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KR-20260064330-A - HOME APPLIANCES INCLUDING RADIATION STRUCTURE

KR20260064330AKR 20260064330 AKR20260064330 AKR 20260064330AKR-20260064330-A

Abstract

A robot vacuum cleaner according to one embodiment of the present disclosure may include a main body, a cleaning unit connected to the main body, a driving unit disposed on the bottom surface of the main body for movement of the robot vacuum cleaner, and a control panel for controlling the operation of the robot vacuum cleaner. The control panel may include a circuit board, an electronic component disposed on the circuit board, a shield can formed to surround the electronic component and coupled with the circuit board, a heat sink disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and a heat transfer member disposed between the electronic component and the heat sink. The shield can may include a support portion supporting the heat sink, a side wall extending from the support portion and formed to surround at least a portion of the heat sink, and a fastening portion formed inside the side wall and coupled with the heat sink.

Inventors

  • 이상호
  • 이종인
  • 박창현
  • 신동준

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20241031

Claims (20)

  1. In a robot vacuum cleaner (100), Main body (110); A cleaning unit (140) connected to the main body (110); A driving unit (130) positioned on the bottom surface of the main body for the movement of the robot vacuum cleaner; and It includes a control panel (120) for controlling the operation of the robot vacuum cleaner, and The above control panel (120) is, Circuit board (510); Electronic components (520) placed on the above circuit board; A shield can (540) formed to be combined with the circuit board and to surround the electronic component; A heat sink (550) disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and It includes a heat transfer member (530) disposed between the electronic component and the heat sink, and A robot vacuum cleaner comprising a shield can that includes a support portion (541) that supports the heat sink, a side wall (543) that extends from the support portion and is formed to surround at least a portion of the heat sink, and a fastening portion (547) that is formed inside the side wall and is coupled to the heat sink.
  2. In Article 1, A robot vacuum cleaner, wherein the shield can comprises at least one opening (540a) formed to contact the heat transfer member and the heat sink.
  3. In Article 2, A robot vacuum cleaner, wherein at least a portion of the heat transfer member is formed to penetrate the opening and configured to diffuse heat generated from the electronic component in contact with the heat sink.
  4. In any one of paragraphs 1 to 3, A robot vacuum cleaner, wherein the side wall of the shield can comprises a lower side wall (5432) spaced apart from the electronic component and the heat transfer member, and an upper side wall (5431) extending from a portion of the lower side wall and formed to surround the heat sink.
  5. In any one of paragraphs 1 to 4, A robot vacuum cleaner comprising a plurality of hooks (5471; 5472) that protrude from the inner side of the side wall and are connected to the base of the heat sink, the fastening portion of the shield can.
  6. In any one of paragraphs 1 to 5, A robot vacuum cleaner, wherein a portion of the lower part of the side wall of the shield can positioned below the above-mentioned fastening portion forms a recess (549) with an opening at the bottom, and the recess is configured to disperse the impact generated in the shield can when the heat sink presses the fastening portion and is joined.
  7. In any one of paragraphs 1 through 6, A robot vacuum cleaner comprising a plurality of heat dissipation fins (552) arranged perpendicular to the circuit board to facilitate heat dissipation, and a base (551) supporting the plurality of heat dissipation fins and mounted on the shield can.
  8. In Article 7, A robot vacuum cleaner, wherein a portion of the upper surface of the base of the heat sink forms a flat surface (553) for easy adsorption with an external suction gripper.
  9. In Article 8, The flat surface of the heat sink is a robot vacuum cleaner positioned along the central area of the base.
  10. In Article 8, The flat surface of the heat sink is arranged along the two edge regions of the base, a robot vacuum cleaner.
  11. In any one of paragraphs 1 through 10, A robot vacuum cleaner, wherein the support portion of the shield can comprises an edge portion (5411) that supports an edge region of the heat sink, and an extension portion (5412) that extends to connect regions facing each other among the edge portions (5411) and supports a center region of the heat sink.
  12. In Article 11, A robot vacuum cleaner in which a portion of the extension part of the shield can includes a flat surface for easy adsorption with an external suction gripper.
  13. In Article 11 or Article 12, A robot vacuum cleaner, wherein the extended portion of the shield can extends downward to be coupled with the circuit board and is configured to partition the space within the shield can for shielding between a plurality of electronic components.
  14. In any one of paragraphs 1 to 13, A robot vacuum cleaner in which the heat sink seated on the shield can is configured such that horizontal movement is restricted by the upper side wall (5431) of the shield can and vertical movement is restricted by the fastening part (547) of the shield can (540).
  15. In any one of paragraphs 1 through 10, A case (420) covering the shield can and the heat sink; and It further includes an air space formed between the heat sink and the case, A robot vacuum cleaner configured such that the air space above is configured to circulate heat diffused from the heat sink.
  16. In the case of home appliances, It includes a control panel (120) for controlling the operation of the above-mentioned home appliance, and The above control panel (120) is, Circuit board (510); Electronic components (520) placed on the above circuit board; A shield can (540) formed to be combined with the circuit board and to surround the electronic component; A heat sink (550) disposed on the shield can and having a plurality of heat dissipation fins arranged to diffuse heat generated by the electronic component, and It includes a heat transfer member (530) disposed between the electronic component and the heat sink, and The above shield can comprises a support portion (541) that supports the heat sink, a side wall (543) that extends from the support portion and is formed to surround at least a portion of the heat sink, and a fastening portion (547) that is formed inside the side wall and is coupled to the heat sink.
  17. In Article 16, A home appliance, wherein at least a portion of the heat transfer member is formed to penetrate the opening of the shield can and configured to diffuse heat generated from the electronic component in contact with the heat sink.
  18. In Article 16 or Article 17, A home appliance, wherein the side wall of the shield can comprises a lower side wall (5432) spaced apart from the electronic component and the heat transfer member, and an upper side wall (5431) extending from a portion of the lower side wall and formed to surround the heat sink.
  19. In any one of paragraphs 16 through 18, A home appliance, wherein a portion of the lower part of the side wall of the shield can positioned below the above-mentioned fastening portion forms a recess (549) with an open lower side, and the recess is configured to disperse the impact generated in the shield can when the heat sink presses the fastening portion and is joined.
  20. In any one of paragraphs 16 through 19, The above heat sink comprises a plurality of heat dissipation fins (552) arranged in a direction perpendicular to the circuit board to facilitate heat dissipation, a base (551) supporting the plurality of heat dissipation fins and seated on the shield can, and a flat surface (553) positioned adjacent to the plurality of heat dissipation fins (552) and for easy adsorption with an external suction gripper.

