KR-20260064405-A - PRINTED CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

KR20260064405AKR 20260064405 AKR20260064405 AKR 20260064405AKR-20260064405-A

Abstract

A printed circuit board assembly according to various embodiments may include a printed circuit board (PCB), an opening penetrating the printed circuit board, a first metal member formed in only a portion of a first inner surface of the opening, a second metal member formed in only a portion of a second inner surface facing the first inner surface of the opening, a solder cream applied to surround at least a portion of the opening on the upper surface of the printed circuit board, and an electronic component including a terminal inserted into the space between the first metal member and the second metal member of the opening, wherein when viewed in a direction perpendicular to the first inner surface, the first metal member and the second metal member are arranged to overlap and the terminal may be aligned between the first metal member and the second metal member. In addition to this, various embodiments identified in this document are possible.

Inventors

권오대
김주호
민유석

Assignees

삼성전자주식회사

Dates

Publication Date: 20260507
Application Date: 20241120
Priority Date: 20241030

Claims (20)

In a printed circuit board assembly, Printed circuit board (PCB); An opening penetrating the above printed circuit board; A first metal member formed only in a partial area on the first inner surface of the above-mentioned opening; A second metal member formed only in a partial area on a second inner surface facing the first inner surface of the opening; A solder cream applied to the upper surface of the printed circuit board to surround at least a portion of the opening; and An electronic component comprising a terminal inserted into the space between the first metal member and the second metal member of the opening; Includes, A printed circuit board assembly in which, when viewed in a direction perpendicular to the first inner surface, the first metal member and the second metal member are arranged to overlap and the terminal is aligned between the first metal member and the second metal member.
In claim 1, The first metal member is formed to have a shape protruding from the first inner surface toward the second inner surface, and A printed circuit board assembly in which the second metal member is formed to have a shape protruding from the second inner surface toward the first inner surface.
In claim 2, The first metal member is formed on the first inner surface through plating molding, and A printed circuit board assembly in which the second metal member is formed on the second inner surface through plating molding.
In claim 1, The above electronic component is, A body portion disposed on the above printed circuit board; It further includes a connection terminal protruding from the side of the body portion and electrically connected to a conductive component; The above terminal is a printed circuit board assembly protruding from the lower surface of the body part.
In claim 4, The above connection terminal is a printed circuit board assembly that protrudes from the side of the body portion and contacts the conductive component.
In claim 1, The first metal member is formed to extend from the first inner surface to the upper surface of the printed circuit board, and A printed circuit board assembly in which the second metal member is formed to extend from the second inner surface to the upper surface of the printed circuit board.
In claim 1, A printed circuit board assembly in which, while the solder cream is curing, at least a portion of the solder cream flows into the internal space of the opening along the first metal member and the second metal member.
In claim 7, A printed circuit board assembly in which the above solder cream is cured through at least one of a thermal curing process or a UV (ultraviolet) curing process.
In claim 1, A non-conductive solution injected into the empty space within the internal space of the opening, excluding the first metal member, the second metal member, and the terminal; A printed circuit board assembly further comprising
In claim 1, The above opening includes a third inner surface and a fourth inner surface facing the third inner surface, and The third inner surface extends from one end of the first inner surface, and The above-mentioned fourth inner surface extends from the other end of the above-mentioned first inner surface, and A printed circuit board assembly in which, when viewed in a direction perpendicular to the upper surface of the printed circuit board, the width of the first inner surface and the width of the second inner surface are each larger than the width of the third inner surface and the width of the fourth inner surface.
In claim 10, A printed circuit board assembly in which the first metal member and the second metal member are formed spaced apart from the third inner surface and the fourth inner surface.
In claim 10, A printed circuit board assembly further comprising a third metal member formed in at least a portion of the third inner surface.
In Article 12, A printed circuit board assembly further comprising a fourth metal member formed in at least a portion of the fourth inner surface.
In claim 10, A printed circuit board assembly in which, when viewed in a direction perpendicular to the upper surface of the printed circuit board, the width of the first metal member corresponds to the width of the second metal member.
In claim 1, A printed circuit board assembly in which, when viewed in a direction perpendicular to the upper surface of the printed circuit board, the opening is formed to have the shape of either an ellipse or a polygon.
In a method for manufacturing a printed circuit board assembly, The operation of forming a first metal member only in a portion of the first inner surface of an opening penetrating a printed circuit board; The operation of forming a second metal member only in a portion of the second inner surface facing the first inner surface of the opening; The action of applying solder cream to the upper surface of the printed circuit board to surround at least a portion of the opening; The operation of inserting a terminal of an electronic component between the first metal member and the second metal member; and The operation of curing the above-mentioned applied solder cream; A manufacturing method comprising
In claim 16, A manufacturing method in which the operation of forming the second metal member is to form the second metal member such that, when viewed in a direction perpendicular to the first inner surface, the second metal member overlaps at least partially with the first metal member.
In claim 17, The operation of injecting a non-conductive solution into the empty space within the internal space of the opening, excluding the first metal member, the second metal member, and the terminal; and A manufacturing method further comprising the action of curing the above non-conductive solution.
In claim 18, A manufacturing method in which at least a portion of the solder cream is introduced into the internal space of the opening along the first metal member and the second metal member while the solder cream is curing.
In claim 16, The step of curing the above solder cream is, A manufacturing method comprising curing the solder cream through at least one of a thermal curing process or a UV (ultraviolet) curing process.

