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KR-20260064418-A - ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION MATERIAL

KR20260064418AKR 20260064418 AKR20260064418 AKR 20260064418AKR-20260064418-A

Abstract

The present disclosure relates to an electronic device. An electronic device according to one embodiment of the present disclosure may include a hole connected to the interior of a shield can so that a heat dissipation material injected into the interior of a substrate assembly flows into the interior of the shield can. An electronic device according to one embodiment of the present disclosure may include at least one guide element disposed around the hole into which the heat dissipation material flows so that the heat dissipation material injected into the interior of a substrate assembly flows easily into the interior of the shield can.

Inventors

  • 이재범
  • 여문기
  • 이도현
  • 이준호
  • 최승범

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20241211
Priority Date
20241031

Claims (20)

  1. In the electronic device (101), A housing (210) forming the exterior of the above electronic device (101); It includes a circuit board assembly (M) disposed inside the above housing (210), and The above circuit board assembly (M) is: A first printed circuit board (310) comprising a first surface (311) and a second surface (312) opposite to the first surface (311); A second printed circuit board (320) including a third surface (321) facing the first surface (311); An interposer (330) disposed between the first printed circuit board (310) and the second printed circuit board (320) to form a first space (S1) together with the first printed circuit board (310) and the second printed circuit board (320), and configured to electrically connect the first printed circuit board (310) and the second printed circuit board (320); A shield can (410, 420) disposed on the second surface (312) of the first printed circuit board (310) to form a second space (S2) together with the first printed circuit board (310); Inlet holes (314, 315) formed in the first printed circuit board (310); A heat dissipation material (600) disposed in the first space (S1) and the second space (S2); and An electronic device comprising at least one guide element (511, 512, 521, 522) configured to guide a portion of the gel-state heat dissipation material (600) injected into the first space (S1) to flow into the second space (S2) through the inlet hole (314, 315).
  2. In Article 1, It further includes an injection hole (313) formed in the first printed circuit board (310) or the second printed circuit board (320) and configured to connect the outside of the circuit board assembly (M) with the first space (S1). An electronic device in which, when viewed from above on the first surface (311) of the first printed circuit board (310), the inlet hole (314, 315) is located between the injection hole (313) and the at least one guide element (511, 512, 521, 522).
  3. In Article 2, The above at least one guide element (511, 512, 521, 522) is, An electronic device formed on at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320), and positioned to at least partially surround the inlet hole (314, 315) at a position (311A) spaced apart from the area (311B) between the inlet hole (314, 315) and the injection hole (313).
  4. In Article 2 or Article 3, The above guide elements (511, 512, 521, 522) are: An electronic device comprising a first guide element (511, 521) spaced apart in a first direction from the inlet hole (314, 315) when viewed from above on a first surface (311) of the first printed circuit board (310), and a second guide element (512, 522) spaced apart in a second direction intersecting the first direction from the inlet hole (314, 315).
  5. In any one of paragraphs 2 through 4, The surrounding area (311S) of the above-mentioned inlet holes (314, 315) is: A first region (311B) located between the injection hole (313) and the inflow holes (314, 315); and An electronic device comprising a second region (311A) spaced apart from the first region (311B), surrounding the inlet hole (314, 315), and having the guide element (511, 512, 521, 522) disposed therein.
  6. In any one of paragraphs 1 to 5, The above circuit board assembly (M) is, An electronic device further comprising an electronic component (E) disposed on a fourth side (322) opposite to a third side (321) of the second printed circuit board (320), and at least partially overlapping with the shield can (410, 420) when viewed from above on the fourth side (322) of the second printed circuit board (320).
  7. In Article 6, When viewed from above on the first printed circuit board (1310), the inlet hole (1314) is an electronic device that overlaps with the electronic component (E').
  8. In Article 6 or Article 7, The above guide elements (2511, 2512, 2521, 2522) are, An electronic device comprising a decoupling capacitor disposed on the third side (321) of the second printed circuit board (320) and connected to the electronic component (E).
  9. In any one of paragraphs 6 through 8, A first heat diffusion sheet (V1) configured to be spaced apart from the circuit board assembly (M) in the direction toward which the second surface (312) of the first printed circuit board (310) faces, and to diffuse heat generated from the circuit board assembly (M); and An electronic device further comprising a second heat diffusion sheet (V2) configured to diffuse heat generated from the circuit board assembly (M), spaced apart from the circuit board assembly (M) in the direction toward which the fourth side (322) of the second printed circuit board (320) faces.
  10. In Article 9, The above heat dissipation material (600) is, It includes a first part (610) disposed in the first space (S1) and a second part (620, 630) disposed in the second space (S2), The electronic component (E) is located between the second heat diffusion sheet (V2) and the first part (610) of the heat dissipation material (600), and The second portion (620, 630) of the heat dissipation material (600) is an electronic device located between the first heat diffusion sheet (V1) and the first portion (610) of the heat dissipation material (600).
  11. In any one of paragraphs 1 through 10, When viewed from above on the second surface (312) of the first printed circuit board (310), the inlet hole (314, 315) is covered by the shield can (410, 420) of the electronic device.
  12. In any one of paragraphs 1 through 11, An electronic device in which the height of the guide element (511, 512, 521, 522) protruding from at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320) is greater than half the gap between the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320).
  13. In any one of paragraphs 2 through 5, The above circuit board assembly (M) is: The first printed circuit board (310) is formed and includes an inspection hole (317, 318) spaced apart from the injection hole (313) in a direction intersecting the direction in which the inlet hole (314, 315) is spaced apart from the injection hole (313). An electronic device configured such that a portion (610) of the heat dissipation material (600) placed in the first space (S1) is visually exposed to the outside of the circuit board assembly (M) through the inspection holes (317, 318).
  14. In Article 13, The above inspection holes (317, 318) are, An electronic device spaced further from the injection hole (313) than from the inflow hole (314, 315).
  15. In any one of paragraphs 1 through 14, The above heat dissipation material (600) is: A first part (610) disposed in the first space (S1); and An electronic device comprising a second part (620, 630) disposed in the second space (S2) and overlapping with the first part (610) when viewed from above on the second surface (312) of the first printed circuit board (310).
  16. In the electronic device (101), A housing (210) that forms the exterior of the electronic device (101) at least partially; It includes a circuit board assembly (M) disposed inside the above housing (210), and The above circuit board assembly (M) is: A first printed circuit board (310) comprising a first surface (311) and a second surface (312) opposite to the first surface (311); A second printed circuit board (320) including a third surface (321) that is spaced apart from the first printed circuit board (310) and faces the first surface (311); An interposer (330) disposed between the first surface (311) and the third surface (321) and electrically connecting the first printed circuit board (310) and the second printed circuit board (320); A first hole (313) disposed on the first printed circuit board (310) or the second printed circuit board (320) and connecting the outside of the circuit board assembly (M) to a first space (S1) defined by the first printed circuit board (310), the second printed circuit board (320), and the interposer (330); A shield can (410, 420) disposed on the second side (312) of the first printed circuit board (310); A second hole (314, 315) disposed on the first printed circuit board (310) and connecting the first space (S1) to a second space (S2) defined by the shield can (410, 420) and the first printed circuit board (310); and An electronic device comprising a gel-type heat dissipation material (600) configured to be introduced into the first space (S1) through the first hole (313) and into the second space (S2) through the second hole (314, 315).
  17. In Article 16, The above circuit board assembly (M) is, An electronic device further comprising an electronic component (E) disposed on a fourth side (322) opposite to a third side (321) of the second printed circuit board (320), and at least partially overlapping with the shield can (410, 420) when viewed from above on the fourth side (322) of the second printed circuit board (320).
  18. In Article 16 or Article 17, The above circuit board assembly (M) is: The first printed circuit board (310) is disposed therein and includes a third hole (317, 318) spaced apart from the first hole (313) in a direction intersecting the direction in which the second hole (314, 315) is spaced apart from the first hole (313). An electronic device configured such that a portion (610) of the heat dissipation material (600) disposed in the first space (S1) is visually exposed to the outside of the circuit board assembly (M) through the third hole (317, 318).
  19. In any one of paragraphs 16 through 18, When viewed from above on the second surface (312) of the first printed circuit board (310), the second hole (314, 315) is covered by the shield can (410, 420) of the electronic device.
  20. In any one of paragraphs 16 through 19, The above heat dissipation material (600) is: A first part (610) disposed in the first space (S1); and An electronic device comprising a second part (620, 630) disposed in the second space (S2) and overlapping with the first part (610) when viewed from above on the second surface (312) of the first printed circuit board (310).

