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KR-20260064260-A - OPTICAL FAULT ISOLATION DEVICE AND PLATE FOR SEMICONDUCTOR DEVICE TEST

KR20260064260AKR 20260064260 AKR20260064260 AKR 20260064260AKR-20260064260-A

Abstract

An optical defect detection device is provided. An optical defect detection device according to some embodiments includes an optical device for detecting defects in a device under test, and a plate including a support unit for fixing the device under test, wherein the plate includes an opening in the center and a magnetic body disposed along the edge of the opening, and the support unit includes a first sub-support unit and a second sub-support unit, wherein the first sub-support unit and the second sub-support unit are spaced apart from each other and attached to the magnetic body, and the device under test includes a first surface attached to the support unit and a second surface opposite to the first surface, and the first surface is exposed through the opening.

Inventors

  • 이욱진
  • 김건일
  • 김대윤
  • 오길근

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20241031

Claims (10)

  1. Optical device for detecting defects in a device under test; A plate including a support unit for fixing the above-mentioned device to be tested, wherein The above plate includes an opening in the center and a magnetic body disposed along the edge of the opening, and The above support unit includes a first sub-support unit and a second sub-support unit, and The first sub-support unit and the second sub-support unit are spaced apart from each other and attached to the magnetic body, and The above-described test device includes a first surface attached to the support unit and a second surface opposite to the first surface, The above first surface is an optical defect detection device exposed through the opening.
  2. In paragraph 1, The above plate is an optical defect detection device in which the first surface is positioned facing the optical device.
  3. In paragraph 1, The above plate is an optical defect detection device in which the second surface is positioned facing the optical device.
  4. In paragraph 1, It further includes a temperature control device for controlling the temperature of the above-mentioned support unit, and The above-mentioned first sub-support unit includes a first heating element that conducts heat to the device under test, and The above second sub-support unit includes a second heating element that conducts heat to the device under test, and The above temperature control device is an optical defect detection device that controls the temperatures of the first heating element and the second heating element, respectively.
  5. In paragraph 4, The above-mentioned test device is, A first support area overlapping with the first sub-support unit, and A second support area overlapping with the above-mentioned second sub-support unit, and It includes a test area between the first support area and the second support area, The above test area is a first test area adjacent to the above first support area, and It includes a second test area adjacent to the second support area, and An optical defect detection device in which the temperatures of the first test area and the second test area are different.
  6. In paragraph 1, The above-mentioned device under test is an optical defect detection device comprising a wafer or a semiconductor package.
  7. In paragraph 1, The above-mentioned test device includes a semiconductor device layer between a first wiring layer and a second wiring layer, and The above first wiring layer is an optical defect detection device that supplies power to the semiconductor device layer.
  8. A plate including a support unit for fixing a semiconductor device and It includes a temperature control device for controlling the temperature of the above-mentioned support unit, The above plate includes an opening in the center and a magnetic body disposed along the edge of the opening, and The above support unit includes a first sub-support unit and a second sub-support unit, and The first sub-support unit and the second sub-support unit are spaced apart from each other and attached to the magnetic body, and The semiconductor device includes a first surface in contact with the support unit and a second surface opposite to the first surface, The first surface is a semiconductor device support plate exposed through the opening.
  9. In paragraph 8, The semiconductor device is tested by an optical device that detects defects in the semiconductor device, and The above optical device is a semiconductor device support plate that detects defects in the semiconductor device at a position facing the first surface.
  10. Optical device for detecting defects in a device under test; A support unit for fixing the above-mentioned test device; A substrate plate having an optical window to which the above-mentioned support unit is attached and which exposes the above-mentioned device under test; A temperature control device that controls the temperature of the support unit and monitors the temperatures of the support unit and the device under test; and The above-mentioned device under test includes a probe that transmits a test signal for detecting defects, The above support unit includes a first sub-support unit and a second sub-support unit, and The above-mentioned first sub-support unit includes a first heating element that conducts heat to the device under test, and The above second sub-support unit includes a second heating element that conducts heat to the device under test, and The above temperature control device is an optical defect detection device that controls the temperatures of the first heating element and the second heating element, respectively.

