The lower surface of the metal layer is substantially coplanar with the lower surface of the glass layer, Printed circuit board.
In Article 1, The upper surface of the metal layer has a step difference with respect to the upper surface of the glass layer, and The lower surface of the metal layer has a step difference with respect to the lower surface of the glass layer, Printed circuit board.
In Article 1, The cavity continuously surrounds the side of the electronic component, and The metal layer is disposed on the wall of the cavity in the form of a metal plate to continuously surround the side of the electronic component. Printed circuit board.
In Article 1, The metal layer comprises a first metal layer disposed on the wall surface of the cavity and a second metal layer disposed on the first metal layer, The first metal layer above includes a laminated structure of a titanium layer and a copper layer, and The above second metal layer comprises a copper layer, Printed circuit board.
In Article 1, A through hole penetrating between the upper and lower surfaces of the glass layer; and Further comprising a metal via filling at least a portion of the above-mentioned through hole; and The upper surface of the metal via is positioned at substantially the same level as the upper surface of the glass layer or is positioned below the upper surface of the glass layer, and The lower surface of the metal via is positioned at substantially the same level as the lower surface of the glass layer or is positioned above the lower surface of the glass layer, Printed circuit board.
In Article 6, The metal via comprises a first metal layer disposed on the wall surface of the through hole and a second metal layer disposed on the first metal layer and filling at least a portion of the through hole. The first metal layer above includes a laminated structure of a titanium layer and a copper layer, and The above second metal layer comprises a copper layer, Printed circuit board.
In Article 6, A frame having a penetration portion in which at least a portion of the above-mentioned glass layer is disposed; A first insulating layer disposed on the upper surface of each of the above frame and the above glass layer; A first wiring layer disposed on the upper surface of the first insulating layer; A first connection via penetrating the first insulating layer and connecting at least a portion of the first wiring layer to the metal via; A second connection via penetrating the first insulating layer and connecting another at least part of the first wiring layer to the electronic component; A second insulating layer disposed on the lower surface of each of the above frame and the above glass layer; A second wiring layer disposed on the lower surface of the second insulating layer; A third connection via penetrating the second insulating layer and connecting at least a portion of the second wiring layer to the metal via; and A third insulating layer filling at least a portion between the frame and the glass layer within the penetration portion; further comprising, The first and third connecting vias each contact the upper and lower surfaces of the metal vias, Printed circuit board.
In Article 8, The third insulating layer has an interlayer boundary with the first and second insulating layers, respectively. Printed circuit board.
In Article 8, The third insulating layer is integrated with one or more of the first and second insulating layers. Printed circuit board.
In Article 8, A first build-up insulating layer disposed on the upper surface of the first insulating layer; A first build-up wiring layer disposed on the upper surface of the first build-up insulating layer; A first build-up via layer penetrating the first build-up insulating layer and connecting the first build-up insulating layer and the first wiring layer; A second build-up insulating layer disposed on the lower surface of the second insulating layer; A second build-up wiring layer disposed on the lower surface of the second build-up insulating layer; and A second build-up via layer penetrating the second build-up insulating layer and connecting the second build-up wiring layer and the second wiring layer; further comprising Printed circuit board.
Glass layer; A cavity penetrating at least a portion between the upper and lower surfaces of the glass layer; A metal layer disposed on the wall surface of the above cavity; and An electronic component, at least a portion thereof disposed within the cavity and spaced apart from the metal layer; comprising, The metal layer comprises a first metal layer disposed on the wall surface of the cavity and a second metal layer disposed on the first metal layer, The first metal layer above includes a laminated structure of a titanium layer and a copper layer, and The above second metal layer comprises a copper layer, Printed circuit board.
In Article 12, In a direction perpendicular to the wall of the above cavity, The second metal layer is thicker than the first metal layer. Printed circuit board.
In Article 12, A through hole penetrating between the upper and lower surfaces of the glass layer; and Further comprising a metal via filling at least a portion of the above-mentioned through hole; and The above metal via includes the first and second metal layers, and The first metal layer included in the above metal via is disposed on the wall surface of the above through hole, and A second metal layer included in the metal via is disposed on a first metal layer included in the metal via to further fill at least a portion of the through hole. Printed circuit board.
In Article 14, The titanium layer of the first metal layer above comprises sputtered titanium, The copper layer of the first metal layer comprises one or more of sputtered copper and chemical copper, and The copper layer of the second metal layer above comprises electrolytic copper, Printed circuit board.

Description

Printed Circuit Board The present disclosure relates to a printed circuit board. With the blossoming of the AI semiconductor era, developments related to glass substrates are actively underway. For instance, semiconductor package substrates made of plastic materials may face various limitations as microfabrication processes are required during packaging. For instance, plastic substrates are difficult to reduce in thickness and may experience issues such as warping. Therefore, glass substrates can be utilized as a solution to address these challenges. However, in the case of glass substrates, cracks may occur due to impact on the side regions of the glass during chip mounting following cavity processing. Additionally, cracks may develop in the glass substrate due to stress generated during the build-up process. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. Figure 3 is a schematic AA' cross-sectional plan of the printed circuit board of Figure 2. Figure 4 is a schematic cross-sectional view of another example of a printed circuit board. Figure 5 is a schematic BB' cross-sectional plan of the printed circuit board of Figure 4. FIG. 6 is a series of process cross-sectional views schematically illustrating the process in which a through hole and a cavity are formed in a glass layer, a metal via and a metal layer are formed on the inside of the through hole and on the wall of the cavity, respectively, and an electronic component is placed in the cavity where the metal layer is formed. The present disclosure will be described below with reference to the attached drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. Referring to the drawing, the electronic device (1000) accommodates a main board (1010). Chip-related components (1020), network-related components (1030), and other components (1040), etc., are physically and/or electrically connected to the main board (1010). These are also combined with other electronic components described later to form various signal lines (1090). The chip-related components (1020) include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs), but are not limited thereto, and other types of chip-related electronic components may also be included. Furthermore, it is obvious that these chip-related components (1020) may be combined with each other. The chip-related components (1020) may also be in the form of a package containing the aforementioned chips or electronic components. Network-related components (1030) include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, but are not limited thereto, and any of a number of other wireless or wired standards or protocols may be included. In addition, it goes without saying that network-related components (1030) can be combined with chip-related components (1020). Other components (1040) include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include passive components in the form of chip components used for various other purposes. In addition, it goes without saying that other components (1040) may be combined with chip-related components (1020) and/or network-related components (1030). Depending on the type of electronic device (1000), the electronic device (1000) may include other electronic components that may or may not be physically and/or electrically connected to the main board (1010). Examples of other electronic components include a camera module (1050), an antenna module (1060), a display (1070), a battery (1080), etc. However, it is not limited thereto, and may include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition to these, other electronic components used for various purposes may be included depending on the type of electronic device (1000). The electronic device (1000) may be a smartphone, personal digital assistant, d