KR-20260064604-A - RADIATION-SENSITIVE COMPOSITION, CURED FILM, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND METHOD FOR PRODUCING THE CURED FILM

Abstract

(Problem) The problem to be solved by the present invention is to provide a radiation-sensitive composition capable of forming a cured film capable of achieving both radiation sensitivity and dry etching resistance, a cured film formed by said composition, a semiconductor device and a display device having said cured film, and a method for manufacturing the cured film. (Solution) The present invention relates to a radiation-reducing composition comprising a polymer (A) containing a structural unit (I) derived from a compound having a heterocyclic structure of 5 or more reduced waters, an alkali-soluble polymer (B), a quinone diazide compound (C), and a solvent (S), wherein the heterocyclic structure is at least one selected from the group consisting of a cyclic ether structure, a cyclic ester structure, a cyclic imide structure, and a triazole ring-containing structure, and the content of the structural unit (I) is 50 mass% or more with respect to the total structural units constituting the polymer (A).

Inventors

• 아카츠카 겐
• 하야시 케이스케
• 나루코 아키토

Assignees

• 제이에스알 가부시키가이샤

Dates

Publication Date

20260507

Application Date

20251029

Priority Date

20241030

Claims (14)

1. A polymer (A) comprising a structural unit (I) derived from a compound having a complex ring structure with a reduction number of 5 or more, and alkali-soluble polymer (B) and, quinonediazide compound (C) and, Solvent (S) Contains, The above heterocyclic structure is at least one selected from the group consisting of cyclic ether structures, cyclic ester structures, cyclic imide structures, and triazole ring-containing structures, and A radiation-reducing composition in which the content of the above structural unit (I) is 50 mass% or more with respect to the total structural unit constituting the polymer (A).
2. In paragraph 1, A radiation-sensitive composition in which the above polymer (A) has a structural unit (II) having a crosslinking group.
3. In paragraph 1 or 2, A radiation-reducing composition, wherein the above complex ring structure is a structure appearing as at least one type selected from the group consisting of the following formulas (a1) to (a5). (among equations (a1) to (a5), R11 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or a ring structure formed by two R11s bonded to the same or adjacent carbon atoms joining together with the carbon atoms to which they are bonded; where multiple R11s exist, the multiple R11s are each identical or different; R 12 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms; R 13 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms; where multiple R 13s exist, each of the multiple R 13s is the same or different; n1 and n2 are, independently, integers from 0 to 2; m1 is an integer from 1 to 3)
4. In paragraph 1 or 2, A radioactive composition in which the above complex ring structure is a cyclic ether structure.
5. In paragraph 1 or 2, A radioactive composition in which the above complex ring structure is a dioxoran structure.
6. In paragraph 1 or 2, A radiation-reducing composition in which the content of the polymer (A) is 1 mass% or more and 30 mass% or less with respect to the total solid content of the polymer (A) and the polymer (B).
7. In paragraph 2, A radiation-sensitive composition in which the above-mentioned crosslinking group is selected from the group consisting of a carboxyl group, an amino group, an epoxy group, and an oxetanyl group.
8. In paragraph 1 or 2, A radiation-reducing composition in which the alkali-soluble polymer (B) is a polymer (B1) comprising a structural unit (III) having an alkali-soluble group, a polyimide-based polymer (B2), or a siloxane polymer (B3).
9. A hardened film formed using the radioactive composition described in paragraph 1 or 2.
10. In Paragraph 9, A cured film having a film surface Ra of 10 or less after RIE dry etching under conditions where the sccm ratio of CF4 and O2 is 1 to 5.
11. A process of forming a coating film using a radioactive composition described in claim 1 or 2, and A process of exposing at least a portion of the above film, and A process for developing the coating film after exposure, and A process of heating the developed film A method for manufacturing a hardened film comprising
12. In Paragraph 11, A method for manufacturing a hardened film, comprising a process of dry etching the hardened film after a heating process.
13. A semiconductor device having a hardened film as described in paragraph 9.
14. A display element having a hardened film as described in paragraph 9.

