KR-20260064436-A - ARATUS FOR PROCESSING WORKPIECE AND METHOD FOR ARRANGING BEAM DELIVERY SYSTEM IN PROCESSING UNIT

KR20260064436AKR 20260064436 AKR20260064436 AKR 20260064436AKR-20260064436-A

Abstract

In a processing device equipped with a vibration damping device, the optical axis in the optical transmission path of the beam transmission system is appropriately adjusted. The laser processing device (100) is equipped with a beam transmission system (12) that transmits a laser beam between a light source (10) and an illumination optical unit (30) installed in the device body (20). The beam transmission system (12) is equipped with a second adjustment mirror (16) for adjusting the optical axis, and the position according to the vertical direction of the second adjustment mirror (16) is on the upper surface (90U) of the vibration damping device (90) that supports the support body (80) of the device body (20) or near thereto.

Inventors

후나야마, 마사히코
시미즈, 슈이치
와시야마, 히로유키

Assignees

가부시키가이샤 오크세이사쿠쇼

Dates

Publication Date: 20260507
Application Date: 20250224
Priority Date: 20241030

Claims (9)

A device body having a support installed thereon for supporting a stage on which a lighting optical unit and a workpiece are mounted, and A beam transmission system that transmits a beam emitted from a light source installed independently of the main body of the above device toward the lighting optical unit, and A vibration damping device that supports the above-mentioned support is provided, and The above beam transmission system is supported by the support and has a main body-side beam transmission unit equipped with a beam correction optical member capable of adjusting the optical axis of the beam, A processing device characterized in that the position of the beam correction optical member according to the vertical direction is at a point or near a point of the vibration damping structure in the vibration damping device.
In paragraph 1, A base installed on the floor surface to support the above vibration damping device is provided, A processing device characterized in that the above vibration damping device is disposed between the bottom of the support and the base.
In paragraph 2, A processing device characterized in that the position of the beam correction optical member in the vertical direction is lower than the workpiece mounting surface of the stage and higher than the point of the vibration damping structure.
In paragraph 1, A processing device characterized by the above support supporting the stage and having a stage support located at a position lower than a point of the vibration damping structure in the vibration damping device along the vertical direction.
In any one of paragraphs 1 through 4, A processing device characterized in that the beam correction optical member is configured as a mirror capable of changing position by reflecting a beam emitted from the light source.
In any one of paragraphs 1 through 4, The above device body comprises a mask stage disposed below the illumination optical unit and a projection optical system disposed below the mask stage, and The above support supports the mask stage and the projection optical system, and A processing device characterized in that the above-mentioned illumination optical unit, the above-mentioned mask stage, the above-mentioned projection optical system, and the above-mentioned stage are integrated by the above-mentioned support.
In any one of paragraphs 1 through 4, A processing device characterized by the above light source emitting a laser beam.
With respect to a device body having an optical unit for lighting, a support for a stage on which a workpiece is mounted, and a base installed on a floor surface, a vibration damping device is installed between the bottom of the support and the base to support the support. A light source emitting a beam is installed independently of the main body of the device, and A method for installing a beam transmission system that transmits a beam emitted from the above-mentioned device light source toward the above-mentioned illumination optical unit, A method for installing a beam transmission system for a processing device, characterized by attaching a beam transmission unit on the main body side, which has a beam correction optical member with an adjustable optical axis of the beam in the beam transmission system, to the support such that the position according to the vertical direction of the beam correction optical member is a point or near a point of the vibration damping structure of the vibration damping device.
A device body having an optical lighting unit and a support body that supports a stage on which a workpiece is mounted, and A vibration damping device that supports the above support, and A base installed on the floor surface to support the above vibration damping device is provided, A processing device characterized in that the support surface supporting the stage of the above support is located at a position lower than the point of the vibration damping structure in the above vibration damping device along the vertical direction.

Description

ARATUS FOR PROCESSING WORKPIECE AND METHOD FOR ARRANGING BEAM DELIVERY SYSTEM IN PROCESSING UNIT The present invention relates to a processing device for processing a substrate by means of a laser beam or the like, and in particular, to a processing device equipped with a vibration damping device for reducing vibration. With the miniaturization and high-density packaging of electronic devices, high-precision pattern formation is required for printed circuit boards and the like. For example, on stacked boards, it is necessary to form fine vias or trenches on the order of μm. As a method for performing micro-machining, ablation processing is performed. In this process, high-energy density laser light is projected onto a workpiece, such as a substrate, while scanning it against a mask. By instantaneously evaporating and removing the surface of the material in accordance with the mask pattern, vias or wiring grooves can be formed on the substrate. Laser light emitted from a laser light source is guided through a laser delivery system to an illumination optical system installed in the main body of the processing device. If an optical axis misalignment occurs in the optical transmission path from the laser light source to the illumination optical system, it affects the processing precision. Accordingly, the laser transmission system is equipped with a beam correction function so that the laser light is incident on the illumination optical system at an appropriate incident position and incident angle by adjusting the angle of the mirror (see, for example, Patent Document 1). When vibration is transmitted from the outside to the main body of the processing device while ablation processing is being performed, the vibration of the main body of the processing device may cause misalignment in the projection position of the mask pattern, which may affect the processing precision. For this reason, a vibration damping device is installed on the main body of the processing device (see Patent Documents 1 and 2). FIG. 1 is a schematic diagram of a laser processing device according to the present embodiment. Figure 2 is a schematic diagram of a beam transmission system. FIG. 1 is a schematic diagram of a laser processing device according to the present embodiment. A laser processing device (100) is a processing device capable of forming a pattern on a substrate (workpiece) (W) by ablation processing, and comprises a light source device (10) and a device body (20). The light source device (10) is installed on a floor surface (G) independently of the device body (20). The light source device (10) is a laser that emits high-energy density laser light, and is configured as an excimer laser that pulses KrF excimer laser light with a wavelength of 248 nm. The laser light emitted from the light source device (10) is sent to the device body (20) through a beam transmission system (12). The device body (20) is equipped with an illumination optical unit (30), a scanning mechanism (40), a projection optical system (50), a mask stage (60), and a processing stage (70), and is supported by a support body (80) of the device body (20). The support body (80), which is a frame structure having four legs that are spaced equally apart and extend vertically downward, is installed on the base (25) of the device body (20). The mask (M) and the substrate (W) are each mounted on the mask stage (60) and the processing stage (70). The illumination optical unit (30) has a line beam forming optical system (not shown) including a cylindrical lens, etc., and shapes the beam beam of laser light incident along the scanning direction into a line-shaped beam. The line-shaped light is guided to a mask (M) through a mirror not shown. The illumination optical unit (30) is supported by a stand not shown and is installed so that the optical axis of the line beam forming optical system is parallel to the scanning direction. The scanning mechanism (40) supporting the stand is located at approximately the same height as the mask stage (60) and is positioned at an adjacent location along the scanning direction (X). The scanning mechanism (40) can reciprocate the illumination optical unit (30) along the scanning direction (X direction). As the illumination optical unit (30) moves, a line-shaped light perpendicular to the scanning direction (X direction) moves relative to the mask (M) and the projection optical system (50), and the mask (M) and substrate (W) fixed to the mask stage (60) and the processing stage (70), respectively, are scanned. The mask stage (60) can hold the mask (M) and simultaneously position the mask (M) by moving and rotating it in the X-Y direction. The projection optical system (50) is an optical system focused on the surface of the mask (M) and the surface of the substrate (W), and projects light transmitted through the mask (M) onto the substrate (W). Here, the projection optical system (50) is configured as a reduction projection optical system