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KR-20260065162-A - THERMALLY CONDUCTIVE SILICONE-BASED COMPOSITION AND CURED PRODUCT THEREOF

KR20260065162AKR 20260065162 AKR20260065162 AKR 20260065162AKR-20260065162-A

Abstract

A thermally conductive silicon-based composition according to one embodiment of the present invention comprises: 1) a first polysiloxane comprising at least one alkenyl group; 2) a second polysiloxane comprising at least one hydrogen group; 3) a hydrosilylation catalyst; and 4) a filler, wherein the filler comprises a first alumina having an average particle size of 0.1 μm or more and less than 1 μm and a specific surface area of 6 m² /g to 8 m² /g, and the content of the first alumina is 5% to 25% by weight based on the total weight of the filler.

Inventors

  • 함송이

Assignees

  • 모멘티브 퍼포먼스 머티리얼즈 인크.

Dates

Publication Date
20260508
Application Date
20241101

Claims (12)

  1. 1) A first polysiloxane comprising at least one alkenyl group; 2) A second polysiloxane comprising at least one hydrogen group; 3) Hydrosilylation catalyst; and 4) Includes filler, The above filler comprises a first alumina having an average particle size of 0.1㎛ or more and less than 1㎛ and a specific surface area of 6 m² /g to 8 m² /g, and A thermally conductive silicon-based composition having a content of 5% to 25% by weight of the first alumina based on the total weight of the above filler.
  2. A thermally conductive silicone-based composition according to claim 1, wherein the first polysiloxane is represented by the following chemical formula 1: [Chemical Formula 1] (R 1a R 2a R 3a SiO 1/2 ) aa (R 4a R 5a SiO 2/2 ) ba (R 6a SiO 3/2 ) ca (SiO 4/2 ) da In the above chemical formula 1, At least one of R 1a to R 6a is an alkenyl group, and The remainders are identical or different from one another, each independently an alkyl group, an alkoxy group, an aryl group, or a silanol group, which are substituted or unsubstituted with a halogen, and aa + ba + ca + da = 1, 0 ≤ aa < 1, 0 ≤ ba < 1, 0 ≤ ca < 1, 0 ≤ da < 1 is satisfied.
  3. A thermally conductive silicone-based composition according to claim 1, wherein the second polysiloxane is represented by the following chemical formula 2: [Chemical Formula 2] (R 1b R 2b R 3b SiO 1/2 ) ab (R 4b R 5b SiO 2/2 ) bb (R 6b SiO 3/2 ) cb (SiO 4/2 ) db In the above chemical formula 2, At least one of R 1b to R 6b is a hydrogen group, and The remainders are identical or different from one another, each independently an alkyl group, an alkoxy group, an aryl group, or a silanol group, which are substituted or unsubstituted with a halogen, and ab + bb + cb + db = 1, 0 ≤ ab < 1, 0 ≤ bb < 1, 0 ≤ cb < 1, 0 ≤ db < 1 is satisfied.
  4. A thermally conductive silicon-based composition according to claim 1, wherein the hydrosilylation catalyst comprises one or more of a platinum-based catalyst, a rhodium-based catalyst, and a palladium-based catalyst.
  5. A thermally conductive silicon-based composition according to claim 1, wherein the filler further comprises one or more of a second filler having an average particle size of 1 μm or more and less than 10 μm, and a third filler having an average particle size of 10 μm or more and less than 100 μm.
  6. A thermally conductive silicon-based composition according to claim 1, wherein the filler further comprises a second alumina having an average particle size of 1 μm or more and less than 10 μm, and a third alumina having an average particle size of 10 μm or more and less than 100 μm.
  7. In claim 1, based on the total weight of the thermally conductive silicon-based composition, A thermally conductive silicone-based composition having a content of the first polysiloxane of 0.1 wt% to 10 wt%, a content of the second polysiloxane of 0.1 wt% to 10 wt%, a content of the hydrosilylation catalyst of 0.0001 wt% to 0.1 wt%, and a content of the filler of 80 wt% to 98 wt%.
  8. A thermally conductive silicone-based composition according to claim 1, wherein the silicone-based composition further comprises one or more of a dispersant, a retardant, and an adhesion promoter.
  9. A thermally conductive silicon-based composition according to claim 8, wherein the dispersant is represented by the following chemical formula 3: [Chemical Formula 3] In the above chemical formula 3, R1 is a group containing an alkoxysiloxy group having 1 to 4 carbon atoms, and R2 is a siloxane represented by the following chemical formula 3-1, or a monovalent hydrocarbon group having 6 to 18 carbon atoms, and X is each independently a divalent hydrocarbon group having 2 to 10 carbon atoms, and R3 is each independently hydrogen or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and a and b are each independently integers greater than or equal to 1, c is an integer greater than or equal to 0, and (a+b+c) is an integer greater than or equal to 4, and [Chemical Formula 3-1] In the above chemical formula 3-1, R4 is a monovalent hydrocarbon group having 1 to 12 carbon atoms, and Y is a group containing a methyl group, a vinyl group, or an alkoxysiloxy group having 1 to 4 carbon atoms, and d is an integer from 2 to 500.
  10. A thermally conductive silicone-based composition according to claim 8, wherein the retardant comprises one or more of alkyl alcohols, enyne compounds, methylalkenylsiloxane oligomers, alkyloxysilanes, and triaryl isocyanurate-based compounds.
  11. A cured product obtained by curing a thermally conductive silicon-based composition of any one of claims 1 to 10.
  12. An electronic device comprising the cured material of claim 11.

