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KR-20260065086-A - DEPOSITION APPARATUS AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE USING THE SAME

KR20260065086AKR 20260065086 AKR20260065086 AKR 20260065086AKR-20260065086-A

Abstract

A deposition apparatus according to the present invention may include a chamber and a deposition module comprising: a first deposition source disposed in an internal space and movable in a first direction and comprising a first deposition material; a second deposition source comprising a second deposition material; a third deposition source comprising a third deposition material; an angle limiting plate defined with a first opening overlapping the first deposition source in a plane, a second opening overlapping the second deposition source and comprising an open area and a blocking area, and a third opening overlapping the third deposition source; and a shutter operating in a blocking mode that blocks the blocking area and the first opening or an opening mode that opens the first opening and the second opening.

Inventors

  • 윤인택
  • 박성종
  • 한종분

Assignees

  • 삼성디스플레이 주식회사

Dates

Publication Date
20260508
Application Date
20241031

Claims (20)

  1. A chamber providing internal space; and A deposition device comprising a deposition module disposed in the internal space and movable in a first direction, comprising a first deposition source including a first deposition material, a second deposition source including a second deposition material, a third deposition source including a third deposition material, an angle limiting plate defined with a first opening overlapping the first deposition source in a plane, a second opening overlapping the second deposition source and including an open area and a blocking area, and a third opening overlapping the third deposition source, and a shutter operating in a blocking mode that blocks the blocking area and the first opening or an opening mode that opens the first opening and the second opening.
  2. In Article 1, In cross-section, the width of the second opening is, A deposition apparatus larger than the width of the first opening and the width of the third opening.
  3. In Article 1, The second discharge angle at which the second deposition material passes through the second opening is, A deposition apparatus in which the first discharge angle at which the first deposition material passes through the first opening and the third discharge angle at which the third deposition material passes through the third opening are greater than
  4. In Article 1, A deposition apparatus in which the first deposition source, the second deposition source, and the third deposition source are sequentially arranged along the first direction.
  5. In Article 1, A deposition apparatus in which the blocking region is defined to be adjacent to the first opening than the opening region.
  6. In Article 1, The second deposition material is a deposition apparatus different from the first deposition material and the third deposition material.
  7. In Article 6, The above first deposition material includes a first host material, and The above second deposition material includes a dopant material, and The above third deposition material is a deposition apparatus comprising a second host material.
  8. In Article 1, The first deposition source comprises a first body portion and a first nozzle disposed on the first body portion, and The second deposition source comprises a second body portion and a second nozzle disposed on the second body portion, and The above third deposition source is a deposition apparatus comprising a third body portion and a third nozzle disposed on the third body portion.
  9. In Article 1, The above shutter is provided in the form of a blocking plate movable in the first direction, and When the above shutter operates in the above shielding mode, The above shutter is a deposition device that shields the above blocking area and the above first opening.
  10. In Article 9, The above shutter is a deposition device capable of sliding movement in the first direction.
  11. In Article 1, The above shutter includes a blocking plate movable in the first direction and a rotating plate attached to the angle limiting plate, and When the above shutter operates in the above shielding mode, The above blocking plate shields the first opening, and The above-mentioned rotating plate is a deposition device that shields the above-mentioned blocking area.
  12. In Article 1, A deposition apparatus comprising a second opening that includes a second-1 opening overlapping with the open area and a second-2 opening that is spaced apart from the second-1 opening in a plane and overlaps with the blocking area.
  13. A chamber providing internal space; and A deposition apparatus comprising a deposition module disposed in the internal space and movable in a first direction, comprising a first deposition source including a first deposition material, a second deposition source including a second deposition material, a third deposition source including a third deposition material, a fourth deposition source including a fourth deposition material, an angle limiting plate having first to fourth openings defined that overlap with the first to fourth deposition sources respectively in a plane, and a shutter operating in a shielding mode that blocks the first opening and the second opening in a plane or an opening mode that opens the first opening and the second opening in a plane.
  14. In Article 13, The above shutter is provided in the form of a blocking plate movable in the first direction, and The above shutter is a deposition device capable of sliding movement in the first direction.
  15. A step of providing a deposition module comprising first to third deposition sources arranged sequentially along one direction, an angle limiting plate having first to third openings defined to overlap each of the first to third deposition sources on a plane, and a shutter capable of blocking a deposition process by the first deposition source and the second deposition source; A step of placing a target substrate on the deposition module; The deposition module forms a first mixed film comprising a first deposition material provided from the first deposition source and a second deposition material provided from the second deposition source on the back surface of the target substrate, and a second-1 mixed film comprising the second deposition material and a third deposition material provided from the third deposition source on the back surface of the first mixed film, and the deposition module moves along the opposite direction of the one direction; and A method for manufacturing an electronic device comprising the step of the shutter shielding a portion of the second opening and the first opening, the deposition module forming a second-2 mixed film on the back surface of the second-1 mixed film, the second deposition material provided from the second deposition source and the third deposition material provided from the third deposition source, and the deposition module moving along the one direction.
  16. In Article 15, Between the step of placing a target substrate on the deposition module and the step of moving the deposition module along the opposite direction of the one direction, A method for manufacturing an electronic device, further comprising the step of the shutter shielding a portion of the second opening and the first opening, the deposition module forming a second-2 mixed film on the back surface of the second-1 mixed film, the second deposition material provided from the second deposition source and the third deposition material provided from the third deposition source, and the deposition module moving along the one direction.
  17. In Article 15, The first deposition source includes a first nozzle facing the target substrate, and When the step of moving the deposition module along the opposite direction of the above one direction begins, A method for manufacturing an electronic device in which the first nozzle is positioned in one direction relative to the adjacent side of the target substrate.
  18. In Article 15, In cross-section, the width of the second opening is greater than the width of the first opening and the width of the third opening, and A method for manufacturing an electronic device in which the second discharge angle of the second deposition material passing through the second opening is greater than the first discharge angle of the first deposition material passing through the first opening and the third discharge angle of the third deposition material passing through the third opening.
  19. In Article 15, In the step where the deposition module moves along the opposite direction of the one direction, The regions where the first to third deposition materials pass through the first to third openings and are deposited on the back surface of the target substrate are each defined as the first to third deposition regions, and The second deposition region overlaps with the first deposition region and the third deposition region, and A method for manufacturing an electronic device in which the first deposition region is spaced apart from the third deposition region by a predetermined distance.
  20. In Article 15, In the step where the above deposition module moves along the above one direction, The second deposition region formed by the second deposition material passing through the second opening is, A method for manufacturing an electronic device in which the third deposition material overlaps with a third deposition region formed by passing through the third opening.

