KR-20260064518-A - PROCESSING APPARATUS, ADJUSTMENT METHOD, AND ARTICLE MANUFACTURING METHOD

Abstract

A processing device placed in a predetermined environment comprises a processing chamber for processing a component, a blower, a first flow path for sending gas from the blower to the processing chamber, a second flow path for returning gas from the processing chamber to the blower, a pressure gauge for detecting a differential pressure of the pressure of the second flow path with respect to the pressure of the predetermined environment, and an adjustment unit for maintaining the differential pressure at a positive value.

Inventors

• 니시카와라 토모후미
• 나카노 히토시

Assignees

• 캐논 가부시끼가이샤

Dates

Publication Date

20260507

Application Date

20251010

Priority Date

20241030

Claims (20)

1. As a processing device placed in a predetermined environment, A processing room for processing materials, and With a blower, and A first flow path for sending gas from the above blower to the above processing room, and A second flow path for returning gas from the above processing chamber to the above blower, and A pressure gauge for detecting the differential pressure of the pressure of the second flow path with respect to the pressure of the above-determined environment, and A processing device characterized by having an adjustment unit that performs an adjustment to maintain the above differential pressure at a positive value.
2. In Article 1, A processing device characterized by further comprising a purifier for purifying gas circulating in a circulation path including the processing chamber, the blower, the first flow path, and the second flow path.
3. In Article 2, The above purifier is a treatment device characterized by reducing the amount of moisture in the gas circulating through the above circulation path.
4. In Article 2, The above purifier is a treatment device characterized by reducing the amount of moisture and oxygen in the gas circulating through the above circulation path.
5. In Article 1, The above blower is configured as part of an air conditioner, and A processing device characterized in that the second Euro has a duct connecting the air conditioner and the processing room, and the pressure gauge is positioned between the duct and the blower.
6. In Article 1, The above processing device has an exhaust port for discharging gas to the outside of the processing device, A processing device characterized by the above adjustment unit comprising a gas supply unit that supplies gas to a circulation path including the processing chamber, the blower, the first flow path and the second flow path, and a pressure regulating valve installed at the exhaust port.
7. In Article 6, A processing device characterized in that the above gas supply unit is connected to a position upstream of the pressure gauge in the above second flow path.
8. In Article 6, A processing device characterized in that the above gas supply unit is connected to the above processing chamber.
9. In Article 7, A treatment device characterized in that the above gas supply unit supplies gas at a flow rate equal to the sum of the flow rate of gas leaking from the treatment device and the flow rate of gas discharged from the exhaust port.
10. In Article 6, A treatment device characterized in that the above exhaust port is arranged to discharge organic gas generated in the above treatment room.
11. In Article 2, A treatment device characterized in that the above purifier is positioned in a flow path that returns gas from the first flow path to a position upstream of the pressure gauge in the second flow path.
12. In Article 2, A treatment device characterized in that the above purifier is positioned in a flow path through which gas flows from the above treatment room to the above blower.
13. In any one of paragraphs 1 to 12, A processing device characterized in that the second flow path has a smaller pressure loss than the first flow path.
14. In any one of paragraphs 1 to 12, A processing device characterized in that the conductance of the second Euro is greater than the conductance of the first Euro.
15. In any one of paragraphs 1 to 12, A processing device characterized in that the second Euro is shorter than the first Euro.
16. In any one of paragraphs 1 to 12, A processing device characterized by further comprising a filter disposed in the first Euro.
17. In any one of paragraphs 1 to 12, A processing device characterized in that the second Euro has higher airtightness than the first Euro.
18. In any one of paragraphs 1 to 12, A processing device characterized in that the first flow path has a duct composed of an insulating member, and the inner and outer surfaces of the insulating member are covered with a metal film.
19. In any one of Articles 6 through 10, A processing device characterized in that the above adjustment unit adjusts the pressure adjustment valve so that the above differential pressure becomes a positive target value.
20. A method for adjusting a processing device that is placed in a predetermined environment, comprising a processing chamber for processing a material, a blower, a first flow path for sending gas from the blower to the processing chamber, and a second flow path for returning gas from the processing chamber to the blower. A detection process for detecting the differential pressure of the pressure of the second flow path with respect to the pressure of the above-determined environment, and A method of adjustment characterized by including an adjustment process for performing an adjustment to maintain the above differential pressure at a positive value.