Description

Optical fault detection device for semiconductor devices and semiconductor device support plate {OPTICAL FAULT ISOLATION DEVICE AND PLATE FOR SEMICONDUCTOR DEVICE TEST} The present invention relates to an optical defect detection device for a semiconductor device and a semiconductor device support plate. As the size of unit logic in semiconductor devices decreases, there are limitations in physically visualizing actual defects. Consequently, Optical Fault Isolation (OFI) analysis techniques, which utilize various optical technologies to identify the causes of device failures, are being used as a method for electrical fault analysis. However, conventional OFI analysis techniques are limited to room temperature, making them unsuitable for analyzing defects in automotive electronic products where high-temperature quality assurance is essential. Therefore, there is a need for a new optical fault detection system capable of detecting defects across high or low temperature ranges to improve product yield. FIG. 1 is a perspective view illustrating a semiconductor device support plate according to some embodiments. FIG. 2 is a perspective view intended to explain only a part of the configuration of FIG. 1. Figure 3 is an enlarged perspective view of area A of Figure 1. Figure 4 is a top view showing an enlarged view of area A of Figure 1. FIGS. 5 and 6 are perspective views illustrating an optical defect detection device according to some embodiments. FIGS. 7 to 10 are perspective views illustrating a method for detecting optical defects in a device under test using an optical defect detection device and a semiconductor device support plate according to some embodiments. FIG. 11 is a cross-sectional view illustrating a device under test according to some embodiments. FIG. 12 is a graph illustrating the effect of a semiconductor device support plate according to some embodiments. FIGS. 13 and 14 are drawings for explaining the effects of a semiconductor device support plate according to some embodiments. FIGS. 15 and 16 are perspective views for illustrating a semiconductor device support plate according to some embodiments. FIGS. 17 and 18 are perspective views illustrating a method of using a semiconductor device support plate in an optical defect detection device according to some embodiments. Embodiments of the present invention will be described in detail below with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. FIG. 1 is a perspective view for illustrating a semiconductor device support plate according to some embodiments. FIG. 2 is a perspective view for illustrating only some components of FIG. 1. Referring to FIGS. 1 and FIGS. 2, the semiconductor device support plate (100) may include a plate (10) and a temperature control device (50). The plate (10) may include an opening (20), a magnetic body (30), and a support unit (40). The opening (20) may be formed in the center of the plate (10). The height of the opening (20) may be the same as the height of the plate (10). The magnetic body (30) may be formed along the edge of the opening (20). The magnetic body (30) may include a material having magnetic properties. The support unit (40) and the magnetic body (30) can be fixed using the magnetism of the magnetic body (30). The support unit (40) may include a first sub-support unit (40a) and a second sub-support unit (40b). According to some embodiments, the support unit (40) may be in the shape of a bar extending along a second direction (Y). In some embodiments, the first sub-support unit (40a) and the second sub-support unit (40b) may be spaced apart from each other and attached to the magnetic body (30). The position where the support unit (40) is attached can be adjusted to fit the size of the device under test (60). Thus, by changing the position of the support unit (40), a versatile semiconductor device support plate capable of attaching devices under test (60) of various shapes and sizes can be provided. In some embodiments, the support unit (40) may include a heating element (45a, 45b) inside. For example, the first sub-support unit (40a) may include the first heating element (45a) inside. The second sub-support unit (40b) may include the second heating element (45b) inside. The support unit (40) may include a metal material that can be attached to the magnetic body (30) and capable of conducting heat by a heating element (45a, 45b). For example, the first sub-support unit (40a) and the second sub-support unit (40b) may each include stainless steel. In some embodiments, the support unit (40) can secure the device under test (60). For example, the device under test (60) can be attached to the support unit (40) by a heat-resistant tape. In some embodiments, the device under test (60) may include a wafer, a semiconductor chip, and a semiconductor package. For example, the device under test (