KR-20260064977-A - Method for forming metal pattern and substrate comprising the metal pattern

Abstract

A method for forming a metal pattern (embossing patterning) according to one embodiment is provided. The method for forming a metal pattern comprises the steps of: preparing a substrate; forming a metal adhesion inhibiting layer on the substrate; forming a metal adhesion pattern on the metal adhesion inhibiting layer; and applying or depositing a metal onto the substrate to form a metal pattern on the metal adhesion pattern; wherein the metal adhesion inhibiting layer comprises a water-soluble polymer and a cellulose material.

Inventors

• 김성원
• 홍용택
• 남중건
• 송준결
• 이병걸
• 장동주

Assignees

• 삼성디스플레이 주식회사
• 서울대학교산학협력단

Dates

Publication Date

20260508

Application Date

20241030

Claims (20)

1. Step of preparing the substrate; A step of forming a metal adhesion inhibition layer on the above substrate; A step of forming a metal adhesion pattern on the metal adhesion inhibition layer; A step of forming a metal pattern on the metal adhesive pattern by applying or depositing a metal onto the substrate; A method for forming a metal pattern, wherein the metal adhesion inhibition layer comprises a water-soluble polymer and a cellulose material.
2. Step of preparing the substrate; A step of forming a metal adhesion inhibiting pattern on the substrate; A step of forming a metal pattern between the metal adhesion inhibition patterns by applying or depositing a metal over the substrate; and The step of selectively removing the metal adhesion inhibition pattern; comprising The above metal adhesion inhibition pattern is a metal pattern forming method comprising a water-soluble polymer and a cellulose material.
3. In paragraph 1 or 2, A method for forming a metal pattern, wherein the above-mentioned water-soluble polymer comprises polyvinyl alcohol or polyacrylic acid.
4. In paragraph 1 or 2, A method for forming a metal pattern, wherein the cellulose material comprises cellulose, methyl cellulose, ethyl cellulose, or a combination thereof, nanofiber, nanocrystal, microfiber, microcrystal, or a combination thereof.
5. In paragraph 1, A method for forming a metal pattern, further comprising the step of removing the metal adhesion inhibitor layer exposed by the metal pattern.
6. A method for forming a metal pattern, wherein the step of selectively removing the metal adhesion inhibition pattern of claim 2 or the step of removing the metal adhesion inhibition layer of claim 5 includes the step of washing with water.
7. In paragraph 1, A method for forming a metal pattern, wherein the step of forming the metal adhesion inhibition layer further includes the step of treating the surface of the metal adhesion inhibition layer with a hydrophobic material.
8. In paragraph 2, A method for forming a metal pattern, wherein the step of forming the metal adhesion inhibition pattern further includes the step of treating the surface of the metal adhesion inhibition petan with a hydrophobic material.
9. In Article 7 or Article 8, A method for forming a metal pattern, wherein the above-mentioned hydrophobic material comprises perfluorooctyltrichlorosilane (FOTS), perfluorodecyltrichlorosilane (FDTS), methacryloxypropyltrimethoxysilane (MPTMS), undecenyltrichlorosilane (UTS), vinyltrichlorosilane (VTS), decyltrichlorosilane (DTS), octadecyltrichlorosilane (OTS), dimethyldichlorosilane (DDMS), dodecyltrichlorosilane (DDTS), perfluorooctyldimethylchlorosilane, aminopropylmethoxysilane (APTMS), or a combination thereof.
10. In paragraph 1 or 2, A method for forming a metal pattern, wherein the substrate is a flexible substrate.
11. In paragraph 1 or 2, A method for forming a metal pattern, wherein the above metal includes a liquid metal (low melting point metal).
12. In paragraph 1 or 2, A method for forming a metal pattern, wherein the metal comprises silver (Ag), gold (Au), aluminum (Al), copper (Cu), magnesium (Mg), or a combination thereof.
13. In Paragraph 11, A method for forming a metal pattern, wherein the liquid metal is a gallium-indium eutectic alloy (EGaIn), a gallium-indium-tin eutectic alloy (Gainstan), or a combination thereof.
14. In paragraph 1, The above metal adhesive pattern is a metal pattern forming method comprising a flexible polymer.
15. In paragraph 1 or 2, A method for forming a metal pattern, wherein the application of the metal includes roller application or stamp application.
16. In paragraph 1 or 2, A method for forming a metal pattern, further comprising the step of forming a sealing layer over the metal pattern.
17. In Paragraph 11, A method for forming a metal pattern, wherein the weight ratio of the cellulose material and the water-soluble polymer is in the range of 0.1:1 to 4:1.
18. Substrate; A metal adhesion inhibitor layer on the above substrate; and Metal pattern structure on the metal adhesion inhibition layer; comprising The metal adhesion inhibitor layer comprises a composition of a cellulose material and a water-soluble polymer, and A substrate comprising a metal pattern structure, the metal pattern structure comprising a metal adhesive pattern; and a metal pattern on the metal adhesive pattern.
19. In Paragraph 18, The above metal pattern is a substrate comprising a metal pattern that includes a liquid metal.
20. In Paragraph 18, The above metal adhesive pattern is a substrate comprising a metal pattern comprising a flexible polymer.

