Search

KR-20260064406-A - ELECTRONIC DEVICE INCLUDING FRAME AND METHOD FOR MANUFACTUREING FRAME

KR20260064406AKR 20260064406 AKR20260064406 AKR 20260064406AKR-20260064406-A

Abstract

According to various embodiments of the present disclosure, a frame of an electronic device is provided, the frame comprises a first metal part forming at least a portion of the side of the electronic device, a second metal part located inside the electronic device, a conductive adhesive member disposed between the first metal part and the second metal part, a first non-metal member located inside the electronic device and bonded to the conductive adhesive member, the first metal part, and the second metal part, and a second non-metal member located at least a portion inside the electronic device and bonded to the first non-metal member, the first metal part, and the second metal part, and the bonding surface between the conductive adhesive member and the first non-metal member includes an uneven surface.

Inventors

  • 윤권득
  • 이호순
  • 김현진
  • 윤재훈
  • 문병수
  • 서성철
  • 윤철웅
  • 정영수
  • 최현석

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20241121
Priority Date
20241030

Claims (20)

  1. In the frame (14) of the electronic device (1), A first metal part (31) forming at least a portion of the side (10C) of the electronic device (1); A second metal part (32) located inside the electronic device (1); A conductive adhesive member (4) disposed between the first metal part (31) and the second metal part (32); A first non-metallic member (51) located inside the electronic device (1) and bonded to the conductive adhesive member (4), the first metal part (31), and the second metal part (32); and It comprises a second non-metallic member (52) that is located at least partially inside the electronic device (1) and is joined to the first non-metallic member (51), the first metal part (31), and the second metal part (32). The bonding surface (605) between the conductive adhesive member (4) and the first non-metallic member (51) is a frame including irregularities.
  2. In Article 1, The first non-metallic member (51) is a frame that covers the conductive adhesive member (4) so that the conductive adhesive member (4) is not exposed to the outside.
  3. In Article 1, The first metal part (31) includes a key hole (701) in which a side key (212) is located, and The above conductive adhesive member (4) is a frame that does not extend into the key hole (701) so as not to be exposed to the outside through the key hole (701).
  4. In Article 1, The irregularities included in the bonding surface (605) between the conductive adhesive member (4) and the first non-metallic member (51) are, A plurality of grooves formed in the conductive adhesive member (4), and A frame comprising a plurality of protrusions of the first non-metallic member (51) inserted into the plurality of grooves of the conductive adhesive member (4).
  5. In Article 4, The plurality of grooves of the conductive adhesive member (4) are a frame formed by transfer by a film (1420) having an uneven surface.
  6. In Article 1, The joining surface (606) between the first non-metallic member (51) and the second non-metallic member (52) is a frame including irregularities.
  7. In Article 6, The first non-metallic member (51) is formed through primary molding, and The second non-metallic member (52) is formed through secondary molding, and The irregularities included in the joining surface (606) between the first non-metallic member (51) and the second non-metallic member (52) are, A plurality of grooves formed in the first non-metallic member (51) through the first molding, and A frame comprising a plurality of protrusions of the second non-metallic member (52) inserted into the plurality of grooves of the first non-metallic member (51).
  8. In Article 1, The joint surface (607) between the second non-metallic member (52) and the first metal part (31), and the joint surface (608) between the second non-metallic member (52) and the second metal part (32) are a frame including irregularities.
  9. In Article 8, The irregularities included in the joining surface (607) between the second non-metallic member (52) and the first metal part (31), and the joining surface (608) between the second non-metallic member (52) and the second metal part (32), are A plurality of pores formed in the first metal part (31) and the second metal part (32), and A frame comprising a plurality of protrusions of the second non-metallic member (52) inserted into the plurality of pores of the first metal part (31) and the second metal part (32).
  10. In Article 9, The plurality of pores formed in the first metal part (31) and the second metal part (32) are a frame formed through anodizing.
  11. In Article 1, The first non-metallic member (51) is a frame that does not contain inorganic material or has a lower inorganic content than the second non-metallic member (52).
  12. In Article 1, A frame in which the first metal part (31) is formed of titanium and the second metal part (32) is formed of aluminum.
  13. In Article 1, A portion of the second non-metallic member (52) is located in at least one segment formed in the first metal part (31), and together with the first metal part (31), forms the side (10C) of the electronic device (1) frame.
  14. In Article 1, The conductive adhesive member (4) comprises a plurality of openings (1001), and the second metal part (32) comprises a plurality of recesses (1002) aligned with the plurality of openings (1001) of the conductive adhesive member (4).
  15. In the method of manufacturing the frame (14), Operation (1201) of forming the first base material (1310) and the second base material (1320); The operation (1203) of joining the first base material (1310) and the second base material (1320) through a conductive adhesive member (1330) and forming a first uneven adhesive surface (1901) for the first molding on the conductive adhesive member (1330); An operation (1205) of forming a first molding part (1340) that is joined to the first base material (1310), the second base material (1320), and the conductive adhesive member (1330) through the first molding above, and includes a second uneven adhesive surface (1902) for the second molding; The operation (1209) of forming a third uneven adhesive surface (1903) for the second molding on the first base material (1310) and forming a fourth uneven adhesive surface (1904) for the second molding on the second base material (1320); and A method comprising the operation (1211) of forming the first base material (1310), the second base material (1320), and the second molding part (1350) joined to the first molding part (1340) through the second molding above.
  16. In Article 15, The first molding part (1340) is a method of covering the conductive adhesive member (1330) so that the conductive adhesive member (1330) is not exposed to the outside.
  17. In Article 16, A method in which the first uneven adhesive surface (1901) of the conductive adhesive member (1330) is formed by transferring a film (1420) having an uneven surface.
  18. In Article 16, The above third uneven adhesive surface (1903) and the above fourth uneven adhesive surface (1904) are formed by a method of anodizing.
  19. In Article 16, A method in which the first molding liquid of the above-mentioned first molding does not contain inorganic material or has a smaller amount of inorganic material than the second molding liquid of the above-mentioned second molding.
  20. In Article 19, A method in which the first molding liquid of the above-mentioned first molding comprises a thermosetting resin.

