KR-20260064576-A - CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD

Abstract

[Problem] A curable resin composition containing polyphenylene ether resin is provided, which can achieve excellent storage stability, excellent adhesion between the cured product and the conductor layer at high temperatures, and excellent dielectric properties of the cured product. [Solution] A curable resin composition comprising a polyphenylene ether resin, a styrene-based elastomer resin, and a polymerization initiator, wherein a styrene-based elastomer resin comprising a soft segment composed of styrene and one or more monomers other than styrene is used as the styrene-based elastomer resin, the melt flow rate of the styrene-based elastomer resin is adjusted to 15.0 g/10 min or less, and the styrene ratio of the styrene-based elastomer resin is adjusted to 65 mass% or more.

Inventors

• 콘도 유미
• 아오야마 요시토모
• 노사카 마미
• 스즈키 타쿠미
• 오키 코타
• 나카다 카즈타카

Assignees

• 다이요 홀딩스 가부시키가이샤

Dates

Publication Date

20260507

Application Date

20251027

Priority Date

20241031

Claims (7)

1. A curable resin composition comprising a polyphenylene ether resin, a styrene-based elastomer resin, and a polymerization initiator, The above styrene-based elastomer resin comprises a soft segment, and the soft segment is composed of styrene and one or more monomers other than styrene, and The melt flow rate of the above styrene-based elastomer resin is 15.0 g/10 min or less, and A curable resin composition characterized by having a styrene ratio of 65 mass% or more of the styrene-based elastomer resin.
2. In paragraph 1, A curable resin composition having a solubility parameter of 17.0 or higher of the soft segment.
3. In paragraph 1, A curable resin composition in which the soft segments of the above-mentioned styrene-based elastomer resin are fully hydrogenated.
4. In paragraph 1, Curable resin composition that substantially does not contain a dispersant.
5. As a dry film, A dry film comprising a first film and a resin layer formed on at least one side of the first film, the resin layer being composed of a curable resin composition as described in claim 1.
6. As a hardened material, A cured product obtained by curing the resin layer of the curable resin composition described in claim 1 or the dry film described in claim 5.
7. As a printed circuit board, A printed circuit board comprising the cured material described in paragraph 6.

Description

Curable resin composition, dry film, cured product and printed wiring board The present invention relates to a curable resin composition, and more particularly to a curable resin composition suitable for use in forming an insulating layer. Furthermore, the present invention relates to a dry film comprising a resin layer formed of the curable resin composition, a cured product of the resin layer of the curable resin composition or the dry film, and a printed circuit board having the cured product. Recently, with the increase in information processing volume, there is a growing demand for the miniaturization and high-density of circuit wiring in circuit boards widely used in various electronic devices to enable the miniaturization and high functionality of these devices. Furthermore, the frequency of electronic device signals is increasing due to the proliferation of high-capacity high-speed communication, represented by 5th generation communication systems (5G), and millimeter-wave radars for automotive ADAS (Advanced Driver Assistance Systems). Consequently, there is a particular requirement for the insulating film of the redistribution layer in the latest high-density semiconductor packages to satisfy excellent dielectric properties, such as high resolution to accommodate the miniaturization associated with high integration, as well as low dielectric constant and low dielectric constant to suppress transmission loss in the high-frequency range. However, it is common to use thermosetting resins or photosensitive resins as materials for forming an insulating layer. Epoxy resins and ester resins are commonly used as thermosetting resins, but since their dielectric constant and dielectric loss are not sufficiently low, as the frequency increases, transmission loss due to dielectric loss increases, and problems such as signal attenuation and heat generation occur. For this reason, recently, the formation of an insulating layer using polyphenylene ether, which has excellent low dielectric properties, has been attracting attention. However, since polyphenylene ether has low compatibility with resins commonly used for forming insulating layers and low solubility in solvents, there is a problem that resin compositions containing polyphenylene ether may not have sufficient storage stability. In addition, a curable resin composition used to form an insulating layer of an electronic component is required to have sufficient adhesion to a conductor layer under high temperatures, such as in a reflow soldering process. To solve the problems of compatibility or solubility of polyphenylene ether, for example, Patent Document 1 proposes a technique to improve compatibility with other resin components and solubility in solvents by branching the polyphenylene ether chain. Additionally, Patent Document 2 proposes a technique to improve compatibility by using two types of polyphenylene ether resins with different durometer hardnesses in combination in a composition. However, these patent documents do not mention the storage stability of the resin composition containing polyphenylene ether or the adhesion between the cured product and the conductor layer under high temperatures. [Curable resin composition] According to one aspect of the present invention, a curable resin composition (hereinafter also referred to as the "curable resin composition of the present invention") is provided. The curable resin composition of the present invention can be suitably used for forming an insulating layer in printed circuit boards, etc. In particular, the curable resin composition of the present invention suppresses an increase in fluidity at high temperatures, and the styrene-based elastomer resin and polyphenylene ether resin are sufficiently compatible, so the storage stability is excellent. The curable resin composition of the present invention comprises a polyphenylene ether resin, a styrene-based elastomer resin, and a polymerization initiator as essential components. Below, each component of the curable resin composition of the present invention will be described in detail. In addition, each component may be commercially available or may be appropriately synthesized. (Polyphenylene ether resin) The curable resin composition of the present invention comprises a polyphenylene ether resin. Since the polyphenylene ether resin has a high symmetry in its molecular structure, the curable resin composition can have a low dielectric constant by including the polyphenylene ether resin. In addition, since the polyphenylene ether resin is stacked at a high density due to the interaction between ring structures and has a high crosslinking density, the curable resin composition can have a low dielectric constant by including the polyphenylene ether resin, thereby suppressing the water absorption rate of the curable resin composition. As for the polyphenylene ether resin, it is not particularly limited as long as it includes a phenylene ether unit as a