KR-20260064483-A - POLYESTER RESIN, RESIN COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR ENCAPSULANT, AND SEMICONDUCTOR DEVICE

Abstract

The objective of the present invention is to provide a polyester resin, a resin composition, a curable resin composition, and a cured product thereof that can exhibit a low dielectric loss tangent and have low thermal expansion. The means for solving the above problem is a polyester resin composed of an aromatic polycarboxylic acid or its halide (A), a monohydroxy aromatic compound (B), and a polyhydroxy aromatic compound (C), wherein the polyhydroxy aromatic compound (C) contains fluorene in its structure.

Inventors

• 가와사키 아유미
• 김영찬
• 하자마 마사키

Assignees

• 디아이씨 가부시끼가이샤

Dates

Publication Date

20260507

Application Date

20250724

Priority Date

20241031

Claims (14)

1. A polyester resin comprising an aromatic polycarboxylic acid or its halide (A), a monohydroxy aromatic compound (B), and a polyhydroxy aromatic compound (C), wherein the polyhydroxy aromatic compound (C) contains fluorene in its structure.
2. Polyester resin, wherein the above polyhydric hydroxy aromatic compound (C) is a compound represented by general formula (1), a hydroxy aromatic compound represented by general formula (2), and a fluorene (but not having a substituent at the 9th position). (during the meal, Ar is an aromatic group that may have substituents, and R1 is, each independently, a hydrogen atom or an aliphatic hydrocarbon group having 1 to 4 carbon atoms, and X is a decoy, and Each R y is independently a hydrogen atom or an aliphatic hydrocarbon group, an aryl group, an arylalkyl group, an alkoxy group or a halogen atom, or two R y may form a ring together with the carbon atom to which they are bonded, and z is an independent integer from 0 to 5.
3. In paragraph 1, The above polyhydric hydroxy aromatic compound (C) is a compound represented by the general formula (3-1), and Polyester resin in which the end of a compound represented by general formula (3-1) is encapsulated as in general formula (3-2) by an aromatic polycarboxylic acid or its halide (A) and a monohydroxy aromatic compound (B). (during the meal, R2 is, each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 4 carbon atoms, and R3 is, each independently an aliphatic hydrocarbon group, an aryl group, an arylalkyl group, an alkoxy group, or a halogen atom, and Ar 1 is an aromatic group that may have substituents independently, and Ar₂ is an aromatic group that may have substituents independently, and Ar 3 is an aromatic group that may have substituents independently, and p is an integer greater than or equal to 1, and p+a is greater than or equal to 1, and m is, independently, 0, 1, 2, 3, or 4.
4. In paragraph 3, Ar 1 is a polyester resin, which is any one of the following. (* indicates the number of bonds formed with other atoms.)
5. In paragraph 3, a polyester resin in which Ar 2 is a structure represented by general formula (4) or (5). (In the formula, R q is, each independently, a hydrogen atom or an aliphatic hydrocarbon group, an aryl group, an arylalkyl group, an alkoxy group or a halogen atom, and t is an integer from 0 to 4, each independently, and u are each independent integers from 0 to 6, and * indicates the number of bonds formed with other atoms.
6. In paragraph 3, a polyester resin in which Ar 3 is a structure represented by general formula (6) or (7). (In the formula, R q is, each independently, a hydrogen atom or an aliphatic hydrocarbon group, an aryl group, an arylalkyl group, an alkoxy group or a halogen atom, and v are each independent integers from 0 to 5, and w are independent integers from 0 to 7, and * indicates the number of bonds formed with other atoms.
7. A resin composition comprising a polyester resin described in any one of claims 1 to 6.
8. A curable resin composition comprising a polyester resin and an epoxy resin as described in any one of claims 1 to 6.
9. Cured product of the curable resin composition described in paragraph 8.
10. A prepreg having a reinforcing substrate and a semi-finished product of the curable resin composition described in claim 7 impregnated in the reinforcing substrate.
11. A circuit board that is a laminate of the prepreg described in paragraph 10 and a copper foil.
12. A build-up film containing the curable resin composition described in paragraph 8.
13. A semiconductor encapsulant containing the curable resin composition described in paragraph 8.
14. A semiconductor device comprising a cured semiconductor encapsulant described in paragraph 13.