Description

Electronic device including heat dissipation material The present disclosure relates to an electronic device, for example, to an electronic device comprising a heat dissipation material. The term "electronic device" may refer to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. With the increasing integration density of electronic devices and the widespread adoption of high-speed, high-capacity wireless communication, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For example, not only communication functions but also entertainment functions like games, multimedia functions like music and video playback, communication and security functions like mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can carry them conveniently. FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2 is a perspective view of an electronic device showing the front of the electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device showing the rear side of the electronic device according to one embodiment of the present disclosure. FIG. 4 is an exploded perspective view of a circuit board assembly according to one embodiment of the present disclosure. FIG. 5 illustrates a circuit board assembly according to one embodiment of the present disclosure, viewed from above a first printed circuit board. FIG. 6 illustrates a circuit board assembly according to one embodiment of the present disclosure in which no heat dissipation material is injected, viewed from above on a first printed circuit board. FIG. 7 is a cross-sectional view of a circuit board assembly according to one embodiment of the present disclosure, cut along the line AA' shown in FIG. 5. FIG. 8 is a cross-sectional view taken along the BB' line shown in FIG. 6, illustrating the injection of a heat dissipation material. FIG. 9 illustrates a first printed circuit board viewed from above on a first surface, according to one embodiment of the present disclosure. FIG. 10 illustrates an enlarged view of a portion of a first surface according to one embodiment of the present disclosure illustrated in FIG. 9. FIG. 11 illustrates a circuit board assembly according to one embodiment of the present disclosure, viewed from above a first printed circuit board. FIG. 12 is a cross-sectional view of a circuit board assembly taken along the line AA' shown in FIG. 5, according to one embodiment of the present disclosure. FIG. 13 is a cross-sectional view of a circuit board assembly taken along the line AA' shown in FIG. 5, according to one embodiment of the present disclosure. The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described herein may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted. The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto. Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces. FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or wit