KR-20260065130-A - Functional adhesives with excellent heat resistance

Abstract

The present invention relates to a functional adhesive with excellent heat resistance that improves thermal conductivity while using a small amount of boron nitride nanoplate microparticles. The functional adhesive comprises an adhesive binder used for bonding, boron nitride plate microparticles that impart thermal conductivity to the adhesive, and a curing agent necessary for curing the adhesive binder. The functional adhesive comprises stone powder, a gelatin additive, and a natural pigment. The boron nitride plate microparticles are nano-level microparticles and are characterized by using plate-shaped particles to improve dispersibility and thermal conductivity.

Inventors

• 김천식

Assignees

• 주식회사 엠티지

Dates

Publication Date

20260508

Application Date

20241101

Claims (4)

1. A functional adhesive comprising an adhesive binder used for bonding, boron nitride plate microparticles that impart thermal conductivity to the adhesive, and a curing agent necessary for curing the adhesive binder, It contains stone powder, gelatin additives, and natural pigments, The above boron nitride plate microparticles are nano-level microparticles and are a functional adhesive with excellent heat resistance characterized by using plate-shaped particles to improve dispersibility and thermal conductivity.
2. In paragraph 1, A functional adhesive with excellent heat resistance, characterized in that the above stone powder is a powder of one or more of loess, marble, maifan stone, granite, jade stone, and germanium stone.
3. In paragraph 1, A functional adhesive with excellent heat resistance, characterized by being prepared by adding and dispersing the above-mentioned plate-shaped boron nitride nanoplate microparticles in an amount of 0.01 to 80% by volume based on the total adhesive.
4. In paragraph 1, A functional adhesive with excellent heat resistance, characterized by comprising 145 to 175 parts by weight of ionized water and 2.5 to 5 parts by weight of an emulsifier, based on 100 parts by weight of the stone powder.

Description

Functional adhesives with excellent heat resistance The present invention relates to a functional adhesive with excellent heat resistance, and more specifically, to a small This invention relates to a functional adhesive with excellent heat resistance that improves thermal conductivity while using a large amount of boron nitride nanoplate microparticles. Today, adhesives are used in a wide range of applications, from construction sites to electronic products. Their usage is increasing because they are more convenient and offer advantages in terms of weight reduction and environmental safety compared to assembly using bolts and nuts or joining using soldering. In addition to their primary purpose of joining for assembly, adhesives are sometimes utilized in electronic products to impart various functionalities. Electronic products inevitably generate heat during operation, requiring technology to dissipate this heat externally. With the current trend toward miniaturization of electronic products, adhesives are required to possess high thermal conductivity to effectively diffuse and remove the heat generated during operation. For instance, adhesives used to attach semiconductor chips during electronic manufacturing are desirable for having high thermal conductivity, leading to the development of adhesives incorporating boron nitride microparticles or metal alloys. When such thermal conductivity is required, interfacial characteristics that allow for positron movement are necessary. However, fillers consisting of inorganic or metal microparticles dispersed in organic polymers are generally recognized as having high interfacial resistance and hindering the smooth movement of electrons and positrons. Boron nitride fine particles, which have the advantages of electrical insulation and chemical stability, are used to increase the thermal conductivity of the adhesive resin. As the boron nitride fine particles become finer, the interfacial resistance of the resin increases. Since the thermal resistance of the resin tends to decrease as the amount added increases, about 78.5% by volume (88% by weight) of micrometer-sized boron nitride fine particles are added to secure the thermal conductivity required for electrical products. However, due to the excessive dosage of boron nitride fine particles of this magnitude, the content of the adhesive binder resin is reduced, resulting in uneven dispersion and an inability to perform the adhesive's inherent adhesive function, which becomes a factor in lowering adhesive performance. Therefore, silane compounds are sometimes used as binders to improve the interfacial resistance between fillers and organic polymers; while partial improvement is reported in this case, the performance of these mixtures as thermally conductive adhesives is evaluated as unsatisfactory. Figure 1 is a photograph showing the boron nitride nanoplate microparticles used in the present invention. The present invention will be described in detail below with reference to embodiments shown in the attached drawings, but the presented embodiments are exemplary for a clear understanding of the present invention and the present invention is not limited thereto. The technical configuration of the present invention according to the following preferred embodiments is described in detail as follows. Figure 1 is a photograph showing the boron nitride nanoplate microparticles used in the present invention. The present invention comprises a functional adhesive used for bonding electronic products, an adhesive binder that imparts adhesive strength, and a curing agent necessary for curing the adhesive binder. In the present invention, in addition to the dry natural functional adhesive composition comprising a gelatin additive and a natural pigment, it is also possible to prepare an aqueous type by mixing 145 to 175 parts by weight of ionized water and 2.5 to 5 parts by weight of an emulsifier based on 100 parts by weight of the stone powder. Here, the stone powder includes stone powder such as red clay, marble, maifan stone, granite, jade stone, or germanium stone, and by adding natural pigment components to impart a beautiful color, it is possible to maximize eco-friendly functionality while simultaneously possessing the unique gloss and high strength characteristics of stone powder. In the present invention, the adhesive binder described above may be a silicone-epoxy-vinyl resin as a matrix resin capable of effectively dispersing and bonding silica powder, silver fine particles, carbon fine particles, boron nitride fine particles, etc., which are commonly added as fillers in the manufacturing process of adhesives for electronic products, which are one type of composite material. The present invention uses a silicone-epoxy-vinyl resin as the matrix resin for an adhesive in the form of a composite material, thereby eliminating surface treatment or addition processes using expensive binders for the dispersion and bonding of