Description

Deposition apparatus and manufacturing method for electronic device using the same The present invention relates to a deposition apparatus and a method for manufacturing an electronic device using the same. Specifically, the invention relates to a deposition apparatus for forming a mixed film for manufacturing an electronic device and a method for manufacturing an electronic device using the deposition apparatus. Electronic devices such as smartphones, digital cameras, laptop computers, navigation systems, and smart televisions that provide video to users generate video and provide the generated video to the user through a display screen. Electronic devices can be manufactured through various processes. For example, electronic devices can be manufactured through deposition processes, etching processes, and cleaning processes on a substrate. In the deposition process on a substrate, a deposition source can be heated to form a deposition layer on the surface of the target substrate. FIG. 1 is a cross-sectional view of a deposition apparatus according to one embodiment of the present invention. FIG. 2 is a plan view of a deposition module according to one embodiment of the present invention. FIG. 3 is a block diagram of a method for manufacturing an electronic device according to one embodiment of the present invention. FIGS. 4 to 9 are drawings illustrating each step of a method for manufacturing an electronic device according to one embodiment of the present invention. Figure 10 is an enlarged view of the AA' area of Figure 9. FIG. 11 is a block diagram of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 12 is an enlarged cross-sectional view of a deposition pattern according to one embodiment of the present invention. FIGS. 13a and 13b are cross-sectional views of a deposition module according to one embodiment of the present invention. FIGS. 14a and 14b are cross-sectional views of a deposition module according to one embodiment of the present invention. FIGS. 15a and FIGS. 15b are cross-sectional views of a deposition module according to one embodiment of the present invention. FIG. 16 is an enlarged cross-sectional view of a deposition pattern according to one embodiment of the present invention. FIG. 17a is a perspective view of an electronic device manufactured by a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 17b is an exploded perspective view of an electronic device manufactured by a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 17c is a diagram illustrating an exemplary cross-section of a pixel included in an electronic device. FIG. 17d is a block diagram of an electronic device according to one embodiment of the present invention. FIG. 18 is a diagram for explaining a deposition process by the deposition apparatus shown in FIG. 1. The present invention is capable of various modifications and may take various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "combined" with another component, it means that it may be directly placed/connected/combined with the other component, or that a third component may be placed between them. Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the effective illustration of the technical content. "And/or" includes all one or more combinations that the associated components may define. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise. Additionally, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings. Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be unders