KR-20260064586-A - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

KR20260064586AKR 20260064586 AKR20260064586 AKR 20260064586AKR-20260064586-A

Abstract

In the space between the actuator and the nozzle body, the pressure sensor can be designed in any shape, thereby realizing a compact configuration according to the substrate processing device. The processing unit comprises a nozzle body that discharges a processing liquid toward the lower edge of the substrate, a shaft that moves back and forth in the radial direction of the substrate by driving a motor, a pressure sensor that acquires a pressure value generated between the motor and the nozzle body, and a home position detection unit that detects that the nozzle body has returned to the home position when the pressure value exceeds a preset threshold value.

Inventors

나카시마 아키히로
후쿠모토 쇼야

Assignees

가부시키가이샤 스크린 홀딩스

Dates

Publication Date: 20260507
Application Date: 20251028
Priority Date: 20241030

Claims (7)

A rotating mechanism that maintains a circular substrate in a horizontal position and rotates it around a vertical axis passing through the center of the substrate, and A nozzle body disposed below the substrate and discharging a processing liquid from a discharge port toward the lower edge of the substrate, and A shaft having one end connected to the nozzle body and the other end connected to an actuator, and which moves back and forth in the radial direction of the substrate by the driving of the actuator, and A pressure sensor that acquires a pressure value generated between the actuator and the nozzle body as the nozzle body moves in the radial direction of the substrate, guided by the shaft; A substrate processing device characterized by having a home position detection unit that detects that the nozzle body has returned to the home position when the pressure value exceeds a preset threshold value.
In claim 1, The pressure sensor has a plane orthogonal to the axial direction of the shaft and has a plurality of pressure detection points on the plane. A substrate processing device wherein the above-described origin position detection unit detects that the nozzle body has returned to the origin position when the pressure value at at least two pressure detection points included in the plurality of pressure detection points is greater than or equal to a preset threshold value.
In claim 2, A substrate processing device in which the above-mentioned origin position detection unit determines that there is an abnormality in the return of the nozzle body to the origin position when there is a difference in the temporal change of the pressure value detected at each of the plurality of pressure detection points.
In claim 1, A substrate processing device in which the pressure sensor is installed at the end of the actuator through which the shaft protrudes, in addition to having a through hole formed through which the shaft passes.
In claim 4, In addition to being installed extending from the end of the actuator in the direction in which the shaft moves back and forth, the bearing further comprises a bearing having an inner surface that accommodates the shaft and slides the nozzle body. A substrate processing device in which the above pressure sensor is housed within the above bearing.
In claim 5, A substrate processing device in which the central axis of the actuator, the central axis of the shaft, and the central axis of the bearing coincide.
By means of a rotating mechanism, a circular substrate is maintained in a horizontal position and rotated around a vertical axis passing through the center of the substrate, and A shaft, having one end connected to a nozzle body positioned below the substrate to discharge a processing liquid from a discharge port toward the lower peripheral portion of the substrate and the other end connected to an actuator, is driven by the actuator to move a shaft back and forth in the radial direction of the substrate. A substrate processing method wherein the pressure value generated between the actuator and the nozzle body is acquired by a pressure sensor as the nozzle body moves in the radial direction of the substrate while being guided by the shaft, A substrate processing method that detects that the nozzle body has returned to the origin when the above pressure value exceeds a preset threshold value.

Description

Substrate Processing Apparatus and Substrate Processing Method The present invention relates to a substrate processing apparatus and a substrate processing method. There is a method for processing a circular or approximately circular substrate, such as a semiconductor wafer, to remove only the thin film at the periphery of the substrate among the thin films formed on at least one main surface of the substrate. For example, a technique is known in which an etching solution is supplied to the periphery while rotating the substrate to remove only the thin film outside the supply position of the etching solution. A process for removing a thin film in this manner is sometimes referred to as a bevel etching process. For example, Patent Document 1 discloses a configuration in which a lower edge nozzle is installed below a substrate to etch the lower edge of a substrate in a horizontal position, in a substrate processing device housed within a processing chamber. In this lower edge nozzle, a plurality of nozzles are mounted on a nozzle support member, and each of these nozzles discharges a processing liquid, such as a chemical solution or a rinse solution, upward toward the lower edge of the substrate. FIG. 1 is a plan view showing the schematic configuration of a substrate processing system equipped with an embodiment of a processing unit, which is one aspect of a substrate processing device according to the present invention. Figure 2 is a side view showing the internal structure of the processing unit. Figure 3 is a plan view of the processing unit shown in Figure 2. FIG. 4 is a drawing showing the structure and arrangement of a processing mechanism equipped in a processing unit. FIG. 5 is a cross-sectional view of a nozzle block showing the structure of a single processing liquid discharge nozzle part provided in a processing mechanism, showing the state in which the nozzle body is located at the origin. FIG. 6 is a cross-sectional view of a nozzle block showing the structure of a single processing liquid discharge nozzle part provided in a processing mechanism, showing the state in which the nozzle body is extended to its maximum extent. FIG. 7 is a perspective view showing the configuration near a pressure sensor equipped in a processing mechanism. FIG. 8 is a flowchart showing an example of a process in which a control unit equipped with a processing unit causes a nozzle body to discharge a processing liquid. FIG. 9 is a flowchart showing an example of a process in which a control unit equipped with a processing unit moves a nozzle body. Figure 10 is a graph showing an example of the relationship between time and the pressure value acquired by the pressure sensor. FIG. 11 is a graph showing an example of the relationship between time and pressure values at multiple pressure detection points acquired by a pressure sensor. FIG. 12 is a cross-sectional view of a nozzle block provided by a processing unit according to Variant Example 1 of the present invention. FIG. 13 is a cross-sectional view showing an example of an opening and closing valve provided by a processing unit according to Variant Example 2 of the present invention. (Substrate processing system) Hereinafter, an embodiment of the present invention will be described in detail. The following description is primarily a description of a substrate processing system, but also includes a description of a substrate processing method for processing substrates. FIG. 1 is a plan view showing a schematic configuration of a substrate processing system (100) equipped with an embodiment of a processing unit (1), which is an embodiment of a substrate processing device according to the present invention. FIG. 1 is a schematic diagram showing the internal structure of the substrate processing system (100) in an easy-to-understand manner by excluding the outer wall panel and other parts of the components. This substrate processing system (100) is a single-wafer type device that is installed, for example, in a clean room and processes substrates (S) one by one. A substrate processing system (100) is equipped with a plurality of processing units (substrate processing devices) (1), each of which is the main processing unit for a substrate (S). In FIG. 1, four processing units (1) are shown arranged in a horizontal direction, but each processing unit (1) is also stacked in multiple layers in the vertical direction. In each of the plurality of processing units (1) equipped in the substrate processing system (100), substrate processing is performed using a processing liquid. The substrate (S) is a circular substrate. In addition, in this embodiment, the term "circular substrate" is a concept that includes a "roughly circular substrate" in which, in addition to the main surface of the substrate having a circular shape when viewed from a flat plane, there are parts of the outer periphery that are different from the circumference, such as orientation flats or cutouts, that hav