Description

Polyester resin, resin composition, curable resin composition, cured product, prepreg, circuit board, build-up film, semiconductor encapsulant, and semiconductor device The present invention relates to a polyester resin, a resin composition, a curable resin composition, a cured product, a prepreg, a circuit board, a build-up film, a semiconductor encapsulant, and a semiconductor device. Epoxy resin compositions having epoxy resin and its curing agent as essential components are widely used in electronic components such as semiconductors and multilayer printed circuit boards, as the cured product exhibits excellent heat resistance and insulation properties. In the field of technology for encapsulation and substrate materials, particularly within the applications of electronic components, the speed and frequency of signals in various electronic devices have recently been increasing. Against this backdrop, materials with low dielectric loss tangents—a parameter indicating transmission loss—are being required due to the increase in signal speed and frequency. [Fig. 1] Fig. 1 is a GPC chart of phenol resin intermediate A-1 of Synthesis Example 1. [Fig. 2] Fig. 2 is a 13 C-NMR chart of phenol resin intermediate A-1 of Synthesis Example 1. [Fig. 3] Fig. 3 is an FD-MS chart of phenol resin intermediate A-1 of Synthesis Example 1. [Fig. 4] Fig. 4 is a GPC chart of polyester resin A-2 of Example 1. [Fig. 5] Fig. 5 is a GPC chart of phenol resin intermediate B-1 of Synthesis Example 2. [Fig. 6] Fig. 6 is a 13 C-NMR chart of phenol resin intermediate B-1 of Synthesis Example 2. [Fig. 7] Fig. 7 is an FD-MS chart of phenol resin intermediate B-1 of Synthesis Example 2. [Fig. 8] Fig. 8 is a GPC chart of polyester resin B-2 of Example 2. [Fig. 9] Fig. 9 is a GPC chart of phenol resin intermediate C-1 of Synthesis Example 3. [Fig. 10] Fig. 10 is a 13 C-NMR chart of phenol resin intermediate C-1 of Synthesis Example 3. [Fig. 11] Fig. 11 is an FD-MS chart of phenol resin intermediate C-1 of Synthesis Example 3. [Fig. 12] Fig. 12 is a GPC chart of polyester resin C-2 of Example 3. [Fig. 13] Fig. 13 is a GPC chart of phenol resin intermediate D-1 of Synthesis Example 4. [Fig. 14] Fig. 14 is a 13 C-NMR chart of phenol resin intermediate D-1 of Synthesis Example 4. [Fig. 15] Fig. 15 is an FD-MS chart of the phenol resin intermediate D-1 of Synthesis Example 4. [Fig. 16] Fig. 16 is a GPC chart of polyester resin D-2 of Example 4. [Fig. 17] Fig. 17 is a GPC chart of phenol resin intermediate E-1 of Synthesis Example 5. [Fig. 18] Fig. 18 is a 13 C-NMR chart of the phenol resin intermediate E-1 of Synthesis Example 5. [Fig. 19] Fig. 19 is an FD-MS chart of the phenol resin intermediate E-1 of Synthesis Example 5. [Fig. 20] Fig. 20 is a GPC chart of polyester resin E-2 of Example 5. Embodiments of the present invention will be described below. These descriptions are intended to be illustrative of the present invention and are not intended to limit the invention in any way. In the present invention, two or more embodiments may be arbitrarily combined. [Term] In this specification, the term "reaction raw material" refers to a compound used to obtain a target compound by a chemical reaction, such as bonding or decomposition, and which partially constitutes the chemical structure of the target compound; substances that serve as aids for the chemical reaction, such as solvents and catalysts, are excluded. In particular, in this specification, the term "reaction raw material" refers to a precursor for obtaining a target polyester resin by a chemical reaction. In this specification, the term "structural unit" refers to a (repeating) unit of a chemical structure formed during a reaction or polymerization; in other words, it refers to a partial structure other than the structure of the chemical bond involved in the reaction or polymerization in a product compound formed by a reaction or polymerization, and refers to a so-called residue. The aliphatic hydrocarbon group in this specification may be of the straight-chain, branched, or cyclic type, and may have unsaturated bonds in its structure. Examples of aliphatic hydrocarbon groups include those having 1 to 20 carbon atoms. Monovalent aliphatic hydrocarbon groups in this specification include alkyl groups, alkenyl groups, alkynyl groups, cycloalkyl groups, cycloalkenyl groups, and cycloalkynyl groups. The alkyl group in this specification may be either straight-chain or branched, and may have 1 to 20 carbon atoms, examples of which are methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, n-pentyl, sec-pentyl, tert-pentyl, neopentyl, amyl, cyclopentyl, hexyl, heptyl, octyl, cumyl, nonyl, decyl, undecyl, dodecyl, etc. The alkenyl group in this specification may be either straight-chain or branched, and may have 2 to 20 carbon atoms, examples of which are vinyl groups, allyl groups, butenyl groups, butadienyl groups, pentenyl groups, hexenyl groups, heptenyl groups, octenyl groups