KR-20260064669-A - SYSTEM FOR DETECTING DEFECTS OF OBJECT USING HARMLESS TERAHERTZ WAVES

Abstract

The present invention provides a system and method for detecting defects in an object using terahertz waves. The object defect detection system using terahertz waves includes i) a terahertz wave transmitter that transmits terahertz waves toward an object, ii) a terahertz wave receiver that receives terahertz waves that have passed through the object, and iii) a defect analyzer that analyzes terahertz waves received from the terahertz wave receiver.

Inventors

• 정연하
• 김성수
• 최병화

Assignees

• 한국전력공사

Dates

Publication Date

20260507

Application Date

20260409

Claims (2)

1. As an object defect detection system using terahertz waves, A terahertz wave transmitter that emits terahertz waves toward the above object, A terahertz wave receiver that receives terahertz waves passing through the above object, A fault analyzer that analyzes terahertz waves received from the above terahertz wave receiver, A pair of supports extending from both ends of the plurality of terahertz wave source arrays in a direction intersecting the arrangement direction of the plurality of terahertz wave source arrays, and A jig spaced apart from the plurality of terahertz wave source arrays and interconnecting the ends of a pair of supports Includes, The above terahertz wave transmitter includes a plurality of terahertz wave source arrays, and The plurality of terahertz wave source arrays are interconnected in a direction surrounding the object, and Among the plurality of terahertz source arrays mentioned above, mutually adjacent terahertz source arrays are connected while forming mutually obtuse angles, and The above terahertz wave source array includes a plurality of terahertz wave source units connected adjacently to each other, and the plurality of terahertz wave source units, Substrate, and A hemispherical terahertz wave source positioned on the substrate and applied to emit the terahertz waves An object defect detection system including
2. In paragraph 1, An object defect detection system in which the above obtuse angle is 120° to 160°.

Description

System for detecting object defects using harmless terahertz waves The present invention relates to a defect detection system and method for an object. More specifically, the present invention relates to a defect detection system and method for an object using terahertz waves. Failures of components, such as distribution cable connectors, account for a significant proportion of overall distribution cable failures. The causes of connector failure involve a complex interplay of manufacturing and installation defects; over time, these defects worsen due to thermal, electrical, mechanical, and environmental factors during prolonged operation, ultimately leading to insulation breakdown. As inspection and diagnostic methods to prevent and avoid accidents in distribution cables caused by such faults, VLF (Very Low Frequency) tanδ in dead line conditions, VLF PD (Partial Discharge), or online PD diagnostic methods are applied. However, in the field of underground transmission, load switching is difficult, so only the partial discharge diagnostic method using HFCT (High Frequency Current Transformer) sensors is used in the normal operation state. As an alternative diagnostic method, non-destructive diagnostic technology is also being developed. For underground transmission junction boxes, technology is being developed to determine the structure, dimensions, and suitability for construction using 3D X-ray imaging. However, the inspection equipment is large and complex, making installation impossible when considering the conditions of power conduits or manholes. Furthermore, its utility is low due to the limitation that X-rays are harmful to the human body and can only be performed by qualified professionals. FIG. 1 is a schematic diagram of the usage state of an object defect detection system according to one embodiment of the present invention. Figure 2 is a schematic cross-sectional view of the usage state of an object defect detection system cut along line II-II of Figure 1. Figure 3 is a schematic perspective view of the terahertz wave transmitter of Figure 1. Figure 4 is a schematic diagram of the terahertz wave source array of Figure 3. Figure 5 is a schematic block diagram of the object defect detection system of Figure 1. Figure 6 is a schematic block diagram of the defect analyzer of Figure 5. Figure 7 is a schematic hardware structure diagram of the fault analyzer of Figure 6. FIG. 8 is a schematic flowchart of an object defect detection method according to one embodiment of the present invention. Figure 9 is a schematic detailed flowchart of the step of detecting defects in the object of Figure 8. Figure 10 is a schematic graph of relative values provided and output according to the spatial resolution of each part of the object in Figure 9. Figure 11 is a schematic cumulative graph of the intensity provided and output according to the spatial resolution of the object in Figure 9. Figure 12 is a schematic diagram showing the graph of Figure 10 with colors distinguished by the number of times the same relative value occurs. Figure 13 is a schematic graph showing the number of times in Figure 12 according to the spatial resolution of the object by part. The technical terms used herein are for the reference of specific embodiments only and are not intended to limit the invention. The singular forms used herein include plural forms unless phrases clearly indicate otherwise. The meaning of "comprising" as used in the specification specifies a particular characteristic, area, integer, step, action, element, and/or component, and does not exclude the presence or addition of other particular characteristic, area, integer, step, action, element, component, and/or group. Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as generally understood by those skilled in the art to which this invention pertains. Terms defined in commonly used dictionaries are further interpreted to have meanings consistent with relevant technical literature and the present disclosure, and are not interpreted in an ideal or highly formal sense unless otherwise defined. For example, the term “applied” described below is interpreted to include both the state in which it is appropriately used and the state prior to appropriate use. Expressions described in the singular in this specification may be interpreted as singular or plural unless explicit expressions such as "one" or "single" are used. In this specification, terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present disclosure, the first component may be named the second component, and similarly, the second component may be named the first component. In the flowchart described with