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KR-20260064654-A - SYSTEM FOR FIXING SEMICONDUCTOR WAFER TO ELECTROSTATIC CHUCK AND METHOD FOR FIXING SEMICONDUCTOR WAFER TO ELECTROSTATIC CHUCK USING THE SAME

KR20260064654AKR 20260064654 AKR20260064654 AKR 20260064654AKR-20260064654-A

Abstract

A system for fixing a semiconductor wafer to an electrostatic chuck according to one embodiment of the present invention comprises an electrostatic chuck, a substrate layer, a conductive layer formed on the substrate layer, and an adhesive layer formed on the conductive layer, and includes a semiconductor adhesive film fixed to the electrostatic chuck such that the substrate layer faces the electrostatic chuck, and a semiconductor wafer adhered to the adhesive layer. The system for fixing a semiconductor wafer to an electrostatic chuck and the method for fixing a semiconductor wafer to an electrostatic chuck according to the present invention allow the semiconductor wafer to be stably fixed to the electrostatic chuck and also separated by the semiconductor adhesive film being adhered to the semiconductor wafer.

Inventors

  • 이지문
  • 장영훈
  • 도상길
  • 유경석
  • 이규완
  • 조한빈
  • 하태용
  • 송경미

Assignees

  • 율촌화학 주식회사

Dates

Publication Date
20260507
Application Date
20260213
Priority Date
20241030

Claims (20)

  1. Power outage chuck; A semiconductor adhesive film comprising a substrate layer, a conductive layer formed on the substrate layer, an adhesive layer formed on the conductive layer, and a release film layer formed on the adhesive layer, wherein the substrate layer is fixed to the electrostatic chuck so as to face the electrostatic chuck; and A semiconductor wafer that adheres to the adhesive layer after the release film layer is peeled off from the adhesive layer; comprising A system for fixing a semiconductor wafer to an electrostatic chuck, wherein, when voltage is applied to the electrostatic chuck, the force with which the electrostatic chuck fixes the semiconductor adhesive film in the horizontal direction is formed to be 200 gf/150 mm or more while the semiconductor adhesive film is fixed to the electrostatic chuck before the release film layer is removed.
  2. In claim 1, A system for fixing a semiconductor wafer to an electrostatic chuck, wherein the adhesive layer of the above semiconductor adhesive film adheres to a coating layer formed on the semiconductor wafer.
  3. In claim 1, A system for fixing a semiconductor wafer to an electrostatic chuck, wherein the semiconductor wafer is fixed to the electrostatic chuck when voltage is applied to the electrostatic chuck, and the semiconductor wafer is separated from the electrostatic chuck when voltage is not applied to the electrostatic chuck.
  4. In claim 1, A system for fixing a semiconductor wafer to an electrostatic chuck, wherein when no voltage is applied to the electrostatic chuck, the force with which the electrostatic chuck fixes the semiconductor adhesive film in the horizontal direction is formed to be 1 gf/150 mm or less.
  5. In claim 1, A system for fixing a semiconductor wafer to an electrostatic chuck, wherein the magnitude of the force for peeling the release film layer from the adhesive layer in the semiconductor adhesive film is formed to be 0.8 to 1.1 gf/25mm.
  6. In claim 2, A system for fixing a semiconductor wafer to an electrostatic chuck, wherein the adhesive force formed between the coating layer and the adhesive layer is 0.8 gf/25mm or more and less than 2.5 gf/25mm.
  7. In claim 6, A system for fixing a semiconductor wafer to an electrostatic chuck, characterized in that the adhesive force formed between the coating layer and the adhesive layer is maintained even at 10 to 110 degrees.
  8. In claim 1, A system for fixing a semiconductor wafer to an electrostatic chuck, wherein the Young's modulus value of the semiconductor adhesive film is formed to be 3500 to 4300 N/ mm² .
  9. In claim 2, The above adhesive layer is, A system for fixing a semiconductor wafer to an electrostatic chuck, comprising a silicon-based compound.
  10. In claim 2, The above coating layer is, A system for fixing a semiconductor wafer to an electrostatic chuck, formed with an organic coating agent.
  11. A method for fixing a semiconductor wafer to an electrostatic chuck using a semiconductor adhesive film in which a substrate layer, a conductive layer, an adhesive layer, and a release film layer are laminated in sequence, A semiconductor adhesive film fixing step, wherein after voltage is applied to the electrostatic chuck, the semiconductor adhesive film is fixed to the electrostatic chuck such that the substrate layer faces the electrostatic chuck, and when voltage is applied to the electrostatic chuck, the force with which the electrostatic chuck fixes the semiconductor adhesive film in the horizontal direction is formed to be 200 gf/150 mm or more; A release film layer peeling step for peeling off the release film layer from the adhesive layer of the semiconductor adhesive film; and A method for fixing a semiconductor wafer to an electrostatic chuck, comprising: a semiconductor wafer adhesion step of adhering the semiconductor wafer to the adhesive layer.
  12. In claim 11, An electrostatic chuck separation step of separating the semiconductor wafer and the semiconductor adhesive film together from the electrostatic chuck after the applied voltage in the electrostatic chuck is turned off; and A method for fixing a semiconductor wafer to an electrostatic chuck, comprising a semiconductor wafer peeling step of separating the semiconductor wafer from the adhesive layer.
  13. In claim 11 or 12, In the above semiconductor wafer adhesion step, A method for fixing a semiconductor wafer to an electrostatic chuck, wherein a coating layer formed on the semiconductor wafer and an adhesive layer are bonded to each other.
  14. In claim 13, In the above semiconductor wafer peeling step, A method for fixing a semiconductor wafer to an electrostatic chuck, characterized by separating the coating layer and the adhesive layer from each other.
  15. In claim 12, A method for fixing a semiconductor wafer to an electrostatic chuck, wherein, in the electrostatic chuck separation step, when no voltage is applied to the electrostatic chuck, the force with which the electrostatic chuck fixes the semiconductor adhesive film in the horizontal direction is formed to be 1 gf/150 mm or less.
  16. In claim 11, A method for fixing a semiconductor wafer to an electrostatic chuck, wherein, in the above-mentioned release film layer peeling step, the magnitude of the force for peeling the release film layer from the adhesive layer in the semiconductor adhesive film is formed to be 0.8 to 1.1 gf/25mm.
  17. In claim 14, A method for fixing a semiconductor wafer to an electrostatic chuck, wherein, in the above semiconductor wafer peeling step, the adhesive force formed between the coating layer and the adhesive layer is formed such that the adhesive force is 0.8 or more and less than 2.5 gf/25 mm.
  18. In claim 17, A method for fixing a semiconductor wafer to an electrostatic chuck, characterized in that, in the semiconductor wafer peeling step, the adhesive force formed between the coating layer and the adhesive layer is maintained even at 10°C to 110°C.
  19. In claim 11, A method for fixing a semiconductor wafer to an electrostatic chuck, wherein the Young's modulus value of the semiconductor adhesive film after the above release film layer peeling step is formed to be 3500 to 4300 N/ mm² .
  20. In claim 13, The above adhesive layer is, A method for fixing a semiconductor wafer to an electrostatic chuck, comprising a silicon-based compound.