Description

Thermally conductive silicone-based composition and cured product thereof The present invention relates to a thermally conductive silicon-based composition and a cured product thereof. In electronic components such as power transistors, ICs (Integrated Circuits), and CPUs (Central Processing Units), thermally conductive adhesives are used to prevent heat accumulation in heating elements. Silicone rubber is widely used in the above-mentioned thermally conductive adhesives. However, since silicone alone cannot increase thermal conductivity, thermally conductive fillers are used in combination to improve the thermal conductivity of silicone rubber. As such thermally conductive fillers, materials with higher thermal conductivity than silicone, such as alumina, boron nitride, aluminum nitride, and magnesium oxide, are known. As recent electronic components increase in power output, they generate more heat, necessitating heat dissipation materials with higher thermal conductivity. To obtain silicon compositions with high thermal conductivity to meet this demand, it is necessary to increase the filling of thermally conductive fillers. However, there are limitations to such filling capacity due to factors such as reduced fluidity. FIG. 1 is a schematic diagram showing a semiconductor package to which a thermally conductive silicon-based composition according to one embodiment of the present invention is applied. The present application will be described in detail below. Thermally conductive materials consist of thermally conductive fillers for high thermal conductivity and silicone compositions for mechanical properties. Basically, to achieve high thermal conductivity, the content of thermally conductive fillers is increased or angular-shaped fillers are used; however, this leads to higher rheological properties, particularly viscosity, which adversely affects the dispersibility of the product. Since this significantly impacts workability during product dispensing and can cause reliability issues, there is a need to develop well-dispersed materials with a viscosity level that allows for workability. The present invention aims to solve these problems by providing a thermally conductive silicon-based composition with improved dispersibility while maintaining high thermal conductivity and conventional mechanical properties. In the present invention, it was discovered that when a thermally conductive filler is included in a combination of thermally conductive silicon-based compositions, the dispersibility of the silicon-based composition is improved when a filler having a specific specific surface area is included. A thermally conductive silicon-based composition according to one embodiment of the present invention comprises: 1) a first polysiloxane comprising at least one alkenyl group; 2) a second polysiloxane comprising at least one hydrogen group; 3) a hydrosilylation catalyst; and 4) a filler, wherein the filler comprises a first alumina having an average particle size of 0.1 μm or more and less than 1 μm and a specific surface area of 6 m² /g to 8 m² /g, and the content of the first alumina is 5% to 25% by weight based on the total weight of the filler. In one embodiment of the present invention, the first polysiloxane may be represented by the following chemical formula 1. [Chemical Formula 1] (R 1a R 2a R 3a SiO 1/2 ) aa (R 4a R 5a SiO 2/2 ) ba (R 6a SiO 3/2 ) ca (SiO 4/2 ) da In the above chemical formula 1, At least one of R 1a to R 6a is an alkenyl group, and The remainders are identical or different from one another, each independently an alkyl group, an alkoxy group, an aryl group, or a silanol group, which are substituted or unsubstituted with a halogen, and aa + ba + ca + da = 1, 0 ≤ aa < 1, 0 ≤ ba < 1, 0 ≤ ca < 1, 0 ≤ da < 1 is satisfied. The above-mentioned first polysiloxane may include one or more types or two or more types. In one embodiment of the present invention, the second polysiloxane may be represented by the following chemical formula 2. [Chemical Formula 2] (R 1b R 2b R 3b SiO 1/2 ) ab (R 4b R 5b SiO 2/2 ) bb (R 6b SiO 3/2 ) cb (SiO 4/2 ) db In the above chemical formula 2, At least one of R 1b to R 6b is a hydrogen group, and The remainders are identical or different from one another, each independently an alkyl group, an alkoxy group, an aryl group, or a silanol group, which are substituted or unsubstituted with a halogen, and ab + bb + cb + db = 1, 0 ≤ ab < 1, 0 ≤ bb < 1, 0 ≤ cb < 1, 0 ≤ db < 1 is satisfied. The above second polysiloxane may include one or more types or two or more types. Silicone-based resins having a siloxane structure (Si-O-Si) are classified into monofunctional silicone units (M units), difunctional silicone units (D units), trifunctional silicone units (T units), and tetrafunctional silicone units (Q units) according to their constituent units, and these units are used individually or in a copolymerized state. Structures composed solely of monofunctional and difunct