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KR-20260065140-A - METHOD OF DICING SUBSTRATE USING LASER BEAM DEFLECTING SYSTEM

KR20260065140AKR 20260065140 AKR20260065140 AKR 20260065140AKR-20260065140-A

Abstract

A substrate cutting method according to an embodiment of the present invention comprises the steps of: forming a protective film on a substrate including a substrate and a wiring layer; performing a laser grooving process to remove at least a portion of the wiring layer to expose the substrate; performing a dicing process to cut the exposed substrate; and removing the protective film, wherein the laser grooving process is performed by a laser beam deflection system.

Inventors

  • 설봉호
  • 박종범
  • 윤성진
  • 윤회정
  • 전진표

Assignees

  • 피에스케이홀딩스 (주)

Dates

Publication Date
20260508
Application Date
20241101

Claims (10)

  1. A step of forming a protective film on a substrate including a substrate and a wiring layer; A step of performing a laser grooving process to remove at least a portion of the wiring layer and expose the substrate; A step of cutting the exposed substrate by performing a dicing process; and The step of removing the above protective film is included, The above laser grooving process is a substrate cutting method performed by a laser beam deflection system.
  2. In Article 1, The above laser beam deflection system is, Laser emitter; An acousto-optic deflector that diffracts a beam emitted from the above laser emitter to form a deflected beam having multiple paths; and A substrate cutting method comprising a scanner that directs the deflection beam toward a stage on which the substrate is placed.
  3. In Article 2, The above laser beam deflection system further includes a control unit, and The above control unit controls the movement of at least one of the acousto-optic deflector, the scanner, or the stage, and The above laser grooving process is a substrate cutting method in which the deflection beam is irradiated at a specific location by the control unit.
  4. In Paragraph 3, The above control unit, based on the operating range, At a first reference value or lower, the scanner is controlled to control the position where the deflection beam is irradiated, and A substrate cutting method that controls the position where the deflection beam is irradiated by controlling the stage in the above range exceeding the first reference value and below the second reference value.
  5. In Paragraph 3, The above control unit The movement of the above-mentioned acousto-optic deflector is controlled to irradiate a deflected beam in the width direction of the scribe line area of the substrate, and A substrate cutting method that controls the movement of the scanner to irradiate the deflection beam in the longitudinal direction of the scribe line area.
  6. In Article 1, It further includes a trench process performed using a single beam in the edge region of the scribe line area of the substrate prior to the laser grooving process, and The above laser grooving process is a substrate cutting method performed in the central area of the above scribe line area after performing the above trench process.
  7. In Article 1, A method for cutting a substrate in which the laser wavelength of the above laser beam deflection system has a range of 100 nm to 1500 nm.
  8. In Article 1, The step of forming the above protective film is, Step of setting the center point of the above substrate; A step of cleaning the above substrate; A step of applying a protective material onto the substrate through a coating process; A step of heating and curing the above protective material; and A substrate cutting method comprising the step of cooling the protective material to form the protective film.
  9. In Article 1, A substrate cutting method in which the above protective film is configured so that the wiring layer is not exposed outside the scribe line area while the above laser grooving process and the above dicing process are performed.
  10. In Article 1, The above dicing process is A step of removing at least a portion of the exposed substrate by performing an isotropic etching process using the protective film as an etching mask; A step of performing a deposition process to form a protective film layer covering the protective film and the exposed substrate; and A substrate cutting method comprising the step of removing the protective film layer and the substrate in the thickness direction through an anisotropic etching process.

Description

Method of Dicing Substrate Using Laser Beam Deflecting System The present invention relates to a method for cutting a substrate using a laser beam deflection system. Recently, due to the trend toward higher performance in semiconductor chips, the integration density of semiconductor chips is increasing, and the difficulty of the process for forming semiconductor chips is increasing. For example, in the case of the substrate dicing process for separating individual chip dies from the substrate, the difficulty of the process is increasing as the thickness of the substrate decreases. Accordingly, various studies are being conducted to cut substrates using not only the diamond blade dicing process, but also lasers, plasma, or combinations thereof. FIG. 1 is a schematic flowchart illustrating a substrate cutting method according to exemplary embodiments. FIGS. 2a, FIGS. 3, FIGS. 4, and FIGS. 5 are cross-sectional views illustrating the step-by-step appearance of a substrate cutting method according to exemplary embodiments. FIG. 2b is a schematic flowchart illustrating a method for forming a protective film according to exemplary embodiments. FIG. 6 is a block diagram schematically illustrating the configuration of a laser beam deflection system according to exemplary embodiments. FIGS. 7 to 9 are drawings for explaining the operating principles and effects of a laser beam deflection system according to exemplary embodiments. FIG. 10 is a drawing for illustrating a substrate cutting method according to exemplary embodiments. Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the contents described in the attached drawings. However, the present invention is not limited or restricted by exemplary embodiments. Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall be used in a meaning that is commonly understood by those skilled in the art to which this disclosure belongs, but this may vary depending on the intent of those skilled in the art, case law, the emergence of new technology, etc. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. In certain cases, terms have been selected at the applicant's discretion, and in such cases, their meanings will be described in detail in the relevant explanatory sections. Accordingly, terms used in this disclosure should be defined not merely by their names, but based on their meanings and the content throughout this disclosure. Throughout this specification, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Furthermore, the singular form used in this specification includes the plural form unless specifically stated otherwise. Additionally, the expression "at least one of a, b, and/or c" as used throughout this specification may encompass 'a alone', 'b alone', 'c alone', 'a and b', 'a and c', 'b and c', or 'a, b, and c all'. Meanwhile, terms such as "first and/or second" used in this specification may be used to describe various components, but they are used solely for the purpose of distinguishing one component from another and are not intended to limit the scope to the components referred to by such terms. For example, without departing from the scope of the present invention, the first component may be named the second component, and the second component may also be named the first component. Additionally, terms such as “…part,” “…module,” etc., as described in this specification refer to a unit that processes at least one function or operation, which may be implemented in hardware or software, or a combination of hardware and software. Furthermore, embodiments of this disclosure may be represented in this specification by functional block configurations and various processing steps. These functional blocks may be implemented by various numbers of hardware and/or software configurations that execute specific functions. For example, embodiments of this disclosure may employ integrated circuit configurations such as memory, processing, logic, look-up tables, etc., which can execute various functions under the control of one or more microprocessors or other control devices. Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In describing the embodiments, technical details that are well known in the art to which the present invention pertains and are not directly related to the present invention will be omitted. This is to ensure that the essence of the present invention is conveyed more clearly without obscuring it by omitting unnecessary explanations. For the same reason, some components in the accompanying drawings may be exagge