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KR-20260064605-A - MANUFACTURING METHOD FOR CIRCUIT BOARD

KR20260064605AKR 20260064605 AKR20260064605 AKR 20260064605AKR-20260064605-A

Abstract

[Problem] To provide a method for manufacturing a circuit board having a fine and thin insulating layer. [Solution] A method for manufacturing a circuit board comprising, in this order, a process of forming a resin pattern by dispensing a resin composition using a jet dispenser onto a substrate, a process of forming an insulating pattern by curing the resin pattern, a process of forming a conductive layer on the substrate and the insulating pattern by electroplating, and a process of forming a conductive pattern by removing a part of the conductive layer; wherein the resin composition comprises a thermosetting resin, an organic solvent, an inorganic filler, and a thermoplastic resin; and when the total component of the resin composition is 100 mass%, the relationship X≥30 and X/Y+X/Z<10 is satisfied when the mass ratio of the organic solvent is X (mass%), the mass ratio of the inorganic filler is Y (mass%), and the mass ratio of the thermoplastic resin is Z (mass%).

Inventors

  • 에도 유키노리

Assignees

  • 아지노모토 가부시키가이샤

Dates

Publication Date
20260507
Application Date
20251029
Priority Date
20241030

Claims (17)

  1. (I) A process of forming a resin pattern by dispensing a resin composition onto a substrate using a jet dispenser, (II) A process of forming an insulating pattern by curing the above resin pattern, (III) A process of forming a conductive layer on the above-mentioned substrate and the above-mentioned insulating pattern by electroplating and (IV) A method for manufacturing a circuit board comprising a process of forming a conductor pattern by removing a portion of the conductor layer in this order, The above resin composition is a resin composition comprising (A) a thermosetting resin, (B) an organic solvent, (C) an inorganic filler, and (D) a thermoplastic resin, wherein When the total components of the above resin composition are set to 100 mass%, and (B) the content of the organic solvent is X (mass%), (C) the content of the inorganic filler is Y (mass%), and (D) the content of the thermoplastic resin is Z (mass%), X≥30, also, X/Y+X/Z<10 A method for manufacturing a circuit board that satisfies the relationship.
  2. A method for manufacturing a circuit board according to claim 1, wherein the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 100 rpm is 350 mPa·s or more and 1,500 mPa·s or less.
  3. A method for manufacturing a circuit board according to claim 1, wherein (A) the thermosetting resin comprises at least one of an epoxy resin and a maleimide resin.
  4. In paragraph 3, (A) a method for manufacturing a circuit board in which a thermosetting resin comprises a curing agent.
  5. In claim 1, (B) the organic solvent comprises an organic solvent having a boiling point of 100°C or higher and 200°C or lower, and A method for manufacturing a circuit board, wherein the content of an organic solvent having a boiling point of 100°C or higher and 200°C or lower is 50% or higher when the total amount of organic solvent in the resin composition is 100% by mass.
  6. In claim 1, (C) a method for manufacturing a circuit board in which the average particle diameter of the inorganic filler is 0.4 μm or less.
  7. In claim 1, (C) a method for manufacturing a circuit board in which an inorganic filler comprises silica.
  8. A method for manufacturing a circuit board according to claim 1, wherein (C) the content of the inorganic filler is 20 mass% or more and 70 mass% or less when the component other than the organic solvent in the resin composition is 100 mass%.
  9. In claim 1, (D) a method for manufacturing a circuit board in which the thermoplastic resin contains an aromatic ring.
  10. A method for manufacturing a circuit board according to claim 1, wherein (D) the content of the thermoplastic resin is 15 mass% or more and 40 mass% or less when the component other than the organic solvent in the resin composition is 100 mass%.
  11. In paragraph 1, after process (II), also, before process (III), The process includes harmonizing the above insulation pattern, Process (III) is, A process of forming a plating seed layer by wet plating on the above substrate and the above insulation pattern, and A method for manufacturing a circuit board, comprising the process of forming a conductor layer consisting of a copper monometal layer on the plating seed layer by electroplating in the above sequence.
  12. In paragraph 1, process (III) is, A process of forming a plating seed layer by dry plating on the above substrate and the above insulation pattern, and The process of forming a conductor layer consisting of a copper monometal layer on the above-mentioned plating seed layer by an electrolytic plating method is included in this order. A method for manufacturing a circuit board, wherein the plating seed layer comprises a conductive seed layer made of a metal including copper, and a diffusion barrier layer made of a metal including titanium between the conductive seed layer, the substrate, and the insulating pattern.
  13. A method for manufacturing a circuit board according to claim 1, wherein the line width of the insulating pattern is 300 μm or less.
  14. A method for manufacturing a circuit board according to claim 1, wherein the thickness of the insulating pattern is 15 μm or less.
  15. In paragraph 1, A method for manufacturing a circuit board that additionally satisfies the relationship X/Y + X/Z > 4.
  16. A method for manufacturing a circuit board according to claim 1, wherein the circuit board is a semiconductor package substrate.
  17. A semiconductor device having a circuit board manufactured by a manufacturing method described in any one of claims 1 to 16.