Description

Radiation-sensitive composition, cured film, semiconductor device, display device, and method for producing the cured film The present invention relates to a radiation-sensitive composition, a cured film, a semiconductor device, a display device, and a method for manufacturing a cured film. A cured film (e.g., an interlayer insulating film, a spacer, a protective film, etc.) having a semiconductor device or a display device is generally formed using a radiation-sensitive composition containing a polymer component and a radiation-sensitive compound (e.g., a photoacid generator or a photopolymerization initiator). For example, a cured film having a pattern shape can be obtained by irradiating a film formed by a radiation-sensitive composition, then forming a pattern by performing a development treatment, and then heat curing by performing a heat treatment. As a material for forming a cured film on a semiconductor device or a display device, various radiation-sensitive compositions have been proposed in the past, and for example, a positive-type photosensitive resin composition containing an alkali-soluble resin, a 1,2-quinone diazide compound, and an active ester-based curing agent is known (for example, see Patent Document 1). (Form for carrying out the invention) Embodiments of the present invention will be described in detail below, but the present invention is not limited to these embodiments. The details regarding the embodiments are described in detail below. In addition, in this specification, a numerical range indicated using "~" means that the numerical values indicated before and after "~" are included as lower and upper limits. "Structural unit" refers to a unit that mainly constitutes the main chain structure, and is a unit that is included in at least two or more of the main chain structure. In this specification, "hydrocarbon group" includes chain hydrocarbon groups, alicyclic hydrocarbon groups, and aromatic hydrocarbon groups. "Chain hydrocarbon group" refers to a straight-chain hydrocarbon group and a branched hydrocarbon group composed solely of a chain structure without including a ring structure in the main chain. However, the chain hydrocarbon group may be saturated or unsaturated. "Alicyclic hydrocarbon group" refers to a hydrocarbon group that includes only an alicyclic hydrocarbon structure as a ring structure and does not include an aromatic ring structure. However, the alicyclic hydrocarbon group does not need to be composed solely of an alicyclic hydrocarbon structure and includes having a chain structure in a part thereof. "Aromatic hydrocarbon group" refers to a hydrocarbon group that includes an aromatic ring structure as a ring structure. However, the aromatic hydrocarbon group does not need to be composed solely of an aromatic ring structure and may include a chain structure or an alicyclic hydrocarbon structure in a part thereof. In addition, the ring structure of the alicyclic hydrocarbon group and the aromatic hydrocarbon group may have a substituent consisting of a hydrocarbon structure. In this specification, "(meth)acryloyl" means including "acryloyl" and "methacryloyl," and "(meth)acryl" means including "acryl" and "methacryl." "(meth)acrylate" means including "acrylate" and "methacrylate." ≪Radioactive Composition≫ The radioactive composition according to the present embodiment (hereinafter also referred to as "the present composition") is, A polymer (A) comprising a structural unit (I) derived from a compound having a complex ring structure with a reduction number of 5 or more, and alkali-soluble polymer (B) and, quinonediazide compound (C) and, Solvent (S) Contains, The above heterocyclic structure is at least one selected from the group consisting of a cyclic ether structure, a cyclic ester structure, a cyclic imide structure, and a triazole ring-containing structure, and The content of the above structural unit (I) is 50 mass% or more with respect to the total structural units constituting the polymer (A). Below, each component included in the present composition and other components incorporated as necessary are described. <Polymer (A)> The above polymer (A) is an aggregate of polymer chains (hereinafter, this aggregate is also referred to as "base polymer (A)"). The above polymer (A) comprises a structural unit (I) derived from a compound having a heterocyclic structure with 5 or more reduced waters, and the content of the structural unit (I) is 50 mass% or more with respect to the total structural units constituting the polymer (A). The above polymer (A) preferably comprises a structural unit (II) having a crosslinkable group. When the polymer (A) comprises the structural unit (II) together with the structural unit (I), the structural unit (I) and the structural unit (II) may be contained in the same polymer chain, or the structural unit (I) may be contained in one polymer chain and the structural unit (II) may be contained in another polymer chain. That is, the