KR-20260064925-A - AUXILIARY TOOL FOR MEASURING THIN FILM THICKNESS AND METHOD FOR MEASURING THIN FILM THICKNESS USING THE SAME

Abstract

The present invention relates to an auxiliary device for measuring thin film thickness capable of accurately measuring the thickness of a metal thin film without using an actual substrate, and a method for measuring thin film thickness using the same. To this end, the present invention provides a method for measuring thin film thickness comprising the steps of: inserting a glass plate into a lower plate having a first hollow formed in the center; joining an upper plate having a second hollow formed on the glass plate; depositing a thin film on the glass plate; and determining the thickness of the thin film by measuring the thickness of the portion of the glass plate where deposition has not been completed and the portion where deposition has been completed. Accordingly, according to the present invention, the thickness of a metal thin film can be accurately measured in an easy manner without using an actual substrate, and since the auxiliary device can be cleaned and reused, the cost required for measuring the thin film thickness can be significantly reduced.

Inventors

• 안광재
• 박기웅
• 김선왕

Assignees

• (주)에스티아이

Dates

Publication Date

20260508

Application Date

20241030

Claims (4)

1. A step of inserting a glass plate into a lower plate having a first hollow formed in the center; A step of joining an upper plate having a second hollow formed thereon to the glass plate above; Step of depositing a thin film on the above glass plate; A method for measuring the thickness of a thin film by performing the step of determining the thickness of the thin film by measuring the thickness of the portion of the glass plate that has not been deposited and the portion where the deposition is completed.
2. In paragraph 1, A method for measuring thin film thickness, characterized in that a pair of bolt holes are formed in the lower plate with a first hollow space in between, and a pair of bolt holes are formed in the upper plate with a second hollow space in between, so that the upper plate and the lower plate are joined by bolts.
3. In paragraph 1, A method for measuring thin film thickness, characterized in that the first hollow and the second hollow are formed in a rectangular shape, and the longitudinal length of the first hollow is formed to be greater than the longitudinal length of the second hollow.
4. A bottom plate having a first hollow formed in the center and a support provided in the first hollow; A glass plate inserted into the first hollow above; and An auxiliary device for measuring thin film thickness, comprising a second hollow formed in the center and an upper plate that contacts the glass plate and is coupled to the lower plate.

Description

Auxiliary tool for measuring thin film thickness and method for measuring thin film thickness using the same The present invention relates to an auxiliary device for measuring thin film thickness and a method for measuring thin film thickness using the same, and specifically, to an auxiliary device for measuring thin film thickness and a method for measuring thin film thickness using the same that can accurately measure the thickness of a metal thin film without using an actual substrate. Semiconductors have a cross-section composed of numerous layers. In other words, the process of depositing thin films on a substrate is important for manufacturing semiconductors. Deposition methods include Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Physical Vapor Deposition (PVD). The metal thin film formed on the surface of a ceramic substrate is formed thin enough to be affected by the surface roughness of the substrate. To verify whether such a metal thin film has been properly deposited, it is necessary to measure the thickness of the metal thin film. According to the prior art registered patent No. 10-2570975, a metal thin film thickness detection device comprises: a first electrode and a second electrode positioned spaced apart from each other on the metal thin film and forming a closed circuit with the metal thin film; and a circuit unit electrically connecting the first electrode and the second electrode, wherein the circuit unit comprises: an input unit that inputs an alternating current signal to the closed circuit; and a measurement unit that measures the output signal of the closed circuit. According to this conventional technology, although there is an advantage in being able to detect the thickness of a metal thin film regardless of the type of metal, there is a problem in that the process is very cumbersome and expensive because complex devices must be provided to measure the thickness of the metal thin film. Alternatively, there is a method of placing glass with low surface roughness on a substrate and securing it with tape; after the process, the thickness of the metal thin film is measured by calculating the height difference between the parts of the glass where the tape was attached and where it was not. However, because this method uses actual substrates, it is not suitable for continuous use, and there is a high risk of tape damage due to heat, leading to the problem of substrate contamination. FIG. 1 is a configuration diagram showing an auxiliary device for measuring thin film thickness according to the present invention; FIG. 2 is a cross-sectional view showing a state in which a glass plate is inserted into a bottom plate; FIG. 3 is a cross-sectional view showing the state in which the top plate is joined in FIG. 2; FIG. 4 is a perspective view of FIG. 3; FIG. 5 is a cross-sectional view showing the state in which a thin film is formed by deposition in FIG. 3; FIG. 6 is a graph showing the thickness measured using a glass plate with completed deposition; Figure 7 is a graph showing the thickness of the edge of the glass plate. The configuration and operation of a specific embodiment according to the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, the auxiliary device for measuring thin film thickness according to the present invention comprises a lower plate (100), an upper plate (200), and a glass plate (300). The lower plate (100) is provided to serve as a substrate such as ceramic, and it is preferable that it be manufactured to be the same size as the substrate. In addition, the material of the lower plate is not limited, but it is preferable that it be made of stainless steel to facilitate cleaning for reuse without causing damage to the glass or differences in the process. A first hollow (120) is formed in the center of the lower plate (100) to accommodate a glass plate (300). The first hollow may be formed in a rectangular shape with a width x1 and a length y1, and a support (122) is provided in the width (x1) direction on the bottom to support the glass plate (300). Here, the length of the first hollow is formed to be greater than the width (y1 > x1). It is preferable that the above support (122) be provided in multiple numbers, and in this embodiment, two support members are provided. In addition, a pair of first bolt holes (140) are formed in the width direction with a first hollow space in between in the lower plate (100) for connection with the upper plate (200). Referring to FIG. 2, a glass plate (300) with a small surface roughness is inserted into the first hollow to measure the thickness of the metal thin film. It is preferable that the thickness of the glass plate be thick enough to protrude above the bottom plate. The glass plate must protrude slightly above the bottom plate so that it makes close contact with the top plate and no gaps are formed. If a gap occurs between the glass plate and the top plate,