Description

Method for forming metal pattern and substrate comprising the metal pattern The present invention relates to a method for forming a metal pattern. To form a flexible device, it is necessary to form flexible wiring or flexible electrodes. Liquid metals can be advantageous as materials for flexible wiring or flexible electrodes. Representative methods for patterning liquid metals include nozzle printing on a stencil mask, screen printing, spray coating, and mold injection, but these methods are unsuitable for high-resolution patterning processes. Therefore, a method for patterning liquid metals at high resolution is required. FIG. 1 is a flowchart schematically illustrating the sequence of a metal pattern formation method according to one embodiment. FIGS. 2a to 2e are schematic cross-sectional views illustrating, in sequence, a method for forming a metal pattern according to one embodiment. FIG. 3 is a flowchart schematically illustrating the sequence of a metal pattern formation method according to one embodiment. FIGS. 4a to 4d are schematic cross-sectional views illustrating, in sequence, a method for forming a metal pattern according to one embodiment. Figure 5a is an optical microscope image of the upper surface of the PVA substrate of Comparative Test Example 1 and the PVACF substrate of Test Example 1. Figure 5b is a graph showing the roughness measured by scanning the upper surface of the PVA substrate and PVACF substrate of Figure 5a in the direction of the arrow using a scratch test device. Figure 6 is a photograph of the PVA substrate of Comparative Test Example 2 and the PVACF substrate of Test Example 2. FIG. 7 shows photographs of EGaIn patterns formed by rolling a roller coated with EGaIn on the substrates of Comparative Test Example 3 and Test Examples 3 to 9, respectively. Figure 8 shows photographs of EGaIn patterns formed by roller application on the substrates of Test Examples 10 and 11, respectively. Figure 9 shows photographs of EGaIn patterns formed by roller coating on the substrates of Test Example 12 and Comparative Test Example 4, respectively. FIGS. 10a to 10c are optical microscope images of the upper surface of the PDMS-PVACF substrate during the EGaIn pattern formation process of Test Example 13. Figure 11 is a photograph of the upper surface of a substrate in which EGaIn is embossed with an LM pattern in Test Example 14. FIG. 12 shows top-surface optical microscope images of embossed patterned EGaIn lines in Test Examples 15 to 17. FIGS. 13a to 13c are optical microscope images of the upper surface of the PDMS-PVACF substrate during the EGaIn pattern formation process of Test Example 18. Figure 14 is a photograph of the upper surface of a substrate in which EGaIn is engraved with an LM pattern in Test Example 19. FIG. 15 shows top-surface optical microscope images of embossed patterned EGaIn lines in Test Examples 20 to 23. Figure 16 is a graph measuring the change in resistance over the stretching cycle of the PDMS/EGaIn strap of Test Example 24. Figure 17 is a graph measuring the change in resistance over the stretching cycle of the PDMS/EGaIn strap of Test Example 25. Figure 18 shows optical microscope images of the upper surface of the glass-PVACF substrate during the EGaIn pattern formation process of Test Example 26. The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted. In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component. In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise. In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added. In the following embodiments, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another film, region, or component is interposed in between. In the drawings, the size of components may be exaggerated o