KR-20260064692-A - Method for inspecting pinholes and degassing defects in a sealed bag of a sealed storage container, and device for inspecting pinholes and degassing defects in a sealed bag of a sealed storage container.

Abstract

The present invention is a method for inspecting pinholes and degassing defects in a sealed container, wherein the sealed container containing a semiconductor wafer is sealed in a resin or aluminum-deposited bag in a degassing state so as not to come into contact with the outside air, and the presence or absence of pinholes and degassing defects in the bag, wherein the sealed container is sealed in a degassing state so as not to come into contact with the outside air, and the method comprises: a pressing process in which at least one side of the bag sealed in the sealed container is pressed with a pad after a certain amount of time has elapsed after the sealed container is sealed; a measuring process in which the distance between the upper part and the sensor is measured using a sensor provided above the upper part of the bag sealed in the sealed container is measured in the pressing process; and a determination process in which the presence or absence of pinholes and degassing defects in the bag are determined based on the distance measured in the measuring process. Accordingly, an inspection method is provided that can determine the presence or absence of pinholes or the presence or absence of degassing defects in a sealed storage container by a simple method, regardless of the inspector.

Inventors

• 무카에, 후미카츠
• 사토, 세이지
• 사토, 아츠시

Assignees

• 신에쯔 한도타이 가부시키가이샤

Dates

Publication Date

20260507

Application Date

20240813

Priority Date

20230912

Claims (4)

1. A method for inspecting pinholes and degassing defects in a sealed container, wherein the sealed container containing a semiconductor wafer is sealed in a resin or aluminum-coated bag in a degassing state so as not to come into contact with the outside air, and the presence or absence of pinholes and degassing defects in the bag. A pressurizing process in which, after sealing the packaging, a certain amount of time has elapsed, at least one side of the envelope body that seals the sealed storage container is pressed with a pad, and A measurement process for measuring the distance between the upper part and the sensor in a pressurized state during the pressurization process, using a sensor provided above the upper part of the bag body that has sealed the above-described sealed storage container; and A determination process for determining the presence or absence of pinholes and the presence or absence of degassing defects in the envelope body based on the distance measured in the above measurement process, A method for inspecting pinholes and degassing defects in a sealed envelope containing a sealed storage container, characterized by including
2. In paragraph 1, A method for inspecting pinholes and degassing defects in a sealed envelope containing a sealed storage container, characterized by setting the above-mentioned fixed time to 10 minutes.
3. In paragraph 1 or 2, After sealed packaging, the process further includes a pre-pressure measurement process that measures the distance between the upper part and the sensor using the sensor before the pressurization process. A method for inspecting pinholes and degassing defects in a sealed storage container, wherein the above determination process determines that there is a pinhole when the displacement amount, which is the difference between the distance measured in the above measurement process before pressurization and the above measurement process, is 1.0 mm or more.
4. A device for inspecting pinholes and degassing defects in a sealed container, wherein the sealed container containing a semiconductor wafer is sealed in a resin or aluminum-coated bag in a degassing state so as not to come into contact with the outside air, and the device inspects the presence or absence of pinholes and degassing defects in the bag. A pad that presses at least one side of the bag body that has sealed the sealed storage container after a certain period of time has elapsed following the sealed packaging, and A sensor provided above the upper part of the bag body that seals the above-determined sealed storage container, for measuring the distance from the upper part in a state where it is pressed by the pad, Equipped with, An inspection device for pinholes and degassing defects in a sealed storage container, characterized by determining the presence or absence of pinholes and degassing defects in the bag body based on the measured distance.

Description

Method for inspecting pinholes and degassing defects in a sealed bag of a sealed storage container, and device for inspecting pinholes and degassing defects in a sealed bag of a sealed storage container. The present invention relates to a method for inspecting pinholes and degassing defects in a bag body that has sealed a sealed storage container, and an apparatus for inspecting pinholes and degassing defects in a bag body that has sealed a sealed storage container. Recently, as the high integration and miniaturization of semiconductor devices have progressed, contamination control of substrates, such as preventing the adhesion of particles to wafers (hereinafter referred to as "wafers"), has become increasingly strict. For example, when transporting semiconductor wafers such as silicon, the wafers are placed in a sealed container such as a FOSB (Front Opening Shipping Box) or FOUP (Front Opening Unified Pod), and these sealed containers are further sealed and packaged into a resin bag or further an aluminum-coated bag for transport. A resin-based envelope or, furthermore, an aluminum-deposited envelope is a moisture-proof envelope designed to prevent contact with the atmosphere containing dust during transport, or to prevent condensation from forming on the surface of a semiconductor wafer stored in a sealed container due to the influence of humidity. Meanwhile, various types of sealed packaging are known, not limited to wafers (Patent Documents 1-3). Figure 1 shows a schematic diagram of a sealed storage container (FOSB). Figure 2 shows a schematic diagram of a sealed storage container (FOSB) sealed with packaging material. Figure 3 shows a schematic diagram of an example of measuring the distance between the top of a sealed storage container (FOSB) and the sealed packaging material using a distance measuring sensor. FIG. 4 shows a schematic diagram of an example in which a pressure pad is used to press the side of a packaging material that has sealed a storage container (FOSB) and a distance measuring sensor is used to measure the distance to the top of the packaging material that has sealed the storage container (FOSB). FIG. 5 shows a schematic diagram of an example of measuring the distance to the top of a packaging material that seals a pinhole-drilled sealed storage container (FOSB) using a distance measuring sensor. FIG. 6 shows a schematic diagram of an example in which a pressure pad is used to apply pressure to the side of a packaging material that has sealed a storage container (FOSB) and to measure the distance to the top of the packaging material that has sealed a storage container (FOSB) with a pinhole formed by a distance measuring sensor. The present invention will be described in detail below, but the invention is not limited to these. As described above, there was a need for an inspection method capable of determining the presence or absence of pinholes or poor degassing in the sealed packaging of a sealed storage container by a simple method, regardless of the inspector. As a result of repeated careful consideration of the above problem, the inventors have provided a method for inspecting pinholes and degassing defects in a sealed container, wherein the sealed container containing a semiconductor wafer is sealed in a resin or aluminum-coated envelope in a degassing state so as not to come into contact with the outside air, and the presence or absence of pinholes and degassing defects in the envelope, wherein the method comprises: a pressing process in which, after sealing the container, at least one side of the envelope containing the sealed container is pressed with a pad after a certain amount of time has elapsed; a measuring process in which the distance between the upper part and the sensor is measured using a sensor provided above the upper part of the envelope containing the sealed container in the pressing process, while the seal is pressed; and a determining process in which the presence or absence of pinholes and degassing defects in the envelope are determined based on the distance measured in the measuring process. By this method, the presence or absence of pinholes and degassing defects in the envelope containing the sealed container can be inspected by a simple method regardless of the inspector. The present invention was completed by discovering a method to determine the presence or absence of defects. In addition, as described above, there was a need for an inspection device capable of easily determining the presence or absence of pinholes or deficiencies in the sealed packaging of a sealed storage container, regardless of the inspector. The inventors, having repeatedly examined the above problem, have discovered that, as a result, a device for inspecting pinholes and degassing defects in a sealed storage container is provided for inspecting the presence or absence of pinholes and degassing defects in a sealed storage container that is sealed in a resin or aluminum-coated