Description

System for fixing a semiconductor wafer to an electrostatic chuck and method for fixing a semiconductor wafer to an electrostatic chuck using the same The present invention relates to a system for fixing a semiconductor wafer to an electrostatic chuck and a method for fixing a semiconductor wafer to an electrostatic chuck using the same. More specifically, the invention relates to a system for fixing a semiconductor wafer to an electrostatic chuck and a method for fixing a semiconductor wafer to an electrostatic chuck using the same, which can stably fix the semiconductor wafer to an electrostatic chuck (ESC) and stably detach the semiconductor wafer. Recently, there has been an even greater demand for the thinning and miniaturization of semiconductor devices and their packages. Consequently, as semiconductor wafers become thinner, electrostatic chucks (ESCs) are utilized to effectively secure them. An electrostatic chuck is a device used to secure wafers in the semiconductor manufacturing process; it fixes the wafer using electrical force and, unlike conventional methods such as physical clamps or vacuum suction, minimizes damage caused by contact and provides uniform fixing force. In order to fix a semiconductor wafer in such an electrostatic chuck, a semiconductor adhesive film may be attached to the wafer. In this case, in order for the wafer to be fixed in the electrostatic chuck through electrical force, the semiconductor adhesive film must have appropriate electrical properties and, at the same time, be able to minimize the generation of residue or bubbles that may occur during attachment to the semiconductor wafer. In addition, the design must ensure that the semiconductor wafer is stably fixed in the electrostatic chuck when voltage is applied to the electrostatic chuck, and that the semiconductor wafer can be detached from the electrostatic chuck when voltage is not applied to the electrostatic chuck. FIG. 1 is a conceptual diagram of a system for fixing a semiconductor wafer to an electrostatic chuck according to an embodiment of the present invention; FIGS. 2 to 6 are conceptual diagrams illustrating a method of fixing a semiconductor wafer to an electrostatic chuck according to an embodiment of the present invention; and FIGS. 7 and 8 are graphs showing the Young's modulus value of a semiconductor adhesive film used in a system for fixing a semiconductor way to an electrostatic chuck according to an embodiment of the present invention. Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. The present invention is not limited to specific embodiments and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention. In connection with the description of the drawings, similar reference numerals may be used for similar components. In this document, expressions such as "have," "can have," "include," or "can include" refer to the existence of the relevant feature (e.g., numerical values, functions, actions, or components, etc.) and do not exclude the existence of additional features. In this document, expressions such as “A or B,” “at least one of A or/and B,” or “one or more of A or/and B” may include all possible combinations of items listed together. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” may refer to cases including (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B. As used in this document, the expression "configured to" may be replaced, depending on the context, with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to." The terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embodiments of this document. Therefore, it should be understood that the configurations of the embodiments described in this specification are merely some of the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, and that various equivalents and modifications that can replace them may exist