KR-20260064512-A - SYSTEM FOR FIXING SEMICONDUCTOR ADHESIVE FILM WITH ANTISTATIC FUNCTIONALITY TO ELECTROSTATIC CHUCK

KR20260064512AKR 20260064512 AKR20260064512 AKR 20260064512AKR-20260064512-A

Abstract

A system for fixing a semiconductor adhesive film having an antistatic function according to one embodiment of the present invention to an electrostatic chuck comprises an electrostatic chuck, a substrate layer, a conductive layer formed on the substrate layer, and an adhesive layer formed on the conductive layer, wherein the semiconductor adhesive film is fixed to the electrostatic chuck such that the substrate layer faces the electrostatic chuck, and a semiconductor wafer adhered to the adhesive layer. A system for fixing a semiconductor adhesive film including an antistatic function to an electrostatic chuck and a method for fixing a semiconductor wafer to an electrostatic chuck according to the present invention allow the semiconductor wafer to be stably fixed to the electrostatic chuck and also separated by the semiconductor adhesive film being adhered to the semiconductor wafer.

Inventors

이지문
이규완
이창우
조한빈
하태용
양승영
도상길

Assignees

율촌화학 주식회사

Dates

Publication Date: 20260507
Application Date: 20250924
Priority Date: 20241030

Claims (12)

electrostatic chuck; and A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, comprising: a substrate layer, a conductive layer formed on the substrate layer, and an adhesive layer formed on the conductive layer, wherein when a voltage of 10 kV is applied in the direction of the adhesive layer surface, the surface potential of the adhesive layer surface is 0.001 kV to 0.8 kV, and when a voltage is applied to the electrostatic chuck, the substrate layer is fixed to the electrostatic chuck such that it faces the electrostatic chuck by electrostatic attraction.
In claim 1, A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, comprising a semiconductor wafer adhered to the adhesive layer.
In claim 1, A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, wherein the time for the surface potential of the adhesive layer surface, which is initially measured when a voltage of 10 kV is applied in the direction of the adhesive layer surface, to be reduced by half is 0.5 sec to 200 sec.
In claim 2, A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, wherein the semiconductor adhesive film has a peeling electrostatic voltage of 0.01kV to 0.5kV when peeled off after being adhered to the semiconductor wafer.
In claim 2, A system for fixing a semiconductor adhesive film having an antistatic function, wherein the adhesive layer of the semiconductor adhesive film is adhered to a coating layer formed on the semiconductor wafer, to an electrostatic chuck.
In claim 5, A system for fixing a semiconductor adhesive film having an antistatic function, wherein the above coating layer is formed from an organic coating agent, to an electrostatic chuck.
In claim 2, When voltage is applied to the electrostatic chuck, the semiconductor wafer is fixed to the electrostatic chuck, and A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, wherein the semiconductor adhesive film and the semiconductor wafer are separated from the electrostatic chuck when no voltage is applied to the electrostatic chuck.
In claim 2, The above semiconductor adhesive film comprises a release film layer formed on the adhesive layer, and The above semiconductor wafer is a system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, wherein the above release film layer is adhered to the adhesive layer after the above release film layer is peeled off from the adhesive layer.
In claim 8, With the semiconductor adhesive film fixed to the electrostatic chuck before the above release film layer is removed, A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, wherein when a voltage of 3kV is applied to the electrostatic chuck, the force with which the electrostatic chuck fixes the semiconductor adhesive film in the horizontal direction is formed to be 200 gf/150mm or more.
In claim 5, The above adhesive layer is, A system for fixing a semiconductor adhesive film containing an antistatic function, comprising a silicon-based compound, to an electrostatic chuck.
In claim 1, A system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, wherein the semiconductor adhesive film has a dielectric loss of 0.02 to 0.1 under conditions of 25 ℃ and 10 GHz.
In claim 1, A system for fixing a semiconductor adhesive film having an antistatic function, wherein the semiconductor adhesive film has a dielectric constant of 2.8 to 3.3 under conditions of 25 ℃ and 10 GHz, to an electrostatic chuck.

Description

System for fixing a semiconductor adhesive film with antistatic function to an electrostatic chuck The present invention relates to a system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck, and more specifically, to a system for fixing a semiconductor adhesive film having an antistatic function to an electrostatic chuck (ESC) so as to stably fix a semiconductor wafer to the electrostatic chuck and stably detach it. Recently, there has been an even greater demand for the thinning and miniaturization of semiconductor devices and their packages. Consequently, as semiconductor wafers become thinner, electrostatic chucks (ESCs) are utilized to effectively secure them. An electrostatic chuck is a device used to secure wafers in the semiconductor manufacturing process; it fixes the wafer using electrical force and, unlike conventional methods such as physical clamps or vacuum suction, minimizes damage caused by contact and provides uniform fixing force. In order to secure a semiconductor wafer in such an electrostatic chuck, a semiconductor adhesive film may be attached to the wafer. In order for the wafer to be secured by electrical force in the electrostatic chuck, the semiconductor adhesive film must possess appropriate electrical properties and simultaneously be able to prevent static electricity from being conducted to the wafer. In particular, as the thinning and miniaturization of semiconductor devices and their packages have recently become increasingly required, the thickness of wafers has begun to become extremely thin, and consequently, wafers have become vulnerable to electrostatic discharge (ESD). Therefore, the semiconductor adhesive film must be designed to include an anti-ESD function to prevent the problem of the semiconductor wafer being damaged by static electricity. In addition, when voltage is applied to the electrostatic chuck, the semiconductor wafer must be stably fixed to the electrostatic chuck, and when voltage is not applied to the electrostatic chuck, it must be designed so that the semiconductor wafer can be detached from the electrostatic chuck. FIG. 1 is a conceptual diagram of a system for fixing a semiconductor adhesive film having an antistatic function according to an embodiment of the present invention to an electrostatic chuck; FIGS. 2 to 6 are conceptual diagrams illustrating a method of fixing a semiconductor wafer to an electrostatic chuck according to an embodiment of the present invention; and FIGS. 7 to 9 are drawings for explaining experimental examples of the present invention. Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. The present invention is not limited to specific embodiments and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention. In relation to the description of the drawings, similar reference numerals may be used for similar components. In this document, expressions such as "have," "can have," "include," or "can include" refer to the existence of the relevant feature (e.g., numerical values, functions, actions, or components, etc.) and do not exclude the existence of additional features. In this document, expressions such as “A or B,” “at least one of A or/and B,” or “one or more of A or/and B” may include all possible combinations of items listed together. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” may refer to cases including (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B. As used in this document, the expression "configured to" may be replaced, depending on the context, with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to." The terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embodiments of this document. Therefore, it should be understood that the configurations of the embodiments described in this specification are merely some of the most preferred embodiments of the present invention and do not represent all of the technic