KR-20260064324-A - POLISHING PAD AND MANUFACTURING METHOD THEREOF

Abstract

The present invention relates to a polishing pad used in the chemical mechanical polishing (CMP) process of semiconductor devices, and specifically, to a polishing pad having eco-friendliness by applying a sub-pad layer containing biomass, and a method for manufacturing the same.

Inventors

• 이도형
• 서장원
• 윤종욱
• 오신일
• 지민경

Assignees

• 엔펄스 주식회사

Dates

Publication Date

20260507

Application Date

20241031

Claims (9)

1. Top pad layer; and It includes a sub-pad layer prepared from a biomass-containing composition, and The above sub-pad layer is an abrasive pad having a total biomass content of 15% by weight to 20% by weight as measured by ASTM D 6866.
2. In Article 1, The above biomass-containing composition includes a urethane prepolymer, and A polishing pad in which the above urethane prepolymer is manufactured from a urethane prepolymer composition comprising an isocyanate raw material and a polyol raw material.
3. In Article 2, A polishing pad comprising the above isocyanate raw material; and the above polyol raw material comprising biomass.
4. In Article 2, A polishing pad comprising one or more types selected from the group consisting of bio-based polymer polyols and bio-based monomer polyols, wherein the above polyol raw material comprises
5. In Article 4, A polishing pad comprising one or more types selected from the group consisting of bio-based polymer polyols, bio-based polyether polyols, bio-based polyester polyols, bio-based polycarbonate polyols, and bio-based polycaprolactam polyols.
6. In Article 4, A polishing pad comprising one or more selected from the group consisting of bio-based monomer polyols: bio-based ethylene glycol, bio-based diethylene glycol, bio-based 1,2-propylene glycol, bio-based 1,3-propanediol, bio-based 2-methyl-1,3-propanediol, bio-based 1,3-butanediol, bio-based 1,4-butanediol, bio-based 2,3-butanediol, bio-based n-butanol, bio-based isobutanol, bio-based 1,5-pentanediol, bio-based 2-octanol, bio-based 1,9-nonanediol, bio-based 1,10-decanediol, bio-based diethylene glycol, and bio-based isosorbide.
7. In Article 2, A polishing pad in which the above isocyanate raw material comprises a bio-based isocyanate.
8. In Article 7, A polishing pad comprising one or more types selected from the group consisting of bio-based isocyanates, bio-based toluene diisocyanate, and bio-based 4,4'-methylene dicyclohexyl diisocyanate.
9. A step of preparing a biomass-containing urethane prepolymer from a urethane prepolymer composition comprising an isocyanate raw material and a polyol raw material comprising a bio-based polyol; A step of preparing a biomass-containing composition comprising the above-mentioned biomass-containing urethane prepolymer, a curing agent, and a foaming agent; A step of manufacturing a sub-pad layer by curing the above biomass-containing composition; The method includes the step of attaching the above sub-pad layer to the top pad layer, A method for manufacturing a polishing pad, wherein the above sub-pad layer has a total biomass content of 15% by weight to 20% by weight as measured by ASTM D 6866.

Description

Polishing pad and manufacturing method thereof An embodiment relates to a polishing pad used in a chemical mechanical polishing (CMP) process for semiconductor devices, and specifically, to a polishing pad having eco-friendliness by applying a sub-pad layer containing biomass and a method for manufacturing the same. Chemical mechanical polishing (CMP) is a process in which a semiconductor substrate, such as a wafer, is attached to a head and contacts the surface of a polishing pad fixed on a platen, and the platen and the head are moved relative to each other to flatten the uneven parts of the surface of the semiconductor substrate. In such a CMP process, the polishing pad is required to possess stable physical properties because it significantly affects the surface processing quality of the semiconductor substrate. In particular, since the polishing rate of the CMP process can vary sensitively depending on the components and physical properties contained in the polishing pad, it is necessary to optimize the components and physical properties of the polishing pad. Meanwhile, with the recent emergence of environmental issues such as climate change, public opinion is forming that companies must assume social responsibility to build a sustainable society through ESG management, including carbon neutrality. Accordingly, various companies are attempting to manufacture a variety of products by applying biomass raw materials derived from plants and other sources instead of petroleum-based raw materials. In line with this trend, there is a need to attempt to enhance eco-friendliness by applying biomass raw materials to polishing pads that were previously manufactured using petroleum-based raw materials. Furthermore, there is a need to provide polishing pads with physical properties capable of achieving the polishing rate required in the CMP process, even when the aforementioned biomass raw materials are applied. FIG. 1 shows a cross-sectional view of a polishing pad according to one embodiment. FIG. 2 is a semiconductor device manufacturing process using a polishing pad according to one embodiment. In describing the embodiments below, detailed descriptions of related known configurations or functions are omitted if it is determined that such descriptions could obscure the essence of the embodiments. Additionally, the sizes of each component in the drawings may be exaggerated or omitted for illustrative purposes and may differ from the actual sizes applied. In this specification, the description that one component is connected or coupled with another component includes both direct and indirect formation, connection, or coupling between these components through the interposition of another component. In this specification, terms referring to each component are used to distinguish them from other components and are not intended to limit the embodiments. Additionally, in this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "first," "second," etc. are used to describe various components, and said components should not be limited by said terms. These terms are used for the purpose of distinguishing one component from another. In this specification, the use of the term "comprising" is intended to specify characteristics, regions, steps, processes, elements, and components, and unless specifically stated otherwise, it does not exclude the existence or addition of other characteristics, regions, steps, processes, elements, or components. For convenience, the molecular weights of compounds or polymers described in this specification are indicated in units of molar mass, but they may be understood as relative masses based on carbon-12. Furthermore, the molecular weights of polymers described in this specification may be interpreted as number-average molecular weight or weight-average molecular weight, for example, as weight-average molecular weight. In numerical ranges defining the size, physical properties, etc., of components described in this specification, if a numerical range in which only the upper limit is defined and a numerical range in which only the lower limit is defined are separately exemplified, it should be understood that a numerical range combining these upper and lower limits is also included in the exemplary range. In this specification, the term "bio-based" component means a component obtained by using biomass derived from plants, etc., as the raw material, rather than fossil fuel-based materials such as petroleum, in whole or in part. Specifically, it is a component containing carbon-14 ( 14 C), a radioactive carbon isotope that is not present in fossil fuel-based materials such as petroleum but exists only in bio-based materials. For example, "bio-based polyol" refers to a polyol obtained using biomass derived from plants, etc., as all or part of the raw material, and since it contains radiocarbon ( 14 C)