KR-20260064214-A - THERMOPLASTIC RESIN COMPOSITION FOR HIGH FREQUENCY HAVING LOW PERMITTIVITY, AND PREPREG, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME

KR20260064214AKR 20260064214 AKR20260064214 AKR 20260064214AKR-20260064214-A

Abstract

The present invention provides a thermosetting resin composition for high frequency that has excellent dielectric properties and excellent copper foil adhesion, a prepreg comprising the composition, a copper foil laminate, and a printed circuit board. The thermosetting resin composition for high frequency according to the present invention comprises a poly(phenylene)ether formulation comprising a poly(phenylene ether) or an oligomer thereof having two or more unsaturated substituents selected from the group consisting of vinyl groups and allyl groups at both ends of the molecular chain and a crosslinking agent, and an epoxy resin formulation comprising an epoxy resin and a latent curing agent, wherein the latent curing agent is obtained by reacting a phenolic curing agent with an aromatic diisocyanate compound.

Inventors

남동기

Assignees

(주)폴라리스우노

Dates

Publication Date: 20260507
Application Date: 20241031

Claims (10)

(A) a poly(phenylene)ether formulation comprising a poly(phenylene ether) or an oligomer thereof having two or more unsaturated substituents selected from the group consisting of vinyl groups and allyl groups at both ends of the molecular chain and a crosslinkable crosslinking agent, and (B) an epoxy resin formulation comprising an epoxy resin and a latent curing agent, wherein the latent curing agent is obtained by reacting a phenolic curing agent with an aromatic diisocyanate compound.
In paragraph 1, The above latent curing agent is a thermosetting resin composition for high frequency, obtained by reacting a phenolic curing agent with an aromatic diisocyanate compound in a molar ratio of 1.2 to 1.8:1.
In paragraph 1, A high-frequency thermosetting resin composition comprising the above poly(phenylene) ether mixture and the above epoxy resin mixture in a weight ratio of 5 to 10:1.
In paragraph 1, A thermosetting resin composition for high frequency, wherein the above-mentioned phenolic curing agent is one or more selected from the group consisting of dicyclopentadiene (DCPD) type curing agent, phenol novolak type curing agent, xylok type curing agent, and bisphenol A type curing agent, and the above-mentioned aromatic diisocyanate compound is one or more selected from the group consisting of methylene diphenyl diisocyanate (MDI), tolylene diisocyanate (TDI), and naphthalene diisocyanate (NDI).
In paragraph 4, A thermosetting resin composition for high frequency, wherein the above-mentioned phenolic curing agent is a dicyclopentadiene (DCPD) type curing agent or a bisphenol A type curing agent, and the above-mentioned aromatic diisocyanate compound is methylene diphenyl diisocyanate (MDI).
In paragraph 1, The above thermosetting resin composition is a thermosetting resin composition for high frequency, further comprising one or more of a flame retardant, an inorganic filler, and a reaction initiator.
In paragraph 1, The above thermosetting resin composition is a thermosetting resin composition for high frequency, further comprising an organic solvent.
A prepreg formed by coating or impregnating a fiber substrate with a thermosetting resin composition for high frequency according to any one of claims 1 to 7.
A copper foil laminate formed by laminating prepreg according to paragraph 8 onto one or both sides of the copper foil.
A printed circuit board formed using a copper foil laminate according to paragraph 9.

Description

Thermoplastic resin composition for high frequency having low dielectric loss characteristics, prepreg, copper clad laminate, and printed circuit board using the same The present invention relates to a thermosetting resin composition for high frequency capable of simultaneously exhibiting excellent low dielectric loss characteristics and copper foil adhesion, and to a prepreg, a copper foil laminate, and a printed circuit board using the same. Recently, electronic components and information and communication devices, such as semiconductor substrates, printed circuit boards, and EMCs (Epoxy Molding Compounds), have shown a trend toward higher frequencies with increasing signal bandwidths. However, since dielectric loss of an electrical signal is proportional to the product of the square root of the relative permittivity of the insulating layer forming the circuit, the dielectric loss tangent, and the frequency of the electrical signal, higher frequencies lead to greater dielectric loss and signal attenuation. This can result in reduced reliability of signal transmission and, as transmission loss is converted into heat, cause heat generation issues. Therefore, in the high-frequency region, it is required to use materials with very low dielectric constant and dielectric loss tangent. Due to this requirement, thermosetting substrate materials with low dielectric properties for high frequency have been developed based on poly(phenylene ether) (PPE) having excellent dielectric properties, comprising an epoxy resin and a crosslinkable curing agent to exhibit low dielectric properties (Patent Documents 1 to 3). Furthermore, when low-roughness copper foil is used as a substrate material to lower the dielectric loss tangent, a problem arises regarding the reduction of the copper foil's peel strength (adhesion). To compensate for this, substrate materials incorporating epoxy resin, which possesses excellent peel strength—i.e., excellent adhesion—have been developed. However, when epoxy resin is used as the substrate material, the dielectric loss tangent is not sufficiently low, leading to a problem where dielectric properties deteriorate as the frequency increases. As described above, in order to solve the problem of poor dielectric properties when epoxy resin is incorporated as a substrate material, a non-epoxy thermosetting resin composition for high frequency was developed comprising modified poly(phenylene ether) in which both ends of poly(phenylene ether) are modified (Patent Document 4). However, the aforementioned conventional technologies need further improvement as they fail to satisfy both low dielectric constant characteristics and adhesion; therefore, the development of high-frequency materials that satisfy both low dielectric constant characteristics and adhesion is required. Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. Hereinafter, a thermosetting resin composition for high frequency according to the present invention and prepregs, copper foil laminates, and printed circuit boards using the same will be described in detail. [Thermosetting resin composition] The thermosetting resin composition for high frequency according to the present invention may include, as described below, (A) a poly(phenylene ether) composition comprising poly(phenylene ether) or an oligomer thereof and a crosslinking curing agent, and (B) an epoxy resin composition comprising a latent curing agent prepared by reacting an epoxy resin and a phenolic resin with a diisocyanate compound. According to some embodiments of the present invention, the poly(phenylene) ether mixture and the epoxy resin mixture may be included in a weight ratio of 5 to 10:1, and it is desirable that these components be included in the weight ratio range to exhibit low dielectric constant characteristics and excellent adhesion. In addition, the thermosetting resin composition for high frequency according to the present invention may further include (C) other conventional additives as needed, within a range that does not impede the effects of the present invention. In the present invention, the term 'thermosetting resin composition' is used to include the form of a resin varnish in which the components (A) and (B), and, if necessary, component (C) are dissolved or dispersed in an organic solvent (D). Hereinafter, each component included in the thermosetting resin composition for high frequency of the present invention will be described in detail. (A) Poly(phenylene ether) blend (a-1) Poly(phenylene ether) or its oligomer In the thermosetting resin composition for high frequency according to the present invention, the poly(phenylene