Description

Printed circuit board assembly and manufacturing method thereof Various embodiments according to the present disclosure relate to a printed circuit board assembly including a printed circuit board and a method for manufacturing the same. As the size of electronic devices is gradually becoming smaller while their functions are becoming more diverse, it has become important to secure space where electronic components (e.g., processors, communication circuits, or memory) required to perform these various functions can be arranged at high density. Electronic components can be placed on the upper and lower surfaces of a printed circuit board inside an electronic component. The electronic component can be placed such that its lower surface contacts the printed circuit board of the electronic device. The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure. FIG. 1 is a perspective view for illustrating a printed circuit board with electronic components attached thereto, according to one embodiment of the present disclosure. FIG. 2 is a perspective view illustrating an example in which an electronic component fixed to a printed circuit board is connected to another conductive component according to one embodiment of the present disclosure. FIG. 3 is a cross-sectional view of a printed circuit board according to one embodiment of the present disclosure. FIG. 4 is a cross-sectional view of a printed circuit board C-C' according to one embodiment of the present disclosure. FIG. 5 is a cross-sectional view of an electronic component inserted into a printed circuit board according to one embodiment of the present disclosure. FIG. 6 is a side cross-sectional view of a printed circuit board assembly including an electronic component inserted into a printed circuit board according to one embodiment of the present disclosure. FIG. 7 is a side cross-sectional view of a printed circuit board assembly including an electronic component inserted into a printed circuit board according to one embodiment of the present disclosure. FIG. 8 is a drawing illustrating a solder cream cured within an opening and a non-conductive solution injected into the internal space of the opening, according to one embodiment of the present disclosure. FIG. 9 is a drawing illustrating an example in which terminals of an electronic component according to one embodiment of the present disclosure are aligned between a first metal member and a second metal member. FIG. 10 is a drawing illustrating a form in which a metal member is formed according to various embodiments of the present disclosure. FIG. 11 is a drawing illustrating a form in which a metal member is formed and a non-conductive solution is injected according to various embodiments of the present disclosure. FIG. 12 is a drawing illustrating the shape of an opening according to various embodiments of the present disclosure. FIG. 13 is a flowchart illustrating a method for manufacturing a printed circuit board assembly according to one embodiment of the present disclosure. FIG. 14 is a drawing for explaining the manufacturing process of a printed circuit board assembly according to one embodiment of the present disclosure. FIG. 15 is a drawing illustrating an example in which the position of a terminal of an electronic component is corrected and a non-conductive solution is injected, according to one embodiment of the present disclosure. FIG. 16 is a block diagram of an electronic device in a network environment according to various embodiments. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this invention belongs from the description below. Hereinafter, embodiments are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein. The terms used in this disclosure are described in their current, general form considering the functions mentioned herein; however, they may refer to various other terms depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Accordingly, the terms used in this disclosure should not be interpreted solely by their names, but should be interpreted based on the meaning of the terms and the overall content of this disclosure. Additionally, terms such as "first," "second," etc., may be used to describe various components, but th