KR-20260065199-A - APPARATUS AND METHOD FOR PREDICTING THE LIFESPAN OF A SEMICONDUCTOR TEST SOCKET PIN

Abstract

One embodiment of the present invention provides a lifespan prediction device for predicting the lifespan of a semiconductor test socket pin, comprising a memory in which a pre-learned lifespan prediction model is stored and a processor, wherein the processor comprises a data collection unit for collecting at least one test data obtained by testing the semiconductor test socket pin, a data processing unit for graphing the collected test data and extracting valid data among the graphed test data, and a lifespan prediction unit for predicting the lifespan of the semiconductor test socket pin using the lifespan prediction model based on the extracted valid data.

Inventors

• 김효영
• 김기현
• 이주훈
• 정수진

Assignees

• 한국공학대학교산학협력단

Dates

Publication Date

20260508

Application Date

20241101

Claims (15)

1. In a life prediction device for predicting the lifespan of a semiconductor test socket pin, A memory storing a pre-trained lifespan prediction model, and Includes a processor, The above processor is, A data collection unit that collects at least one test data obtained by testing the above-mentioned semiconductor test socket pin, and A data processing unit that graphs collected test data and extracts valid data from the graphed test data, and A life prediction device characterized by including a life prediction unit that predicts the lifespan of the semiconductor test socket pin using the life prediction model based on extracted valid data.
2. In paragraph 1, The above test data is, A life prediction device characterized by including at least one of contact force data, resistance data, temperature data, and image data.
3. In paragraph 1, The above semiconductor test socket is, A life prediction device characterized by being a hybrid semiconductor test socket having a pogo pin structure and a MEMS structure.
4. In paragraph 1, The above data processing unit is, A life prediction device characterized by classifying the test data into clustered data and outlier data by performing cluster analysis on the graphed test data, and determining the classified clustered data as valid data.
5. In paragraph 4, The above data processing unit is, A life prediction device characterized by performing density-based cluster analysis (DBSCAN) on the above-mentioned graphed test data.
6. In paragraph 5, The above data processing unit is, A life prediction device characterized by extracting training data by filtering the above-determined valid data.
7. In paragraph 6, The above data processing unit is, A life prediction device characterized by graphing the above valid data, setting a filtering baseline, and extracting the above training data based on the filtering baseline.
8. In paragraph 1, The above-mentioned life prediction unit is, A life prediction device characterized by calculating the lifespan of the semiconductor test socket pin based on output data output from the life prediction model.
9. In paragraph 8, The above-mentioned life prediction unit is, A life prediction device characterized by generating a prediction cycle based on the above output data, and calculating the life of the semiconductor test socket pin by analyzing the frequency or pattern in which abnormal values of the above output data are detected based on the generated prediction cycle.
10. In paragraph 1, The above lifespan prediction model is, A life prediction device characterized by including at least one neural network among Deep Neural Networks (DNN), Convolutional Neural Networks (CNN), Recurrent Neural Networks (RNN), and Long Short-Term Memory (LSTM).
11. In a life prediction method performed by a life prediction device for predicting the lifespan of a semiconductor test socket pin, The step of testing the semiconductor test socket pins to collect at least one test data, and A step of graphing collected test data and extracting valid data from the graphed test data, and A lifespan prediction method characterized by including the step of predicting the lifespan of the semiconductor test socket pin using a lifespan prediction model based on extracted valid data.
12. In Paragraph 11, The step of extracting the above valid data is, A lifespan prediction method characterized by classifying the test data into clustered data and outlier data by performing cluster analysis on the graphed test data, and determining the classified clustered data as valid data.
13. In Paragraph 12, The step of extracting the above valid data is, A life prediction method characterized by classifying the test data into clustered data and outlier data by performing density-based clustering analysis (DBSCAN) on the graphed test data.
14. In Paragraph 13, The step of graphing the above extracted valid data, and The step of establishing filtering baselines, and A lifespan prediction method characterized by extracting training data by filtering the graphed valid data based on the filtering baseline.
15. In Paragraph 11, The step of predicting the lifespan of the above semiconductor test socket pins is, A step of generating a prediction cycle based on output data from the above-mentioned life prediction model, and A life prediction device characterized by including a step of calculating the life of the semiconductor test socket pin by analyzing the frequency or pattern in which abnormal values of the output data are detected based on the generated prediction cycle.

Description

Apparatus and Method for Predicting the Lifespan of a Semiconductor Test Socket Pin The present invention relates to a lifespan prediction device and method, and more specifically, to a lifespan prediction device and method for predicting the lifespan of a semiconductor test socket pin. In the semiconductor manufacturing process, test sockets play a crucial role in verifying whether a semiconductor chip is functioning properly. Conventional semiconductor test sockets press the semiconductor chip with a constant pressure to allow current to flow, thereby determining whether the chip is normal or abnormal. However, damage to or malfunction of the test socket itself can cause a normal semiconductor chip to be judged as defective, which leads to reduced productivity. The pins of semiconductor test sockets are designed with built-in springs to apply a constant force to the chip. However, if the springs undergo plastic deformation or break over time, the accuracy of the force applied to the chip may decrease. Additionally, the current flowing through the socket is related to the socket's temperature rise; prolonged use can cause the socket to be damaged by high temperatures, leading to sudden changes in resistance or current deviations from the normal range. Existing technologies have relied on passive monitoring using socket springs and current-sensing sensors to address these issues; however, this approach has limitations in predicting socket health or detecting abnormalities in advance before a failure occurs. Accordingly, there is a need for technology capable of evaluating socket performance in real time, predicting failures before they occur, and taking appropriate measures. FIG. 1 is a block diagram illustrating a life prediction device according to one embodiment of the present invention. FIG. 2 is a block diagram schematically illustrating the configuration of a processor according to one embodiment of the present invention. FIG. 3 is a flowchart illustrating a lifespan prediction method according to one embodiment of the present invention over time. FIG. 4 is a schematic diagram illustrating a testbed according to one embodiment of the present invention. FIG. 5 is a reference diagram illustrating a method for a data processing unit to graph test data and extract valid data according to an embodiment of the present invention. FIG. 6 is a schematic diagram illustrating valid data graphed according to one embodiment of the present invention. FIG. 7 is a graph illustrating the prediction cycle generated by the life prediction unit according to one embodiment of the present invention. The present invention will be described below with reference to the attached drawings. However, the present invention may be implemented in various different forms and is therefore not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification have been given similar reference numerals. Throughout the specification, when it is stated that a part is "connected (connected, in contact, combined)" with another part, this includes not only cases where they are "directly connected," but also cases where they are "indirectly connected" with other members interposed between them. Furthermore, when it is stated that a part "includes" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. The terms used herein are merely for describing specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Embodiments of the present invention will be described in detail below with reference to the attached drawings. Hereinafter, a lifespan prediction device and a lifespan prediction method for predicting the lifespan of a semiconductor test socket pin will be described. The semiconductor test socket for which the lifespan prediction device and method of the present invention predicts lifespan may be a hybrid semiconductor test socket having both a Pogo Pin structure and a MEMS (Micro-Electro-Mechanical Systems) structure. A hybrid semiconductor test socket may consist of a contact portion that communicates by contacting the semiconductor, and an elastic portion equipped with a spring. The end of the contact portion is typically formed in a crown shape to reduce contact resistance with the