Description

Manufacturing Method for Circuit Board The present invention relates to a method for manufacturing a circuit board. Circuit boards, such as printed circuit boards, are widely used in various electronic devices. As a manufacturing method for circuit boards, a build-up method is known in which insulating layers and conductive layers are alternately stacked on an inner substrate. As an example of the build-up method, there is a technique in which conductive layers are created and then covered with insulating layers to be stacked. In this method, methods for covering conductive layers with insulating layers include, for example, the lamination method, spin coating method, curtain coating method, dip coating method, spray coating method, and slit coating method. However, in the above methods, there was a problem in that it was impossible to form an insulating layer only at specific locations on the conductive layer because the insulating layer uniformly covers the entire conductive layer. On the other hand, as a method for manufacturing a circuit board in which a conductive layer is formed only at specific locations, a method of dispensing a conductive material using a jet dispenser is known. As a method for manufacturing a circuit board including a process of dispensing a conductive material using a jet dispenser, for example, the technology of Patent Documents 1 and 2 is disclosed. Hereinafter, the present invention will be described in detail by presenting embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and may be implemented with arbitrary modifications within the scope of the claims of the present invention and equivalent scopes without departing from the scope thereof. [Explanation of Terms] In this specification, the term “may have a substituent” with respect to a compound or group means both cases where the hydrogen atoms of the compound or group are not substituted with a substituent and cases where some or all of the hydrogen atoms of the compound or group are substituted with a substituent. In this specification, the term “substituent” means, unless specifically explained otherwise, a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, a cycloalkyloxy group, an aryl group, an aryloxy group, an arylalkyl group, an aryl alkoxy group, a monovalent heterocyclic group, an alkylidene group, an amino group, a silyl group, a carboxyl group, a sulfo group, a cyano group, a nitro group, a hydroxyl group, a mercapto group, and an oxo group. In this specification, the term “aromatic ring” refers to a ring according to Hückel’s rule in which the number of electrons contained in the π electron system on the ring is 4n+2 (where n is an integer greater than or equal to 1), and includes a monocyclic aromatic ring and a condensed aromatic ring formed by the condensation of two or more monocyclic aromatic rings. An aromatic ring may be an aromatic carbon ring having only carbon atoms as ring constituent atoms, or an aromatic complex ring having heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms in addition to carbon atoms as ring constituent atoms. In this specification, the term “heteroatom” refers to an atom other than carbon atoms and hydrogen atoms, and examples include oxygen atoms, nitrogen atoms, sulfur atoms, silicon atoms, etc. In this specification, the term “(meth)acryloyl group” includes acryloyl groups, methacryloyl groups, and combinations thereof. Additionally, the term “(meth)acrylate compound” refers to a compound having a (meth)acryloyl group and includes acrylate compounds, methacrylate compounds, and combinations thereof. However, (meth)acrylate compounds do not include (meth)acrylic acid. Additionally, the term “(meth)acrylic acid” includes acrylic acid, methacrylic acid, and combinations thereof. In this specification, the term "non-volatile component" used with respect to a resin composition refers to a component among the components constituting the resin composition other than the organic solvent described below. Furthermore, the term "resin component" used with respect to a resin composition refers to a component among the non-volatile components constituting the resin composition other than the inorganic filler described below. [Resin Composition] Before describing in detail the method for manufacturing a circuit board of the present invention, the resin composition for forming the resin pattern in process (I) of the manufacturing method is described. A resin composition forming a resin pattern comprises (A) a thermosetting resin, (B) an organic solvent, (C) an inorganic filler, and (D) a thermoplastic resin. Furthermore, when the total components in the resin composition are set to 100 mass%, the resin composition is such that when the content of (B) the organic solvent is X (mass%), the content of (C) the inorganic filler is Y (mass%), and the content of (D) the thermoplastic r