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KR-20260064429-A - A FLEXIBLE PRINTED CIRCUIT BOARD AND AN ELECTRONIC DEVICE INCLUDING THE SAME

KR20260064429AKR 20260064429 AKR20260064429 AKR 20260064429AKR-20260064429-A

Abstract

An electronic device according to one embodiment of the present disclosure comprises: a housing; a battery disposed within the housing; a wireless power receiver disposed within the housing and including a coil; a first circuit board; a second circuit board; and a flexible printed circuit board disposed between the wireless power receiver and the battery, comprising a first portion including a first end connected to the first circuit board, a second portion including a second end connected to the second circuit board, and a third portion connecting the first portion and the second portion, wherein, when viewed from above, the coil of the wireless power receiver overlaps and is connected between the first portion and the second portion, wherein the third portion comprises: a first substrate layer; a first wiring layer comprising a first-1 signal line disposed in a first region of the first substrate layer and a second-1 signal line disposed in a second region of the first substrate layer and spaced apart from the first-1 signal line in a first direction; a first dielectric layer disposed on the first wiring layer; and a first shielding layer disposed between the wireless power receiver and the first dielectric layer. An electronic device comprising: a second shielding layer disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein the second shielding layer is a second shielding layer (334b; 434b) that does not overlap with the first-1 signal line between the first substrate layer and the battery to reduce and/or prevent interference of a wireless signal by the second shielding layer, and wherein the thickness of the third portion is smaller than the thickness of the first portion (T1) and the thickness of the second portion.

Inventors

  • 김병준
  • 고병국
  • 박성원
  • 송찬미
  • 여문기
  • 이대규
  • 이영선
  • 이원호
  • 조경환

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260507
Application Date
20250113
Priority Date
20241030

Claims (20)