Description

Processing apparatus, adjustment method, and article manufacturing method The present disclosure relates to a processing apparatus, a method of adjustment, and a method of manufacturing an article. Patent Document 1 describes a chamber device having a chamber room and a machine room. Dry air is supplied to the chamber room through a supply duct, and the atmosphere inside the chamber room is introduced into the machine room through an exhaust duct. The atmosphere exhausted into the machine room through the exhaust duct is exhausted from the machine room through an air control damper and an exhaust fan. A pressure sensor is installed inside the chamber room, and a controller controls the air control damper and the exhaust fan on the exhaust side so that the pressure inside the chamber room detected by the pressure sensor maintains a static pressure. In the chamber device described in Patent Document 1, the pressure inside the chamber room is maintained at a positive pressure as described above. In such a device, when air is circulated in a circulation path including the chamber room, a region having negative pressure relative to the external space may be formed on the downstream side of the exhaust duct. In this case, there is a possibility that air may enter from the circulation system into the external space. The present disclosure includes providing a technology advantageous for ensuring that there is positive pressure with respect to the external space in the entire area of the circulation path. One aspect of the present disclosure relates to a processing device placed in a predetermined environment, the processing device comprising: a processing chamber for processing a material; a blower; a first flow path for sending gas from the blower to the processing chamber; a second flow path for returning gas from the processing chamber to the blower; a pressure gauge for detecting a differential pressure of the pressure of the second flow path with respect to the pressure of the predetermined environment; and a control unit for performing an adjustment to maintain the differential pressure at a positive value. [Fig. 1] A drawing illustrating an example of the configuration of the main body part of a processing device. [Fig. 2] A drawing illustrating an example of the configuration of a processing device of the first embodiment. [Fig. 3] A drawing illustrating an example of the configuration of a processing device of a second embodiment. Hereinafter, embodiments are described in detail with reference to the attached drawings. Furthermore, the following embodiments do not limit the invention covered by the patent claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined at will. Additionally, in the attached drawings, the same reference number is assigned to identical or similar components, and redundant descriptions are omitted. Hereinafter, an exemplary embodiment of a processing device placed in a predetermined environment is described. The processing device may comprise a processing chamber for processing a material, a blower, a first flow path for sending gas from the blower to the processing chamber, a second flow path for returning gas from the processing chamber to the blower, and a pressure gauge for detecting a differential pressure of the pressure of the second flow path with respect to the pressure of the predetermined environment. Additionally, the processing device may comprise an adjustment unit for performing adjustment to maintain the differential pressure at a positive value. An adjustment method for adjusting the processing device may include a detection process for detecting the differential pressure of the pressure of the second flow path with respect to the pressure of the predetermined environment, and an adjustment process for performing adjustment to maintain the differential pressure at a positive value. A processing unit for processing a material is disposed in the processing chamber. The processing unit may be, for example, a main body part of any one of the following devices: an inkjet device, an exposure device, an imprint device, a planarization device, a bonding device, a film deposition device, an etching device, a coating device, a developing device, etc. Hereinafter, with reference to FIGS. 1 and 2, an example is described in which a processing device is configured as an inkjet device (1) and a main body part (MB) of the inkjet device (1) is disposed in a processing chamber (201). In this specification and the accompanying drawings, as shown in FIG. 1, the processing chamber (201) is shown in an XYZ coordinate system in which the plane parallel to the plane on which the substrate (2) as the member to be processed is disposed is the XY plane. The main body part (MB) disposed in the processing chamber (201) forms a pattern by applying ink (4), which is a liquid mater