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KR-20260064756-A - DISPLAY MODULE MANUFACTURING SYSTEM AND METHOD THEREOF

KR20260064756AKR 20260064756 AKR20260064756 AKR 20260064756AKR-20260064756-A

Abstract

A manufacturing system and method using a display module manufacturing apparatus are provided. A manufacturing system using a display module manufacturing apparatus according to one aspect of the present disclosure may include the steps of: soldering each of at least one pad on a substrate having at least one pad formed thereon; flattening the solder formed on at least one pad to form a flattened portion; forming a flux on the flattened solder; placing an LED on the solder on which the flux has been formed; and soldering to fix the LED to the solder while removing the flux from the solder.

Inventors

  • 정승호
  • 권미주

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260508
Application Date
20241018

Claims (12)

  1. In a method for manufacturing a display module using a display module manufacturing device, A step of forming solder on each of the plurality of pads on a substrate having a plurality of pads formed thereon; A step of flattening each solder formed on the plurality of pads above; A step of forming flux on the flattened solder; A step of placing an LED on the solder on which the flux is formed; and A manufacturing method comprising the step of soldering the LED so as to fix it to the solder while removing the flux from the solder.
  2. In paragraph 1, The step of arranging the above LED is, A manufacturing method for 'seating one LED on at least two solders flattened on at least two consecutive pads among the plurality of pads, using the viscosity of the flux formed on the at least two solders.'
  3. In paragraph 2, The step of soldering to fix the above LED is, A manufacturing method for joining the LED and the solder by heating the substrate on which the LED is placed in a reflow chamber to remelt the flattened solder.
  4. In paragraph 1, The step of forming the above flux is, A manufacturing method comprising the step of covering the upper surface of the substrate on which the flattened solder is formed with the flux sheet.
  5. In paragraph 1, The step of forming the above flux is, A manufacturing method comprising the step of applying the above flux in a liquid form onto the flattened solder.
  6. In paragraph 1, The step of flattening the solder formed on the above-mentioned at least one pad is, A step of fixing the substrate to a jig using a vacuum adsorption method; and A manufacturing method comprising the step of grinding the upper side of the solder.
  7. In a display module manufacturing system using a display module manufacturing device, Transfer device; Flattening device; Reflow device; Flux treatment device; and Includes a processor; The above processor is, The reflow device is controlled to solder each of the plurality of pads formed on the substrate so that solder is formed on the plurality of pads, and The flattening device is controlled to flatten the solder formed on the pad, and Control the flux treatment device to form flux on the flattened solder, and The transfer device is controlled to place an LED on the solder on which the flux is formed, and A manufacturing system that controls the reflow device to fix the LED to the solder while removing the flux from the solder.
  8. In Paragraph 7, The above processor is, A manufacturing system that controls a transfer device to mount a single LED on at least two solders flattened on at least two consecutive pads among the plurality of pads, using the viscosity of the flux formed on the at least two solders.
  9. In Paragraph 7, The above processor is, A manufacturing system for combining the LED and the solder by controlling the reflow device to heat the substrate when the substrate on which the LED is placed is introduced into the reflow chamber of the reflow device, thereby remelting the flattened solder.
  10. In Paragraph 9, The above processor is, A manufacturing system that controls the flux treatment device to cover the upper surface of the substrate on which the flattened solder is formed with a flux sheet.
  11. In Paragraph 9, The above processor is, A manufacturing system that controls the flux treatment device to apply the flux in a liquid form onto the solder.
  12. In Paragraph 7, The above flattening device is, A jig for fixing the substrate by a vacuum adsorption method; and A manufacturing system comprising: a grinder for grinding the upper side of the solder while the substrate is fixed by the jig.

Description

Display module manufacturing system and method thereof for manufacturing a display module The present disclosure relates to a manufacturing system for manufacturing a display module and a method thereof. A display device is an output device that converts electrical information into visual information and displays it to a user. Recently, to realize large-sized screens, display devices in which multiple display modules are combined to form a single screen are also being developed and distributed. The display module used in such a display device may include micro LEDs capable of displaying images without a backlight. The display module drives the micro LEDs at the pixel or subpixel level to express various colors. The operation of each pixel or subpixel is controlled by a plurality of Thin Film Transistors (TFTs). The plurality of TFTs are arranged on a substrate, a glass substrate, or a plastic substrate, and this is referred to as a TFT substrate. In the process of manufacturing such display modules, soldering can be performed to fix multiple micro-LEDs onto a substrate. However, according to conventional technology, phenomena such as the LEDs tilting may occur during the process of placing the LEDs on the solder formed by soldering. In this case, problems such as the LED color being misperceived by viewers viewing the display device may occur. FIG. 1 is a perspective view illustrating a display module according to at least one embodiment of the present disclosure. FIG. 2 is a schematic diagram illustrating a display device according to at least one embodiment of the present disclosure. FIG. 3 is a block diagram illustrating the configuration of a display device manufactured according to at least one embodiment of the present disclosure. FIG. 4 is a block diagram illustrating the configuration of a display module manufacturing system according to at least one embodiment of the present disclosure. FIG. 5 is a schematic diagram illustrating a process in which a paste-type solder is printed in a display module manufacturing system according to at least one embodiment of the present disclosure. FIG. 6 is a schematic diagram illustrating a process in which soldering is performed in a display module manufacturing system according to at least one embodiment of the present disclosure. FIG. 7 is a schematic diagram showing the state of forming solder on a pad in a display module manufacturing system according to at least one embodiment of the present disclosure. FIGS. 8 and 9 are drawings illustrating a process for flattening solder in a display module manufacturing system according to at least one embodiment of the present disclosure. Figure 10 is a drawing showing solder flattened by the method of Figures 8 and 9. FIGS. 11, FIGS. 12, and FIGS. 13 are drawings illustrating an example of a method for performing flux treatment on a substrate. FIGS. 14 and 15 are drawings illustrating a process of transferring an LED onto a substrate in a display module manufacturing system according to at least one embodiment of the present disclosure. FIG. 16 is a drawing illustrating a process of performing heat treatment through a reflow device in a display module manufacturing system according to at least one embodiment of the present disclosure. Figure 17 is a diagram illustrating another example of a method for performing flux treatment on a substrate. FIGS. 18 and 19 are drawings for explaining the process of joining an LED to flux-treated solder using the method of FIG. 17. FIG. 20 is a drawing illustrating the configuration of a display module manufactured according to at least one embodiment of the present disclosure. FIG. 21 is a block diagram showing an example of a laser transfer device usable in a display module manufacturing system according to various embodiments of the present disclosure. FIG. 22 is a block diagram showing a laser oscillator of a laser transfer device according to one embodiment of the present disclosure. FIG. 23 is a flowchart sequentially illustrating a manufacturing method using a display module manufacturing device according to one embodiment of the present disclosure. The embodiments described in this specification may be modified in various ways. Specific embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the accompanying drawings are intended only to facilitate understanding of various embodiments. Accordingly, the technical concept is not limited by specific embodiments disclosed in the accompanying drawings, and it should be understood that it includes all equivalents or substitutions that fall within the spirit and scope of the invention. Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but these components are not limited by the aforementioned terms. The aforementioned terms are used solely for the purpose of distinguishing one component from anot