Description

Home appliances including a radiation structure Various embodiments of the present disclosure relate to a heat dissipation structure for shielding electromagnetic noise of electronic components placed inside a home appliance and dissipating heat generated from electronic components, and a home appliance including the same. Generally, home appliances include a circuit board assembly (e.g., a printed board assembly (PBA)) for driving the appliance's components (e.g., a display). The circuit board assembly is typically located within a limited space inside the home appliance. In such situations, for home appliances with sufficient space for airflow, the heat generated by electronic components (e.g., processors) placed on the circuit board assembly can be managed normally. However, for appliances with severe space constraints or high-temperature environments (e.g., robot vacuums, cooking appliances, air conditioners, washing machines (or dryers), or refrigerators), there is insufficient space for airflow, making it difficult to effectively dissipate the heat generated from the circuit board assembly. If heat is not effectively dissipated, the temperature of the electrical components placed on the circuit board assembly rises. This can lead to performance degradation of the electronic components. Accordingly, a heat dissipation structure and a design of a home appliance including the heat dissipation structure are discussed for effectively dissipating heat generated in the circuit board assembly of the home appliance, even in high-temperature environments and/or environments with space constraints. FIG. 1 is a perspective view of a robot vacuum cleaner according to one embodiment of the present disclosure. FIG. 2 is a drawing of a robot vacuum cleaner viewed from below, according to one embodiment of the present disclosure. FIG. 3 is a block diagram illustrating the relationships between components, focusing on the control and operation of a robot vacuum cleaner according to one embodiment of the present disclosure. FIG. 4 is an exploded perspective view showing a circuit board, a display module, and a case having a shielding and heat dissipation structure arranged thereon, according to one embodiment of the present disclosure. FIG. 5 is a perspective view showing a structure (e.g., a heat dissipation structure) for shielding and heat dissipation of an electronic component according to one embodiment of the present disclosure. FIG. 6 is a cross-sectional view taken along the A-A' direction of FIG. 5 of a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure) according to one embodiment of the present disclosure. FIG. 7 is a cross-sectional view taken along the B-B' direction of FIG. 5 of a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure) according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view showing a heat dissipation path of a heat dissipation structure according to one embodiment of the present disclosure. FIG. 9 is a top view of a heat dissipation structure according to one embodiment of the present disclosure. FIG. 10 is a top view of a heat dissipation structure with a heat sink (heat transfer member) excluded, according to one embodiment of the present disclosure. FIG. 11 is a top view of a shield can according to one embodiment of the present disclosure. FIG. 12 is a view of a shield can according to one embodiment of the present disclosure, seen from below. FIG. 13 is a diagram showing the connection between a circuit board and a shield can viewed from the side of a heat dissipation structure according to one embodiment of the present disclosure. FIG. 14 is a view of the upper surface of a circuit board with a heat dissipation structure according to one embodiment of the present disclosure. FIG. 15 is a perspective view showing a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure (500a)) according to one embodiment of the present disclosure. FIG. 16 is a perspective view showing a structure for shielding and heat dissipation of an electronic component (e.g., a heat dissipation structure (500b)) according to one embodiment of the present disclosure. Figure 17a is a graph showing the temperature change of an electronic component inside a typical shield can in a high-temperature chamber. FIG. 17b is a graph showing the temperature change of an electronic component with respect to a heat dissipation structure in a high-temperature chamber according to one embodiment of the present disclosure (the embodiment of FIG. 16). FIG. 17c is a graph showing the temperature change of an electronic component with respect to a heat dissipation structure in a high-temperature chamber according to one embodiment of the present disclosure (the embodiment of FIG. 5 to 7). FIG. 18a is a perspective view of a cooking appliance