KR-20260064423-A - TRANSPARENCY-CONTROLLED ADHESIVE FILM FOR SEMICONDUCTORS AND METHOD OF MANUFACTURING THE SAME

Abstract

The present invention provides a semiconductor adhesive film comprising a base layer, a conductive layer formed on the base layer, and an adhesive layer formed on the conductive layer, wherein the haze value of the semiconductor adhesive film is 8% or more.

Inventors

• 이지문
• 장영훈
• 도상길
• 유경석
• 이규완
• 조한빈
• 하태용
• 송경미

Assignees

• 율촌화학 주식회사

Dates

Publication Date

20260507

Application Date

20241220

Priority Date

20241030

Claims (11)

1. base layer, A conductive layer formed on the above base layer and A semiconductor adhesive film comprising an adhesive layer formed on the above conductive layer, A semiconductor adhesive film having a haze value of 8% or more.
2. In claim 1, A semiconductor adhesive film having a haze value of 8% to 50%.
3. In claim 1, A semiconductor adhesive film having a total light transmittance (Tt) value of 50% or more.
4. In claim 1, The above semiconductor adhesive film is a semiconductor adhesive film having a surface resistance of 1 x 10¹¹ to 1 x 10¹³ Ω/sq when an external voltage of 1 kV is applied.
5. In claim 1, The above semiconductor adhesive film is a semiconductor adhesive film having a dielectric loss of 0.02 to 0.1 under conditions of 25 ℃ and 10 GHz.
6. In claim 1, The above semiconductor adhesive film is a semiconductor adhesive film having a dielectric constant of 2.8 to 3.3 under conditions of 25 ℃ and 10 GHz.
7. In claim 1, A semiconductor adhesive film having a surface roughness Ra value on the base layer side exposed to the outside of the semiconductor adhesive film, ranging from 55 nm to 70 nm.
8. In claim 7, A semiconductor adhesive film wherein the surface roughness of the base layer is controlled by using at least one of corona discharge treatment, plasma treatment, chemical treatment, primer treatment, addition of a slip agent, and addition of a filler.
9. In claim 8, The above filler is a semiconductor adhesive film that uses an inorganic filler.
10. In claim 9, A semiconductor adhesive film in which the content of the above-mentioned inorganic filler is included in an amount of 100% by weight to 0.01% by weight to 5% by weight of the base layer.
11. In claim 1, A semiconductor adhesive film having a thickness of 15 to 50 μm of the adhesive layer.

Description

Transparency-Controlled Adhesive Film for Semiconductors and Method of Manufacturing the Same The present invention relates to a semiconductor adhesive film with controlled transparency and a method for manufacturing the same. Recently, there has been an even greater demand for the thinning and miniaturization of semiconductor devices and their packages. Consequently, as semiconductor wafers become thinner, electrostatic chucks (ESCs) are utilized to effectively secure them. An electrostatic chuck is a device used to secure wafers in the semiconductor manufacturing process; it fixes the wafer using electrical force and, unlike conventional methods such as physical clamps or vacuum suction, minimizes damage caused by contact and provides uniform fixing force. In particular, wafer fixing technology utilizing electrostatic chucks is effective in minimizing physical damage and providing uniform fixing force. In such ESC systems, adhesive films are used to fix semiconductor wafers, which can serve to protect the wafer surface and prevent damage that may occur during the process. The adhesive film used in this process must generally be designed with a multilayer structure. Such films must minimize the occurrence of burrs or bubbles that may arise during the semiconductor process, and must be able to be cleanly removed without residue after the precision processing of the semiconductor wafer is completed. Various studies are currently underway to maintain these functions while enabling the semiconductor wafer to adhere to the electrostatic chuck and preventing wafer degradation caused by the voltage generated by the chuck. When the above adhesive film is adhered to a wafer, in order to verify whether the adhesive film is adhered to the correct position on the semiconductor wafer or whether pores have formed between the semiconductor wafer and the adhesive film after adhesion, an imaging device, such as a camera, within the semiconductor process needs to correctly recognize the semiconductor wafer, and for this purpose, the semiconductor adhesive film is required to have appropriate optical characteristics. For example, the semiconductor adhesive film needs to be transparent, but depending on the contained components, there may be cases where the transparency is reduced, such as becoming white, and if the reduction in transparency becomes significant, recognition by the imaging device becomes difficult. FIG. 1 is a schematic diagram showing a semiconductor film according to one embodiment of the present invention. Figure 2 is a photograph illustrating the measurement method during the measurement of Experimental Example 3. FIG. 3 is a schematic diagram showing the conditions under which a semiconductor film according to one embodiment of the present invention is placed when it is combined with a semiconductor wafer. Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. The present invention is not limited to specific embodiments and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention. In relation to the description of the drawings, similar reference numerals may be used for similar components. In this document, expressions such as "have," "can have," "include," or "can include" refer to the existence of the relevant feature (e.g., numerical values, functions, actions, or components, etc.) and do not exclude the existence of additional features. In this document, expressions such as “A or B,” “at least one of A or/and B,” or “one or more of A or/and B” may include all possible combinations of items listed together. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” may refer to cases including (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B. As used in this document, the expression "configured to" may be replaced, depending on the context, with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to." The terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embod