KR-20260065051-A - Binder composition for electromechanical devices capable of improving crosslinking density, adhesive strength, and storage modulus

Abstract

The present invention provides a binder composition for an electromechanical device capable of improving crosslinking density, adhesive strength, and storage modulus. More specifically, the present invention provides a binder composition for an electromechanical device capable of improving crosslinking density, adhesive strength, and storage modulus, which can more easily deliver haptic effects to a user without damping haptic vibrations.

Inventors

• 배상한
• 배창준
• 권오은

Assignees

• 경원산업 주식회사
• 한국재료연구원

Dates

Publication Date

20260508

Application Date

20241031

Claims (5)

1. A first epoxy resin; and an epoxy resin mixture comprising a second epoxy resin having a different number of functional groups from the first epoxy resin; A curing agent comprising one or more benzene rings; and Optionally including an electrically conductive filler; Binder composition for electromechanical devices capable of improving crosslinking density, adhesive strength, and storage modulus.
2. In paragraph 1, A binder composition for an electromechanical device, wherein the first epoxy resin is a bisphenol-based modified epoxy resin.
3. In paragraph 1, Based on 100 parts by weight of a binder composition for electromechanical devices, An epoxy resin mixture comprising 70 to 90 parts by weight of a first epoxy resin; and a second epoxy resin; 10 to 30 parts by weight of a curing agent; or A binder composition for an electromechanical device comprising 20 to 70 parts by weight of an electrically conductive filler.
4. In paragraph 1, The above electrically conductive filler comprises one or more metal particles selected from nickel, aluminum, gold, silver, copper, tin, platinum, silicon, germanium, indium, antimony, platinum, bismuth, cadmium, zinc, molybdenum, and tungsten, one or more of graphite, carbon fibers, and carbon nanotubes, and is a binder composition for an electromechanical device.
5. In paragraph 1, The above binder composition for an electromechanical device is a binder composition for an electromechanical device having improved adhesive strength and crosslinking density, having at least one of the following (1) to (6): (1) The curing temperature is 140℃ or higher (2) Adhesion strength is 9 MPa or higher (3) Elongation is 1.25 mm or more (4) The storage modulus is 1,000 to 1,500 MPa at 150°C. (5) The loss modulus is 100 to 150 MPa at 150℃. (6) The loss tangent (Tan delta) is 0.4 or less at 150℃.

Description

Binder composition for electromechanical devices capable of improving crosslinking density, adhesive strength, and storage modulus The present invention relates to a binder composition for an electromechanical device capable of improving crosslinking density, adhesive strength, and storage modulus. More specifically, the present invention relates to a binder composition for an electromechanical device capable of improving crosslinking density, adhesive strength, and storage modulus, which can more easily deliver haptic effects to a user without damping haptic vibrations. Piezoelectric ceramics, utilized as electromechanical elements, are materials capable of mutually converting mechanical vibration energy into electrical energy and electrical energy into mechanical vibration energy, and are materials with very high conversion efficiency. Accordingly, piezoelectric ceramics are used in various devices such as haptic actuators, haptic sensors, ultrasonic sensors, energy harvesters, resonators, communication devices, medical devices such as ultrasonic blood flow meters, transformers for LCD backlights, ultrasonic motors, and transducers. Meanwhile, conventional haptic sensors are composed of metal and ceramic, and a binder is used to bond the metal and ceramic. However, conventional binders for haptic sensors dampen haptic vibrations, which has the problem of making it difficult to effectively implement haptic feedback. Therefore, there is a continuous demand for the development of technology that can effectively transmit vibrations to the piezoelectric ceramic and metal elements of the sensor without damping haptic vibrations. As background technology of the present invention, Korean published patent No. 10-2013-0045131 describes a haptic feedback module. FIG. 1 is an exemplary diagram schematically illustrating haptic driving by the structure of an actuator comprising a binder composition for an electromechanical device of the present invention, a piezoelectric ceramic, and a booster. FIG. 2 is a graph showing the heat flow according to temperature for Examples 1 to 4 of the binder composition for electromechanical devices of the present invention. Figure 3 is a graph showing the heat flow according to temperature for Preparation Examples 3, 5, and 6 of the binder composition for electromechanical devices of the present invention. Figure 4 is a graph showing the heat flow according to temperature for Preparation Examples 3 and 7 of the binder composition for electromechanical devices of the present invention. FIG. 5 is a graph showing the heat flow according to temperature for Preparation Examples 2, 3, 7, and 8 of the binder composition for electromechanical devices of the present invention. FIG. 6 is a graph showing the adhesive strength and elongation rate for Preparation Examples 2, 9, and 10 of the binder composition for electromechanical devices of the present invention. FIG. 7 is a graph showing the adhesive strength and elongation rate for Preparation Examples 3, 7, and 11 of the binder composition for electromechanical devices of the present invention. FIG. 9 is a graph showing the adhesive strength and elongation rate for Preparation Examples 12 and 13 of the binder composition for electromechanical devices of the present invention. FIG. 10 is a graph showing the adhesive strength and elongation rate for Preparation Examples 12 to 14 of the binder composition for electromechanical devices of the present invention. FIG. 11 is a graph showing the storage modulus according to temperature for Preparation Examples 2, 3, 7, and 8 of the binder composition for electromechanical devices of the present invention. FIG. 12 is a graph showing the loss modulus of elasticity according to temperature for Preparation Examples 2, 3, 7, and 8 of the binder composition for electromechanical devices of the present invention. FIG. 13 is a graph showing the loss tangent according to temperature for Preparation Examples 2, 3, 7, and 8 of the binder composition for electromechanical devices of the present invention. The object, specific advantages, and novel features of the present disclosure will become more apparent from the following detailed description and embodiments in conjunction with the accompanying drawings. Prior to this, terms and words used in this specification and claims should not be interpreted in their ordinary and dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of this disclosure, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention. In this specification, where a component, such as a layer, part, or substrate, is described as being "on," "connected," or "joined" to another component, it may be directly "on," "connected," or "joined" to the other component, or it may have one or more other components interposed between the two components. In contrast, where a component is de