KR-20260064585-A - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

By utilizing the detection results of multiple pressure detection points by a pressure sensor, abnormalities related to the forward and backward movement of the shaft are detected with high precision. The processing unit comprises a nozzle body for performing a predetermined surface treatment on a substrate, a shaft that moves back and forth in a predetermined direction by driving a motor, a pressure sensor that acquires pressure values generated between the motor and the nozzle body at multiple pressure detection points, and an abnormality detection unit that detects abnormalities related to the forward and backward movement of the shaft based on pressure values at at least two pressure detection points included in the multiple pressure detection points.

Inventors

• 나카시마 아키히로
• 후쿠모토 쇼야

Assignees

• 가부시키가이샤 스크린 홀딩스

Dates

Publication Date

20260507

Application Date

20251028

Priority Date

20241030

Claims (9)

1. A surface treatment mechanism for performing a predetermined surface treatment on a substrate, and A shaft having one end connected to the above-mentioned surface treatment mechanism and the other end connected to an actuator, and which moves back and forth in a predetermined direction by the driving of the actuator, and A pressure sensor that acquires a pressure value generated between the actuator, the surface treatment mechanism, or the shaft at a plurality of pressure detection points by guiding the surface treatment mechanism in the aforementioned direction as the surface treatment mechanism moves in the aforementioned predetermined direction, and A substrate processing device having an abnormality detection unit that detects an abnormality related to the forward and backward movement of the shaft based on pressure values at at least two pressure detection points included in the plurality of pressure detection points.
2. In claim 1, A rotation mechanism is additionally provided to maintain a circular substrate in a horizontal position and rotate it around a vertical axis passing through the center of the substrate, and The above surface treatment mechanism is a nozzle body disposed below the substrate and discharges a treatment liquid from a discharge port toward the lower edge of the substrate. A substrate processing device wherein the shaft moves back and forth in the radial direction of the substrate in the predetermined direction.
3. In claim 1, A substrate processing device in which the above abnormality detection unit determines that there is an abnormality in the forward and backward movement of the shaft when there is a difference in the temporal change of the pressure value detected at each of the plurality of pressure detection points.
4. In claim 3, A substrate processing device in which the above abnormality detection unit determines that there is an abnormality in the forward and backward movement of the shaft when a significant difference is recognized between the pressure value detected at any one of the plurality of pressure detection points and the pressure value detected at another pressure detection point at the same timing.
5. In claim 3, A substrate processing device in which the above abnormality detection unit determines that there is an abnormality in the forward and backward movement of the shaft when a significant difference is recognized between the rate of change of a pressure value detected at one of the plurality of pressure detection points during a specific period and the rate of change of a pressure value detected at another pressure detection point during the same specific period.
6. In claim 1, A substrate processing device in which the pressure sensor is installed at the end of the actuator through which the shaft protrudes, in addition to having a through hole formed through which the shaft passes.
7. In claim 6, In addition to being installed extending from the end of the actuator in the direction in which the shaft moves back and forth, a bearing having an inner surface that accommodates the shaft and slides the surface treatment mechanism is additionally provided. A substrate processing device in which the above pressure sensor is housed within the above bearing.
8. In claim 7, A substrate processing device in which the central axis of the actuator, the central axis of the shaft, and the central axis of the bearing coincide.
9. A shaft, having one end connected to a surface treatment mechanism for performing a predetermined surface treatment on a substrate and the other end connected to an actuator, is moved back and forth in a predetermined direction by the driving of the actuator. A substrate processing method wherein, by guiding the surface treatment mechanism to move in the aforementioned predetermined direction as described above, the pressure value generated between the actuator and the surface treatment mechanism or the shaft is acquired at a plurality of pressure detection points in a pressure sensor. A substrate processing method for detecting abnormalities related to the forward and backward movement of the shaft based on pressure values at at least two pressure detection points included in the plurality of pressure detection points.

Description

Substrate Processing Apparatus and Substrate Processing Method The present invention relates to a substrate processing apparatus and a substrate processing method. As a process for a circular or approximately circular substrate, such as a semiconductor wafer, there is a method of removing only the thin film at the periphery of the substrate among the thin films formed on at least one main surface of the substrate. For example, a technique is known in which an etching solution is supplied to the periphery while the substrate is rotated, and only the thin film outside the supply position of the etching solution is removed. A process of removing a thin film in this manner is sometimes referred to as a bevel etching process. For example, Patent Document 1 discloses a configuration in which a lower edge nozzle is installed below a substrate to etch the lower edge of a substrate in a horizontal position, in a substrate processing device housed within a processing chamber. In this lower edge nozzle, a plurality of nozzles are mounted on a nozzle support member, and each of these nozzles discharges a processing liquid, such as a chemical solution or a rinse solution, upward toward the lower edge of the substrate. FIG. 1 is a plan view showing the schematic configuration of a substrate processing system equipped with an embodiment of a processing unit, which is one aspect of a substrate processing device according to the present invention. Figure 2 is a side view showing the internal structure of the processing unit. Figure 3 is a plan view of the processing unit shown in Figure 2. Figure 4 is a drawing showing the structure and arrangement of a processing mechanism equipped in a processing unit. FIG. 5 is a cross-sectional view of a nozzle block showing the structure of a single processing liquid discharge nozzle part provided in a processing mechanism, showing the state in which the nozzle body is located at the origin. FIG. 6 is a cross-sectional view of a nozzle block showing the structure of a single processing liquid discharge nozzle part provided in a processing mechanism, showing the state in which the nozzle body is extended to its maximum extent. FIG. 7 is a perspective view showing the configuration near a pressure sensor equipped in a processing mechanism. FIG. 8 is a flowchart showing an example of a process in which a control unit equipped with a processing unit discharges a processing liquid to a nozzle body. FIG. 9 is a flowchart showing an example of a process in which a control unit equipped with a processing unit moves a nozzle body. Figure 10 is a graph showing an example of the relationship between time and the pressure value acquired by the pressure sensor. FIG. 11 is a graph showing an example of the relationship between time and pressure values at multiple pressure detection points acquired by a pressure sensor. FIG. 12 is a cross-sectional view of a nozzle block provided by a processing unit according to Variant Example 1 of the present invention. FIG. 13 is a cross-sectional view showing an example of an opening and closing valve provided by a processing unit according to Variant Example 2 of the present invention. (Substrate processing system) Hereinafter, an embodiment of the present invention will be described in detail. The following description is primarily a description of a substrate processing system, but also includes a description of a substrate processing method for processing substrates. FIG. 1 is a plan view showing a schematic configuration of a substrate processing system (100) equipped with an embodiment of a processing unit (1), which is an embodiment of a substrate processing device according to the present invention. FIG. 1 is a schematic diagram showing the internal structure of the substrate processing system (100) in an easy-to-understand manner by excluding the outer wall panel and other parts of the components. This substrate processing system (100) is a single-wafer type device that is installed, for example, in a clean room and processes substrates (S) one by one. A substrate processing system (100) is equipped with a plurality of processing units (substrate processing devices) (1), each of which is the main processing unit for a substrate (S). In FIG. 1, four processing units (1) are shown arranged in a horizontal direction, but each processing unit (1) is also stacked in multiple layers in the vertical direction. In each of the plurality of processing units (1) equipped in the substrate processing system (100), substrate processing is performed using a processing liquid. The substrate (S) is a circular substrate. In addition, in this embodiment, the term "circular substrate" is a concept that includes a "roughly circular substrate" in which, in addition to the substrate having a circular shape when viewed from a flat plane, there are parts of the outer periphery that are different from the circumference, such as orientation flats or cutouts, that are circular. In