  1. In the electronic device (200), Housing (220); A battery (254) placed within the above housing; A wireless power receiver (302) including a coil (3021) and disposed within the housing; First circuit board (264a); Second circuit board (264b); and A flexible printed circuit board (301) comprising a first part (310) including a first end (3041) connected to a first circuit board and disposed between the wireless power receiver and the battery, a second part (320) including a second end (3032) connected to a second circuit board, and a third part (330; 430) connecting the first part and the second part, wherein when viewed from above, the coil of the wireless power receiver overlaps and is connected between the first part and the second part. The above third part is, First substrate layer (331a; 431a); A first wiring layer (332; 432) comprising a first-1 signal line (3321; 4321) disposed in a first region of the first substrate layer, and a second-1 signal line (3322; 4322) disposed in a second region of the first substrate layer and spaced apart from the first-1 signal line in a first direction; A first dielectric layer (333; 433) disposed on the first wiring layer above; A first shielding layer (334a; 434a) disposed between the wireless power receiver and the first dielectric layer; and A second shielding layer (334b; 434b) disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein, in order to reduce and/or prevent interference of wireless signals by the second shielding layer, the second shielding layer (334b; 434b) does not overlap with the first-1 signal line between the first substrate layer and the battery; and The thickness of the third part (T3') is smaller than the thickness of the first part (T1) and the thickness of the second part (T2) of the electronic device.
  2. In Article 1, The sum of the thickness of the third part and the coil (T3) corresponds to the thickness of the first part and the thickness of the second part, and The above third part is, A second substrate layer (331b) disposed between the first dielectric layer and the first shielding layer, A plurality of first-1 grounding sections (335a) spaced apart from each other on both sides of the first-1 signal line, A plurality of first-second grounding portions (335b) disposed between the first dielectric layer and the second substrate layer and spaced apart at positions corresponding to the plurality of first-first grounding portions, A plurality of 1-1 connecting portions (336a) that penetrate the first dielectric layer and connect the plurality of 1-1 ground portions and the plurality of 1-2 ground portions, and It further includes a plurality of first-2 connecting portions (336b) that penetrate the second substrate layer and connect the plurality of first-2 grounding portions and the first shielding layer, and The plurality of first-1 connecting parts and the plurality of first-2 connecting parts are configured to be grounded through the first shielding layer, and An electronic device in which the first shielding layer, the first-1 connection part, and the first-2 connection part surround at least a portion of the first-1 signal line to prevent and/or reduce the wireless signal interference.
  3. In Article 2, The flexible printed circuit board comprises a plurality of first conductive parts (303a), each including a plurality of first-1 connecting parts and a plurality of first-2 connecting parts, and The plurality of first conductive members are spaced apart from each other by a first distance (D1) along the first-1 signal line to shield the first-1 signal line together with the first shielding layer, The above first distance (D1) is an electronic device that is less than or equal to half of the first wavelength defined as the maximum frequency of the signal transmitted from the above first-1 signal line.
  4. In Article 2 or Article 3, An electronic device in which the thickness (Tb) of the second substrate layer is greater than the thickness (Ta) of the first substrate layer, such that the distance between the first signal line and the first shielding sheet is greater than the distance between the first signal line and the battery.
  5. In any one of paragraphs 1 to 4, The wireless power receiver has the flexible printed circuit board connecting the second circuit board and the first circuit board across the space between the battery and the wireless power transmitter, and The above wireless power receiver is an electronic device in contact with the first part and the second part where the coil of the above wireless power receiver is not placed.
  6. In any one of paragraphs 1 to 5, The above first part is, A second wiring layer (312) disposed on a first adhesive layer (3131) attached to a second dielectric layer (313a), comprising a first-2 signal line (3121) electrically connected to the first-1 signal line and a second-2 signal line (3122) electrically connected to the second-1 signal line; A second-second dielectric layer (313b) spaced apart from the second-first dielectric layer and disposed between the wireless power receiver and the second wiring layer, A plurality of 2-1 grounding sections (315a) spaced apart by a second distance from both sides of the above 1-2 signal line, The second-2 grounding portion (315b) disposed in the second-2 dielectric layer to partially overlap the plurality of spaced-apart second-1 grounding portions in a direction perpendicular to the first direction, A second-third grounding portion (315c) disposed on the coating layer and disposed to overlap the plurality of second-first grounding portions and the second-second grounding portions in a direction perpendicular to the first direction, A plurality of 2-1 connecting portions (316a) that penetrate the 2-2 dielectric layer and connect the plurality of 2-1 ground portions and the 2-2 ground portions, and It includes a plurality of 2-2 connecting parts (316b) that penetrate the 2-1 dielectric layer and connect the 2-1 grounding part and the 2-3 grounding part, and An electronic device configured such that the plurality of 2-1 connection parts, the plurality of 2-2 connection parts, the 2-2 ground part, and the 2-3 ground part surround at least a portion of the 1-2 signal line to prevent and/or reduce wireless signal interference of the 1-2 signal line.
  7. In any one of paragraphs 1 through 6, The above second part is, A third wiring layer (322) disposed on a second coating layer (327) in contact with the battery, comprising a first-3 signal line (3221) electrically connected to the first-1 signal line and a second-3 signal line (3222) electrically connected to the second-1 signal line, The third-1 dielectric layer (323a) disposed in the third wiring layer above, A third-2 dielectric layer (323b) spaced apart from the third-1 dielectric layer in a direction away from the third wiring layer, A plurality of 3-1 grounding sections (325a) spaced apart from both sides of the above 1-3 signal lines, A plurality of 3-2 grounding portions (325b) spaced apart from each other and positioned on a 2 adhesive layer (3231) attached to the 3-1 dielectric layer, corresponding to the 3-1 grounding portions, A third-3 grounding portion (325c) disposed in the third-2 dielectric layer so as to overlap the third-1 grounding portion and the third-2 grounding portion in a direction perpendicular to the first direction, and It includes a second conductive part (303b) comprising a plurality of third-1 connecting parts (326a) that penetrate the third-1 dielectric layer and connect the plurality of third-1 grounding parts and the plurality of third-2 grounding parts, and a plurality of third-2 connecting parts (326b) that penetrate the third-2 dielectric layer and connect the plurality of third-2 grounding parts and the third-3 grounding part. An electronic device configured such that the second conductive part surrounds at least a portion of the first-3 signal line together with the third-1 grounding part, the third-2 grounding part and the third-3 grounding part to prevent and/or reduce wireless signal interference of the first-3 signal line.