Description

ELECTRONIC DEVICE INCLUDING FRAME AND METHOD FOR MANUFACTUREING FRAME The present disclosure relates to an electronic device including a frame and a method for manufacturing the frame. The frame of the electronic device may include heterogeneous metal parts joined together through an adhesive material. The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure. During the manufacturing process of the frame, the adhesive material may be damaged or contaminated by impact (e.g., cutting impact) or heat that may occur during at least one process, such as external shape processing, making it difficult to secure bonding strength between dissimilar metal parts using only the adhesive material. Various embodiments of the present disclosure provide an electronic device including a frame capable of improving bonding strength between dissimilar metal parts and a method for manufacturing the frame. The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be understood by those skilled in the art from the description below. According to various embodiments of the present disclosure, a frame of an electronic device is provided, the frame comprising a first metal part, a second metal part, a conductive adhesive member, a first non-metal member, and a second non-metal member. The first metal part forms at least a portion of the side of the electronic device. The second metal part is located inside the electronic device. A conductive adhesive member is disposed between the first metal part and the second metal part. The first non-metal member is located inside the electronic device and is bonded to the conductive adhesive member, the first metal part, and the second metal part. The second non-metal member is located inside the electronic device and is bonded to the first non-metal member, the first metal part, and the second metal part. The bonding surface between the conductive adhesive member and the first non-metal member includes irregularities. According to various embodiments of the present disclosure, a method for manufacturing a frame is provided, the method of manufacturing including the action of forming a first base material and a second base material. The method of manufacturing a frame includes the action of joining the first base material and the second base material through a conductive adhesive member and forming a first uneven adhesive surface for a first molding on the conductive adhesive member. The method of manufacturing a frame includes the action of forming a first molding portion that is joined to the first base material, the second base material, and the conductive adhesive member through a first molding and includes a second uneven adhesive surface for a second molding. The method of manufacturing a frame includes the action of forming a third uneven adhesive surface for a second molding on the first base material and forming a fourth uneven adhesive surface for a second molding on the second base material. The method of manufacturing a frame includes the action of forming a second molding portion joined to the first base material, the second base material, and the first molding portion through a second molding. An electronic device including a frame and a method for manufacturing the frame according to embodiments of the present disclosure can reduce bonding problems between dissimilar metal parts and improve bonding strength between dissimilar metal parts. In addition, other effects that can be obtained or predicted by the various embodiments of the present disclosure will be disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure. The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken together with the accompanying drawings. FIG. 1 is a drawing showing various aspects of an electronic device according to various embodiments of the present disclosure. FIG. 2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3 is a drawing showing a frame according to various embodiments of the present disclosure. FIG. 4 is a cross-sectional view of a portion of a frame cut along line A-A' of FIG. 3 according to various embodiments of the present disclosure. FIG. 5 is a cross-sectional view of a portion of a frame cut along line B-B' of FIG. 3 according to various embodiments of the present disclosure. FIG. 6 is a cross-sectional view of a portion of a frame cut along line C-C' of FIG. 3 according to various embodiments of the present disclosure. FIG. 7 is a cross-sectional perspective view of