  8. In Article 6 or Article 7, The first shielding layer and the second substrate layer are in contact with the wireless power receiver and extend from the second portion so as to be disposed in the first portion and the third portion, and The first shielding layer is an electronic device in contact with the wireless power receiver.
  9. In any one of paragraphs 1 through 8, The first part includes a first-2 signal line (3121) electrically connected to the first-1 signal line, and the second part includes a first-3 signal line (3221) electrically connected to the first-1 signal line. The width of the first-2 signal line is smaller than the width of the first-3 signal line and the width of the first-1 signal line, and An electronic device in which the width of the first-3 signal line is greater than the width of the first-1 signal line, and the distance (L4) between the first-3 signal line and the third-3 ground portion is greater than the distance (L3) between the first-1 signal line and the first shielding layer.
  10. In any one of paragraphs 1 through 9, The above third portion further includes a third-1 signal line (3323; 4323) disposed between the first dielectric layer and the second substrate layer, and The above 2-1 signal line and the above 3-1 signal line are configured to transmit signals and power transmitted from outside the electronic device to a first circuit board inside the housing through the first end, and The above-mentioned first-1 signal line is an electronic device configured to transmit a wireless signal transmitted from outside the electronic device to the first circuit board through the first end.
  11. In any one of paragraphs 1 through 10, The first shielding layer is an electronic device having electrical conductivity greater than that of the second shielding layer.
  12. In any one of paragraphs 1 through 11, The electronic device is configured such that a portion (381) of the second end is configured to transmit power and signals from outside the electronic device to the second part.
  13. In the electronic device (200), A housing (220) for housing a wireless power receiver (302) including a battery (254) and a coil (3021); and A flexible printed circuit board (301) is disposed between the battery and the wireless power receiver and includes a first part (310), a second part (320), and a third part (330; 430) connecting the first part and the second part. The above third part is, First substrate layer (331a; 431a), A first wiring layer (332; 432) including a first-1 signal line (3321; 4321) disposed on a part of the first substrate layer, A first dielectric layer (333; 433) disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line, and An electronic device comprising a first shielding layer (334a; 434a) disposed between the wireless power receiver and the first dielectric layer.
  14. In Article 13, The first wiring layer comprises a second-1 signal line (3322; 4322) disposed on the first substrate layer and spaced apart from the first-1 signal line in a first direction; and, The third portion comprises a second shielding layer (334b; 434b) disposed between the first substrate layer and the battery at a position corresponding to the second-1 signal line, wherein, in order to reduce and/or prevent interference of wireless signals by the second shielding layer, the second shielding layer comprises a second shielding layer (334b; 434b) that does not overlap with the first-1 signal line between the first substrate layer and the battery. An electronic device in which the thickness (T3') of the third part is smaller than the thickness (T1) of the first part and/or the thickness (T2) of the second part that does not overlap with the coil.
  15. In Article 14, The above third part A second substrate layer (331b) disposed between the first dielectric layer and the first shielding layer; First-1 grounding portions (335a) spaced apart from each other on both sides of the first-1 signal line; A first-second grounding portion (335b) disposed between the first dielectric layer and the second substrate layer and spaced apart from each other at a position corresponding to the first-first grounding portion; and It further includes a first-1 connecting part (336a) that penetrates the first dielectric layer and connects the first-1 grounding part and the first-2 grounding part, and a first-2 connecting part (336b) that penetrates the second substrate layer and connects the first-2 grounding part and the first shielding layer. An electronic device in which the first shielding layer, the first-1 connection part, and the first-2 connection part ground through the first shielding layer and surround at least a portion of the first-1 signal line to prevent wireless signal interference.
  16. In Article 15, The above battery includes a non-conductive material, and The above first-1 signal line is an electronic device configured to transmit a wireless signal transmitted from outside the electronic device to a second circuit board (264b) disposed inside the housing.
  17. In Article 15 or Article 16, The flexible printed circuit board comprises a plurality of first conductive parts (303a), each including the first-1 connection part and the first-2 connection part. The plurality of first conductive members are spaced apart from each other by a second distance along the first-1 signal line to shield the first-1 signal line together with the first shielding layer, The above first distance (D1) is an electronic device that is less than or equal to half of the first wavelength defined as the maximum frequency transmitted from the above first-1 signal line.
  18. In a flexible printed circuit board (301), It includes a first part (310), a second part (320), and a third part (330) that connects the first part and the second part and is thinner than the thickness of the first part and the second part. The above third part First substrate layer (331a; 431a), A first wiring layer (332; 432) comprising a first-1 signal line (3321; 4321) disposed in a part of the first substrate layer, and a second-1 signal line (3322; 4322) disposed in another part of the first substrate layer and spaced apart from the first-1 signal line in a first direction. A first dielectric layer (333; 433) disposed on the first wiring layer and partially supporting the first-1 signal line and the second-1 signal line, A second substrate layer (331b) disposed between the first dielectric layer and the first shielding layer, A first shielding layer (334a; 434a) disposed on the second substrate layer, and A flexible printed circuit board comprising: a second shielding layer (334b; 434b) disposed below the first substrate layer at a position corresponding to the second-1 signal line, wherein the second shielding layer does not overlap with the first-1 signal line below the first substrate layer in order to reduce and/or prevent interference of a wireless signal by the second shielding layer.
  19. In Article 18, The above third part is, First-1 grounding portions (335a) spaced apart from each other on both sides of the first-1 signal line; A first-second ground portion (335b) disposed between the first dielectric layer and the second substrate layer and spaced apart at a position corresponding to the first-first ground portion; and A flexible printed circuit board comprising a plurality of first conductive parts (303a), each including a first connecting part (336a) that penetrates the first dielectric layer and connects the first-1 ground part and the first-2 ground part, and a first connecting part (336b) that penetrates the second substrate layer and connects the first-2 ground part and the first shielding layer.
  20. In Article 19, The plurality of first conductive members are spaced apart from each other by a first distance along the first-1 signal line to shield the first-1 signal line together with the first shielding layer, The above first distance (D1) is a flexible printed circuit board that is less than or equal to half of the first wavelength defined as the maximum frequency transmitted from the above first-1 signal line.

Description

A flexible printed circuit board and an electronic device including the same The various embodiments disclosed in this document relate to flexible printed circuit boards, for example, flexible printed circuit boards and electronic devices including the same. Driven by remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. In particular, recent electronic devices are being developed to enable portable communication. The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and in-car navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can recently be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music/video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device. As electronic devices have become miniaturized, securing mounting space for internal circuit boards has become difficult. Circuit boards containing various wiring and wires pose challenges in ensuring signal efficiency due to signal interference when they run across electronic components. Furthermore, as internal circuit boards are placed inside electronic devices, it has been difficult to achieve a thin profile while simultaneously reducing signal loss. The information described above may be provided as background art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure. The aspects, configurations, and/or advantages described above regarding various embodiments of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings. FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2 is a perspective view showing an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing an electronic device according to one embodiment of the present disclosure. FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 5 is a disassembled view of a portion of the rear of an electronic device according to one embodiment of the present disclosure. FIG. 6 is a conceptual diagram viewed from the -Z direction to the +Z direction showing a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 7 is a conceptual diagram showing an exploded view of a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 8a is a conceptual diagram showing a portion of cross-section A-A' shown in FIG. 5, according to one embodiment of the present disclosure. FIG. 8b is a conceptual diagram showing a part of cross-section B-B' shown in FIG. 5, according to one embodiment of the present disclosure. FIG. 8c is a conceptual diagram showing a part of the cross-section C-C' illustrated in FIG. 5 according to one embodiment of the present disclosure. FIG. 9 is a drawing showing a portion of a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 10 is a conceptual diagram showing a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 11 is a conceptual diagram showing a part of cross-section B-B' shown in FIG. 5 according to one embodiment of the present disclosure. Throughout the attached drawings, similar parts, configurations, and/or structures may be assigned similar reference numbers. FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic de